IEC 62014-1-2001 Electronic design automation libraries - Part 1 Input output buffer information specifications (IBIS) (version 3.2)《电子设计自动化程序库 第1部分：输入 输出缓冲器信息规范（IBIS版3.2）》.pdf

《IEC 62014-1-2001 Electronic design automation libraries - Part 1 Input output buffer information specifications (IBIS) (version 3.2)《电子设计自动化程序库 第1部分：输入 输出缓冲器信息规范（IBIS版3.2）》.pdf》由会员分享，可在线阅读，更多相关《IEC 62014-1-2001 Electronic design automation libraries - Part 1 Input output buffer information specifications (IBIS) (version 3.2)《电子设计自动化程序库 第1部分：输入 输出缓冲器信息规范（IBIS版3.2）》.pdf（92页珍藏版）》请在麦多课文档分享上搜索。

1、INTERNATIONAL STANDARD IEC 62014-1 First edition 2001-05 Electronic design automation libraries Part 1: Input/output buffer information specifications (IBIS version 3.2) Reference number IEC 62014-1:2001(E)Publication numbering As from 1 January 1997 all IEC publications are issued with a designatio

2、n in the 60000 series. For example, IEC 34-1 is now referred to as IEC 60034-1. Consolidated editions The IEC is now publishing consolidated versions of its publications. For example, edition numbers 1.0, 1.1 and 1.2 refer, respectively, to the base publication, the base publication incorporating am

3、endment 1 and the base publication incorporating amendments 1 and 2. Further information on IEC publications The technical content of IEC publications is kept under constant review by the IEC, thus ensuring that the content reflects current technology. Information relating to this publication, inclu

4、ding its validity, is available in the IEC Catalogue of publications (see below) in addition to new editions, amendments and corrigenda. Information on the subjects under consideration and work in progress undertaken by the technical committee which has prepared this publication, as well as the list

5、 of publications issued, is also available from the following: IEC Web Site (www.iec.ch) Catalogue of IEC publications The on-line catalogue on the IEC web site (www.iec.ch/catlg-e.htm) enables you to search by a variety of criteria including text searches, technical committees and date of publicati

6、on. On-line information is also available on recently issued publications, withdrawn and replaced publications, as well as corrigenda. IEC Just Published This summary of recently issued publications (www.iec.ch/JP.htm) is also available by email. Please contact the Customer Service Centre (see below

7、) for further information. Customer Service Centre If you have any questions regarding this publication or need further assistance, please contact the Customer Service Centre: Email: custserviec.ch Tel: +41 22 919 02 11 Fax: +41 22 919 03 00INTERNATIONAL STANDARD IEC 62014-1 First edition 2001-05 El

8、ectronic design automation libraries Part 1: Input/output buffer information specifications (IBIS version 3.2) PRICE CODE IEC 2001 Copyright - all rights reserved No part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying a

9、nd microfilm, without permission in writing from the publisher. International Electrotechnical Commission 3, rue de Varemb Geneva, Switzerland Telefax: +41 22 919 0300 e-mail: inmailiec.ch IEC web site http:/www.iec.ch X For price, see current catalogueCommission Electrotechnique InternationaleInter

10、national Electrotechnical Commission 2 62014-1 IEC:2001(E) CONTENTS Page FOREWORD .3 INTRODUCTION.5 Scope and object.7 Section 1: General introduction .8 Section 2: Statement of intent9 Section 3: General syntax rules and guidelines. 11 Section 4: File header information. 13 Section 5: Component des

11、cription 15 Section 6: Model statement 24 Section 6a: Add submodel description . 50 Section 7: Package modeling . 60 Section 8: Electrical board description. 72 Section 9: Notes on data derivation method . 8062014-1 IEC:2001 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ ELECTRONIC DESIGN AUTOMATION

12、LIBRARIES- Part 1: Input/output buffer information specifications ( IBIS version 3.2 ) FOREWORD 1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of the IEC

13、is to promote international co- operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, the IEC publishes International Standards. Their preparation is entrusted to technical committees; any IEC National Committe

14、e interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. The IEC collaborates closely with the International Organization for Standardization (ISO) in ac

15、cordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from

16、all interested National Committees. 3) The documents produced have the form of recommendations for international use and are published in the form of standards, technical specifications, technical reports or guides and they are accepted by the National Committees in that sense. 4) In order to promot

17、e international unification, IEC National Committees undertake to apply IEC International Standards transparently to the maximum extent possible in their national and regional standards. Any divergence between the IEC Standard and the corresponding national or regional standard shall be clearly indi

18、cated in the latter. 5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with one of its standards. 6) Attention is drawn to the possibility that some of the elements of this International Standard may be

19、 the subject of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62014-1 has been prepared by IEC technical committee 93: Design Automation This standard is based on ANSI-EIA-656-A (September 1999): I/O buffer information

20、specifications (IBIS) version 3.2 The text of this standard is based on the following documents: FDIS Report on voting 93/129/FDIS 93/136/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This standard does not fol

21、low the rules for the structure of international standards given in Part 3 of the ISO/IEC Directives. IEC 62014 consists of the following parts: IEC 62014-1, Electronic design automation libraries Part 1: Input/Output buffer information specifications (IBIS version 3.2) IEC 62014-2, Electronic desig

