BS EN 60191-6-2-2002 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - c.pdf

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1、BRITISH STANDARD BS EN 60191-6-2:2002 IEC 60191-6-2:2001 Incorporating Corrigendum No. 1 Mechanical standardization of semiconductor devices Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for 1,50 mm, 1,27 mm and 1,00 mm

2、pitch ball and column terminal packages The European Standard EN 60191-6-2:2002 has the status of a British Standard ICS 31.080.01; 01.100.25 BS EN 60191-6-2:2002 This British Standard, having been prepared under the direction of the Electrotechnical Sector Policy and Strategy Committee, was publish

3、ed under the authority of the Standards Policy and Strategy Committee on 29 March 2002 BSI 4 March 2003 ISBN 0 580 39260 0 National foreword This British Standard is the official English language version of EN 60191-6-2:2002. It is identical with IEC 60191-6-2:2001, including Corrigendum October 200

4、2. The UK participation in its preparation was entrusted by Technical Committee EPL/47, Semiconductors, to Subcommittee EPL/47/4, Mechanical standardization, which has the responsibility to: A list of organizations represented on this subcommittee can be obtained on request to its secretary. Cross-r

5、eferences The British Standards which implement international or European publications referred to in this document may be found in the BSI Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of Bri

6、tish Standards Online. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; prese

7、nt to the responsible European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front co

8、ver, the EN title page, pages 2 to 11 and a back cover. The BSI copyright date displayed in this document indicates when the document was last issued. Amendments issued since publication Amd. No. Date Comments 14243 Corrigendum No. 1 4 March 2003 Replacement of figures in Clauses 4 and 5 and correct

9、ions to Tables 2, 4, 6 and 8EUROPEAN STANDARD EN 60191-6-2 NORME EUROPENNE EUROPISCHE NORM February 2002 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassa

10、rt 35, B - 1050 Brussels 2002 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60191-6-2:2002 E ICS 31.080.01 English version Mechanical standardization of semiconductor devices Part 6-2: General rules for the preparation of outlin

11、e drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages (IEC 60191-6-2:2001) Normalisation mcanique des disposifs semiconducteurs Part 6-2: Rgles gnrales pour la prparation des dessins dencombrement des dispo

12、sitifs semiconducteurs pour montage en surface - Guide de conception pour les botiers broches en forme de billes et de colonnes, avec des pas de 1,50 mm, 1,27 mm et 1,00 mm (CEI 60191-6-2:2001) Mechanische Normung von Halbleiterbauelementen Teil 6-2: Allgemeine Regeln fr die Erstellung von Gehusezei

13、chnungen von SMD-Halbleitergehusen - Konstruktionsleitfaden fr Gehuse mit Kugel- und Sulenanschlssen in einem Raster von 1,50 mm, 1,27 mm und 1,00 mm (IEC 60191-6-2:2001) This European Standard was approved by CENELEC on 2002-02-01. CENELEC members are bound to comply with the CEN/CENELEC Internal R

14、egulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.

15、 This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC me

16、mbers are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom.Foreword The text of document 47D/460/FDIS, futu

17、re edition 1 of IEC 60191-6-2, prepared by SC 47D, Mechanical standardization of semiconductor devices, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6-2 on 2002-02-01. The following dates were fixed: latest date by which

18、the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2002-11-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2005-02-01 Annexes designated “normative“ are part of the body of the stan

19、dard. In this standard, annex ZA is normative. Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 60191-6-2:2001 was approved by CENELEC as a European Standard without any modification. _ Page 2 EN 6019162:2002INTRODUCTION This design guide is intende

20、d to standardize the requirements for all ball and column terminal packages in order to establish common rules for terminal shapes, irrespective of device and package types. Page 3 EN 6019162:2002MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-2: General rules for the preparation of outli

21、ne drawings of surface mounted semiconductor device packages Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages 1 Scope This part of IEC 60191 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packa

22、ges, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA). 2 Normative references The following normative documents contain provisions, which, through reference in th

23、is text, constitute provisions of this part of IEC 60191. For dated references, subsequent amend- ments to, or revisions of, any of these publications do not apply. However, parties to agreements based on this part of IEC 60191 are encouraged to investigate the possibility of applying the most recen

24、t editions of the normative documents indicated below. For undated references, the latest edition of the normative document referred to applies. Members of IEC and ISO maintain registers of currently valid International Standards. IEC 60191 (all parts), Mechanical standardization of semiconductor de

25、vices 3 Definitions For the purpose of this part of IEC 60191, the following definitions apply. 3.1 ball terminal packages packages that have solder balls attached to a ceramic/laminate/tape substrate for mounting on a PCB surface, e.g. C-BGA, P-BGA and T-BGA 3.2 column terminal packages packages th

26、at have solder columns attached to a ceramic/laminate/tape substrate for mounting on a PCB surface, e.g. C-CGA Page 4 EN 6019162:20024 Ball terminal packages, 1,50 mm, 1,27 mm and 1,00 mm pitch Reference characters and drawings 2 1 3B C S ES B Sv S D E Sv 2A A 3 1 S ee DS 1x SB 2x S pb mreTilan ixed

27、n aera EIC 10/6242 Sy Page 5 EN 6019162:2002 1 2 3 A B C S A SE B vS S D E vS A2 A A3 A1 S ee SD X1 S A B X2 S bp Terminal index area IEC 2699/01 yS4.1 Outline dimensions The ball terminal dimensions are shown in the tables below. 4.2 Package height The package height (A) is the thickness of the pac

28、kage body, including the lid and ball heights. For all BGA packages, the package body thickness (A2) is considered to be design specific. 4.3 Ball terminal diameter Table 1 Solder terminal Ball diameter b pnominal C-BGA P-BGA T-BGA Terminal pitch e LMP a HMP b L M PH M PL M PH M P 1,00 0,60 0,70 0,6

29、0 0,60 0,63 1,27 0,75 0,89 0,75 0,75 0,63 1,50 0,75 0,89 0,75 0,75 0,63 a LMP = Low melting point. b HMP = High melting point. 4.4 Tolerance of ball centre position Table 2 Tolerance of ball centre position Tolerance of solder ball centre position Coplanarity y Terminal pitch e X1 X2 LMP a HMP b 1,0

30、0 0,25 0,10 0,15 0,15 1,27 0,30 0,15 0,20 0,15 1,50 0,30 0,15 0,20 0,15 a LMP = Low melting point. b HMP = High melting point. 4.5 Package body thickness and stand-off heights The relationship between the package body thickness and stand-off heights for each package is shown in the table below. Page

31、 6 EN 6019162:2002Table 3 Package body thickness and stand-off heights Stand-off height A1 nominal Package type Package body thickness A2 nominal LMP a HMP b Terminal pitch e 0,50 0,70 1,00 0,60 0,90 1,27 C-BGA Design specific 0,60 0,90 1,50 0,50 1,00 0,60 1,27 P-BGA Design specific 0,60 1,50 0,50 0

32、,55 1,00 0,60 0,55 1,27 T-BGA Design specific 0,60 0,55 1,50 a LMP = Low melting point. b HMP = High melting point. 4.6 Tolerance of terminal centre position and coplanarity Table 4 Tolerance of terminal centre position and coplanarity Tolerance of solder ball Centre position Coplanarity y Package t

33、ype Terminal pitch e X1 X2 LMP a HMP b C-BGA, P-BGA, T-BGA 1,00 0,25 0,10 0,15 0,15 C-BGA, P-BGA, T-BGA 1,27 0,30 0,15 0,20 0,15 C-BGA, P-BGA, T-BGA 1,50 0,30 0,15 0,20 0,15 a LMP = Low melting point. b HMP = High melting point. 4.7 Explanatory notes 4.7.1 Objective of establishment This part of IEC

34、 60191 is intended to standardize the requirements of all types of ball terminal packages and to establish common rules, regardless of package type. 4.7.2 Conventional design rules for ball terminal packages Dimensions for the packages with solder ball are listed in tables 1, 2, 3, and 4. Page 7 EN

35、6019162:20025 Column terminal packages, 1,50 mm, 1,27 mm and 1,00 mm pitch Reference characters and drawings 2 1 3B C S ES B Sv S D E Sv 2A A 3 1 S ee DS 1x SB 2x S pb mreTilan ixedn aera EI10/7242 C Sy Page 8 EN 6019162:2002 1 2 3 A B C S A SE B vS S D E vS A2 A A3 A1 S ee SD X1 S A B X2 S bp Termi

36、nal index area IEC 2700/01 yS5.1 Outline dimensions The column terminal dimensions are shown in the tables below. 5.2 Package height The package height (A) is the thickness of the package body, including the lid and column heights. For all C-CGA packages, the package body thickness (A2) is considere

37、d to be design specific. 5.3 Column terminal diameter Table 5 Solder terminal Terminal pitch e Column diameter b pnominal C-CGA LMP a HMP b 1,00 0,50 0,50 1,27 0,50 0,50 1,50 0,50 0,50 a LMP = Low melting point. b HMP = High melting point. 5.4 Tolerance of column centre position Table 6 - Tolerance

38、of column centre position Tolerance of solder column centre position Coplanarity y Terminal pitch e X1 X2 LMP a HMP b 1,00 0,30 0,10 0,15 0,15 1,27 0,30 0,10 0,20 0,15 1,50 0,30 0,10 0,20 0,15 a LMP = Low melting point. b HMP = High melting point. 5.5 Package body thickness and stand-off heights The

39、 relationship between the package body thickness and stand-off heights for each package is shown in the table below. Page 9 EN 6019162:2002Table 7 Package body thickness and stand-off heights Stand-off height A1 nominal Package type Package body thickness A2 nominal LMP a HMP b Terminal pitch e 2,20

40、 2,20 1,00 2,20 2,20 1,27 C-CGA Design specific 2,20 2,20 1,50 a LMP = Low melting point. b HMP = High melting point. 5.6 Tolerance of terminal centre position and coplanarity Table 8 Tolerance of terminal centre position and coplanarity Tolerance of solder column Centre position Coplanarity y Packa

41、ge type Terminal pitch e X1 X2 LMP a HMP b C-CGA 1,00 0,25 0,10 0,15 0,15 C-CGA 1,27 0,30 0,15 0,20 0,15 C-CGA 1,50 0,30 0,15 0,20 0,15 a LMP = Low melting point. b HMP = High melting point. 5.7 Explanatory notes 5.7.1 Objective of establishment This part of IEC 60191 is intended to standardize the

42、requirements of all types of column terminal packages and to establish common rules, regardless of package type. 5.7.2 Conventional design rule for column terminal packages Dimensions for the packages with columns are listed in tables 5, 6, 7, and 8. _ Page 10 EN 6019162:2002Annex ZA (normative) Nor

43、mative references to international publications with their corresponding European publications This European Standard incorporates, by dated or undated reference, provisions from other publications. These normative references are cited at the appropriate places in the text and the publications are l

44、isted hereafter. For dated references, subsequent amendments to or revisions of any of these publications apply to this European Standard only when incorporated in it by amendment or revision. For undated references, the latest edition of the publication referred to applies (including amendments). N

45、OTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60191 Series Mechanical standardization of semiconductor devices EN 60191 Series Page 11 EN 6019162:2002BS EN 60191-6-2:2002 IEC 6019

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