DLA DSCC-VID-V62 03610 REV B-2012 MICROCIRCUIT DIGITAL CMOS DIGITAL SIGNAL PROCESSOR MONOLITHIC SILICON.pdf
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1、 REVISIONSLTR DESCRIPTION DATE (YY-MM-DD) APPROVEDA Correct lead finish on last page. Update boilerplate. - CFS 05-11-01 Thomas M. Hess B Update boilerplate paragraphs to current requirements. - PHN 12-03-22 Thomas M. Hess CURRENT DESIGN ACTIVITY CAGE CODE 16236 HAS CHANGED NAMES TO: DLA LAND AND MA
2、RITIME COLUMBUS, OHIO 43218-3990 Prepared in accordance with ASME Y14.24 Vendor item drawing REV B B B B B B B B B PAGE 40 41 42 43 44 45 46 47 48 REV B B B B B B B B B B B B B B B B B B B B B B PAGE 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 REV STATUS OF PAGES REV B B B B B
3、B B B B B B B B B B B B PAGE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 PMIC N/A PREPARED BY Thanh V. Nguyen DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43218-3990 Original date of drawing CHECKED BY Thanh V. Nguyen TITLE MICROCIRCUIT, DIGITAL, CMOS, DIGITAL SIGNAL PROCESSOR, MONOLITHIC SILICON YY
4、-MM-DD 02-12-18 APPROVED BY Thomas M. Hess SIZE A CODE IDENT. NO. 16236 DWG NO. V62/03610 REV B PAGE 1 OF 51 AMSC N/A 5962-V040-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16
5、236 DWG NO. V62/03610 REV B PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance digital signal processor microcircuit, with an operating temperature range of -40C to +100C for device type 01 and -55C to +125C for device type 02 as shown in 1.2.1 below. 1.
6、2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/03610 - 01 X E Drawing Device type Case outline Lead finish nu
7、mber (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 320VC33-EP Digital signal processor 02 320VC33-EP Digital signal processor 1.2.2 Case outline(s). The case outlines are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style
8、 X 144 MS-026 Plastic quad flatpack Y 144 Ceramic ball grid array 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer: Finish designator Material A Hot solder dip B Tin-lead plateC Gold plateD PalladiumE Gold flash palladium Z O
9、ther Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/03610 REV B PAGE 3 1.3 Absolute maximum ratings. 1/ Supply voltage range (DVDD) -0.3 V to +4.0 V 2/ Supply vol
10、tage range (CVDD) -0.3 V to +2.4 V 2/ Input voltage range (VI). -1.0 V to +4.6 V 3/ Output voltage range (VO) . -0.3 V to +4.6 V Continuous power dissipation (worst case) (PD) . 500 mW 4/ Storage temperature range (TSTG) -55C to +150C 5/ Case operating temperature range (TC): Device type 01 . -40C t
11、o +100C Device type 02 . -55C to +125C 1.4 Recommended operating conditions. 2/ 6/ 7/ 8/ Supply voltage range for the core CPU (CVDD) . 1.71 V to 1.89 V 9/ Supply voltage range for the I/O pins (DVDD) 3.0 V to 3.6 V 10/ Supply ground (VSS) 0.0 V High level input voltage range (VIH) . 0.7 x DVDDto DV
12、DD+ 0.3 V 3/ Low level input voltage range (VIL) -0.3 V to 0.3 x DVDD3/ Maximum high level output current (IOH) . 4.0 mA Maximum low level output current (IOL) . 4.0 mA Case operating temperature range (TC): Device type 01 . -40C to +100C Device type 02 . -55C to +125C Maximum capacitive load per ou
13、tput pin (CL) 30 pF 1/ Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
14、implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2/ All voltage values are with respect to VSS. 3/ Absolute dc input level should not exceed the DVDDor VSSsupply rails by more than 0.3 V. An instantaneous low current pulse of 2 ns, 10 mA, and
15、 1 V amplitude is permissable. 4/ Actual operating power is much lower. This value was obtained under specially produced worst-case test conditions for the device, which are not sustained during normal device operation. These conditions consist of continuous parallel writes of a checkerboard pattern
16、 to the external data and address buses at the maximum possible rate with a capacitive load of 30 pF. See normal (IDD) current specification in table I herein. 5/ Long term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of overall d
17、evice life. 6/ Use of this product beyond the manufacturers design rules or stated parameters is done at the users risk. The manufacturer and/or distributor maintain no responsibility or liability for product used beyond the stated limits. 7/ All inputs and I/O pins are configured as inputs. 8/ All
18、inputs and I/O pins use a Schmidt hysteresis inputs except SHZ and D0 D31. Hysteresis is approximately 10% of DVDDand is centered at 0.5 x DVDD. 9/ CVDDshould not exceed DVDDby more than 0.7 V. (Use a Schottky clamp diode between these supplies.) 10/ DVDDshould not exceed CVDDby more than 2.5 V. Pro
19、vided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/03610 REV B PAGE 4 2. APPLICABLE DOCUMENTS THE INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS (IEEE) IEEE Standard
20、1149.1 - IEEE Standard Test Access Port and Boundary Scan Architecture. (Copies of these documents are available online at http:/www.ieee.org or from the IEEE Service Center, 445 Hoes Lane, P.O. Box 1331, Piscataway, NJ 088551331. JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JEP95 Registered and
21、 Standard Outlines for Semiconductor Devices (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10th Street, Suite 240S, Arlington, VA 22201.) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked w
22、ith the manufacturers part number as shown in 6.4 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applicable) ab
23、ove. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified here
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