DLA SMD-5962-85084 REV C-2006 MICROCIRCUIT DIGITAL LOW-POWER SCHOTTKY TTL DECODERS DRIVERS MONOLITHIC SILICON《硅单片解码器 驱动器 TTL肖脱基高级小功率数字微型电路》.pdf

《DLA SMD-5962-85084 REV C-2006 MICROCIRCUIT DIGITAL LOW-POWER SCHOTTKY TTL DECODERS DRIVERS MONOLITHIC SILICON《硅单片解码器 驱动器 TTL肖脱基高级小功率数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-85084 REV C-2006 MICROCIRCUIT DIGITAL LOW-POWER SCHOTTKY TTL DECODERS DRIVERS MONOLITHIC SILICON《硅单片解码器 驱动器 TTL肖脱基高级小功率数字微型电路》.pdf（12页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update to reflect latest changes in format and requirements. Editorial changes throughout. -les 01-12-05 Raymond Monnin B Change 3.5 marking paragraph to remove “5962”. Update boilerplate to MIL-PRF-38535 requirements. - CFS 05-08-16 Thomas M. He

2、ss C Add device class V. Editorial changes throughout. - gap 06-11-02 Raymond Monnin Current CAGE code is 67268 The original first sheet of this drawing has been replaced. REV SHET REV SHET REV STATUS REV C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY David W. Queenan

3、DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Nelson A. Hauck MICROCIRCUIT, DIGITAL, LOW-POWER SCHOTTKY, TTL, DECODERS/DRIVERS, AND AGENCIES OF TH

4、E DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 85-09-28 MONOLITHIC SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 14933 85084 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E023-07 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DR

5、AWING SIZE A 85084 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A c

6、hoice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device classes M and Q: 85084

7、01 E X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)For device class V: 5962 - 85084 01 V E X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3)

8、 / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropri

9、ate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54LS145 BCD-to-decimal decoder/driver 1.2.3 Device class designator. The device class designator is a single le

10、tter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class Device requirements docume

11、ntation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 Provided by IHSNot for ResaleNo reproduction or networking permitted without lic

12、ense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85084 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminal

13、s Package style E GDIP1-T16 or GDIP2-T16 16 Dual-in-line F GDFP2-F16 or GDFP3-F16 16 Flat 2 CQCC1-N20 20 Square chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1

14、/ Supply voltage . -0.5 V dc to +7.0 V dc Input voltage range . -1.5 V dc at -18 mA to +7.0 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) per device 71.5 mW Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) : Case E and F . See MIL

15、-STD-1835 Case 2 . 80C/W Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) +4.5 V dc minimum to +5.5 V dc maximum Minimum high level input voltage (VIH) . 2.0 V dc Maximum low level input voltage (VIL) . 0.7 V dc Case operating temperature range (TC) -5

16、5C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation

17、or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENS

18、E HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil;quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Buil

19、ding 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exem

20、ption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,

21、-STANDARD MICROCIRCUIT DRAWING SIZE A 85084 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as spec

22、ified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN

23、 class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case out

24、lines. The case outlines shall be in accordance with 1.2.4. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.3 Elec

25、trical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test

26、requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For class V only

27、 where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with

28、MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as requi

29、red in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance s

30、hall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for d

31、evice classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-3

32、8535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that aff

33、ects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of t

34、he reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 11 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICR

35、OCIRCUIT DRAWING SIZE A 85084 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C Group A subgroups Device type Limits Unit unless otherwise specified Min Max Off

36、-state output voltage VO(off)1, 2, 3 All 15 V On-state output voltage VO(on)VCC= 4.5 V, IOLH= 12 mA, VIL = 0.7 V, VIN= 2.0 V 1, 2, 3 All 0.4 V Input clamp voltage VI CVCC= 4.5 V, IIH= -18 mA, TC= +25C 1, 2, 3 All -1.5 V Low level input current IILVCC= 5.5 V, VIN= 0.4 V 1, 2, 3 All -0.4 mA High level

37、 input current IIH1 VCC= 5.5 V, VIN= 2.7 V 1, 2, 3 All 20 A IIH2 VCC= 5.5 V, VIN= 7.0 V 1, 2, 3 All 100 A Off-state output current IO(off)VCC= 4.5 V, VIH= 2 V, VOH= 15 V, VIL= 0.7 V 1, 2, 3 All 250 A Supply current ICCVCC= 5.5 V, All inputs grounded, All outputs open 1, 2, 3 All 13 mA 9 All 50 Propa

38、gation delay time, low to high level output tPLH 10, 11 All 70 ns 9 All 50 Propagation delay time, high to low level output tPHL VCC= 5.0 V, RL= 665 5%, CL= 50 pF 10% 10, 11 All 70 ns Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRC

39、UIT DRAWING SIZE A 85084 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 Device types 01 01 Case outlines E, F 2 Terminal number Terminal symbols 1 Y0NC 2 Y1Y0 3 Y2Y1 4 Y3Y2 5 Y4Y3 6 Y5NC 7 Y6Y4 8 GND Y5 9 Y7Y6 10 Y8GND11 Y9 NC 12 D Y7 13 CY814

40、 BY915 AD 16 VCCNC 17 C 18 B19 A 20 VCC FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85084 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC

41、FORM 2234 APR 97 INPUTS OUTPUTS No. D C B A 0 1 2 3 4 5 6 7 8 9 0 L L L L L H H H H H H H H H 1 L L L H H L H H H H H H H H 2 L L H L H H L H H H H H H H 3 L L H H H H H L H H H H H H 4 L H L L H H H H L H H H H H 5 L H L H H H H H H L H H H H 6 L H H L H H H H H H L H H H 7 L H H H H H H H H H H L

42、H H 8 H L L L H H H H H H H H L H 9 H L L H H H H H H H H H H L H L H L H H H H H H H H H H H L H H H H H H H H H H H H H H L L H H H H H H H H H H H H L H H H H H H H H H H H H H H L H H H H H H H H H H INVALID H H H H H H H H H H H H H H H = High level (off) L = Low level (on) FIGURE 2. Truth tabl

43、e. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85084 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for Resa

44、leNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85084 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling

45、and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall b

46、e in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance wit

47、h method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under doc

48、ument revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives