DLA DSCC-VID-V62 03609 REV B-2012 MICROCIRCUIT DIGITAL-LINEAR CMOS 12- BIT ANALOG-TO-DIGITAL CONVERTER MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Correct lead finish on last page. Update boilerplate. - CFS 05-11-01 Thomas M. Hess B Update boilerplate paragraphs to current requirements. - PHN 12-06-04 Thomas M. Hess CURRENT DESIGN ACTIVITY CAGE CODE 16236 HAS CHANGED NAMES TO: DLA LAND AND MARITIME CO
2、LUMBUS, OHIO 43218-3990 Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV B B B B B B B B B B B PAGE 18 19 20 21 22 23 24 25 26 27 28 REV STATUS OF PAGES REV B B B B B B B B B B B B B B B B B PAGE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 PMIC N/A PREPARED BY RICK OFFICER DEFE
3、NSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43218-3990 Original date of drawing CHECKED BY TOM HESS TITLE MICROCIRCUIT, DIGITAL-LINEAR, CMOS, 12-BIT, ANALOG-TO-DIGITAL CONVERTER, MONOLITHIC SILICON 02-12-12 APPROVED BY RAYMOND MONNIN SIZE A CODE IDENT. NO. 16236 DWG NO. V62/03609 REV B PAGE 1 OF 28 A
4、MSC N/A 5962-V060-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/03609 REV B PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a hi
5、gh performance linear-digital microcircuit, with an operating temperature range of -55C to +125C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item
6、on the engineering documentation: V62/03609 - 01 X E Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 THS1206-EP CMOS, 12-bit, 6 MSPS, analog-to-digital converter 1.2.2 Case outline(s). The case outl
7、ines are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 32 MO-153 Plastic thin shrink small outline package with gull wing leads 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer: Finish design
8、ator Material A Hot solder dip B Tin-lead plate C Gold plate D Palladium E Gold flash palladium Z Other Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/03609 REV B
9、 PAGE 3 1.3 Absolute maximum ratings. 1/ Supply voltage range: DGND to DVDD. -0.3 V to 6.5 V BGND to BVDD. -0.3 V to 6.5 V AGND to AVDD. -0.3 V to 6.5 V Analog input voltage range AGND 0.3 V to AVDD+ 1.5 V Reference input voltage . -0.3 V + AGND to AVDD+ 0.3 V Digital input voltage range -0.3 V to B
10、VDD/ DVDD+ 0.3 V Power dissipation (PD) (TA 25C) 1453 mW 2/ Operating virtual junction temperature range (TJ) -55C to +150C Storage temperature range -65C to +150C Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds . 260C 1.4 Recommended operating conditions. 3/ Power supply section Supply
11、 voltage: AVDD. 4.75 V to 5.25 V DVDD. 3 V to 5.25 V BVDD. 3 V to 5.25 V Analog and reference inputs section Analog input voltage in single-ended configuration VREFMto VREFPCommon-mode input voltage VCMin differential configuration 1 V to 4 V External reference voltage, VREFP. AVDD 1.2 V maximum Ext
12、ernal reference voltage, VREFM. 1.4 V minimum Digital inputs section High-level input voltage (VIH): With BVDD= 3.3 V 2 V minimum With BVDD= 5.25 V 2.6 V minimum Low-level input voltage (VIL) With BVDD= 3.3 V 0.6 V maximum With BVDD= 5.25 V 0.6 V maximum Input CONV_CLK frequency, (with DVDD= 3 V to
13、5.25 V) 0.1 MHz to 6 MHz CONV_CLK pulse duration, clock high, tW(CONV_CLKH): With DVDD= 3 V to 5.25 V . 80 ns to 5000 ns CONV_CLK pulse duration, clock low, tW(CONV_CLKL): With DVDD= 3 V to 5.25 V . 80 ns to 5000 ns Ambient operating temperature (TA) . -55C to +125C 1/ Stresses beyond those listed u
14、nder “absolute maximum rating” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “ recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditio
15、ns for extended periods may affect device reliability. 2/ The derating factor above TA= +25C is 11.62 mW/C. 3/ Use of this product beyond the manufacturers design rules or stated parameters is done at the users risk. The manufacturer and/or distributor maintain no responsibility or liability for pro
16、duct used beyond the stated limits. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/03609 REV B PAGE 4 2. APPLICABLE DOCUMENTS JEDEC SOLID STATE TECHNOLOGY ASSOCIA
17、TION (JEDEC) JEP95 Registered and Standard Outlines for Semiconductor Devices (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10th Street, Suite 240S, Arlington, VA 22201.) 3. REQUIREMENTS 3.1 Marking. Parts shall be
18、 permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with
19、 items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical
20、 dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2. 3.5.3 Block diagram. The block diagram shall be as shown in figure 3. 3.5.4 Timing wave
21、forms. The timing waveforms shall be as shown in figure 4. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/03609 REV B PAGE 5 TABLE I. Electrical performance chara
22、cteristics. 1/ Test Symbol Conditions -55C TA +125C Limits Unit Min Max Digital input section High-level input current IIHDVDD= digital inputs -50 50 A Low-level input current IILDigital input = 0 V -50 50 A Input capacitance CIN5 TYP pF High-level output voltage VOHIOH= -50 A, BVDD= 3.3 V BVDD 0.5
23、V IOH= -50 A, BVDD= 5 V BVDD 0.5 Low-level output voltage VOLIOL= 50 A, BVDD= 3.3 V 0.4 V IOL= 50 A, BVDD= 5 V 0.4 High-impedance-state output current IOZCS1 = DGND, CS0 = DVDD-10 10 A Output capacitance COUT5 TYP pF Load capacitance at databus D0 D11 CL30 pF Resolution RES 12 Bits Integral nonlinea
24、rity INL 1.8 LSB Differential nonlinearity DNL 1 LSB Offset error 2/ OE After calibration in differential mode -20 20 LSB After calibration in single-ended mode 20 TYP Gain error 2/ GE -20 20 LSB Analog input section Input capacitance CIN15 TYP Input leakage current IINLVAIN= VREFMto VREFP10 A Inter
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