22、n automation libraries Part 2: Library standard architectures (TR)(under consideration) IEC 62014-3, Electronic design automation libraries Part 3: Modules of integrated circuits for EMI Behavioural simulation (under consideration ) 4 62014-1 IEC:2001(E) The committee has decided that the contents o

23、f this publication will remain unchanged until 2004. At this date, the publication will be reconfirmed; withdrawn; replaced by a revised edition, or amended.62014-1 IEC:2001 5 INTRODUCTION Background of IBIS IBIS was first developed at Intel Corporation and has been expanded to its current form (Ver

24、sion 3.2) through the cooperative efforts of additional analog simulator vendors, computer manufacturers, IC vendors, commercial users, and universities. In May 1993, the group formed itself into the IBIS Open Forum, an open, voluntary, cooperative association. In March 1995, the group affiliated wi

25、th the EIA (now the Electronic Industries Alliance) as the EIA IBIS Open Forum. The Forum has been and continues to meet via teleconference approximately every third week to propose updates to the IBIS standard, to help new participants, and to advance the standard. The Forum also meets in person ab

26、out four times a year to exchange ideas and conduct official business. Most of the Forum activities are handled through e-mail discussions using a reflector “ibiseda.org.“ A users group reflector “ibis-userseda.org“ is also supported for users of IBIS. One can get more information on subscribing to

27、the reflectors and to other ongoing Forum activities through the official web page: “http:/www.eigroup.org/ibis/ibis.htm“. The process of making changes and improvements to IBIS is through a “BIRD“ (Buffer Issue Resolution Document) process involving approval by the Forum voting members. Over the ye

28、ars the Forum has grown to over thirty voting members (requiring a modest yearly fee for administrative support), but the Forum also maintains an open, public communications policy and welcomes all interested participants regardless of membership status. Through official EIA and ANSI (American Natio

29、nal Standards Institution) public letter ballot processes, IBIS Version 2.1 was ratified as ANSI/EIA-656 in December 13, 1995. Version 1.1 of IBIS focused on TTL and CMOS logic components. Although never officially ratified as a national standard, IBIS Version 1.1 served as a basis for advances in V

30、ersion 2.1 to increase its accuracy and number of device types that are supported. Version 2.1 contains the following advances: Controlled slew rate devices ECL and PECL technologies Independent control over power rails so RS232 and other types of devices with multiple rails can be modeled Different

31、ial drivers and devices Open-drain I/O devices such as open drain and open collector devices Expanded package model definitions to include coupling between pins. The Forum also voluntarily funded a parser development activity through the sale of source code licenses of “ibischk2“ and has made execut

32、ables of the parser code freely and publicly available to enable IBIS model checking. Industrial advances associated with new semiconductor topologies, package design and measurement needs kept the Forum busy proposing new capabilities, eventually leading to IBIS Version 3.2. Again through official

33、EIA and ANSI public letter ballot processes, IBIS Version 3.2 was ratified as ANSI/EIA-656-A on September 21, 1999. Its advances include the following: Series and series switch models Multi-stage driver capability for phased stages 6 62014-1 IEC:2001(E) Submodel capability supporting dynamic clamps

34、and bus hold functions for active and dynamic terminations More specification values for overshoot and pulse immunity Uncoupled packages with sections and forks Uncoupled advanced packages known as electrical board descriptions with sections, forks and on- board components. IBIS Version 3.2 has comp

35、lied with an original Forum objective that all subsequent versions of IBIS be backward compatible with previous versions. The Forum funded through voluntary source code license purchases the corresponding “ibischk3“ parser and has made its executables freely available. The IBIS Standard has achieved

36、 wide spread national and international support and recognition as indicated by over 40 semiconductor vendors providing IBIS models freely from their web sites. Many more IBIS models and libraries are available from commercial vendors and directly through IC vendor sales organizations. While IBIS mo

37、dels can be of value in all phases of a design and analysis process, they are particularly suitable for printed circuit board design tools used in conjunction with the corresponding physical and mechanical data bases describing the boards. Future IBIS Directions Technology continues to advance, forc

38、ing more stringent electrical requirements and newer ways of doing things. The Forum is keeping up with such advances. However, its strategy has shifted. Up to now the Forum has been adding to the existing fixed-format IBIS document. Such a process is slow and subject to unexpected interactions with

39、 existing capability. The newer approach is to create a compatible macro-language that allows more rapid reconfiguration and response to changing needs. While the Forum has not yet ratified any of these approaches, it is pursuing these projects: A macro-language that fully supports IBIS Version 3.2

40、but can also support more advanced features and nodal component structures A separate Connector Specification with advanced coupled stages to support key component used to connect printed circuit boards (and possibly be used for more advanced package models) Some further advances in specification de

41、tails beyond IBIS Version 3.2. These projects advance the capability of IBIS in a manner that supports the existing IBIS Version 3.2 functionality, but also allows for much more rapid implementation of new requirements. References ANSI/EIA-656: IBIS Version 2.1 released December 13, 1995 ANSI/EIA-65

42、6-A: IBIS Version 3.2 released September 21, 199962014-1 IEC:2001 7 ELECTRONIC DESIGN AUTOMATION LIBRARIES Part 1: Input/output buffer information specifications ( IBIS version 3.2 ) Scope and object This standard gives specifications for electronic behavioral of digital integrated circuit input/ ou

43、tput analog characteristics. It specifies a consistent software-parsable format for essential behavioral information. The goal of this standard is to support all simulators of all degrees of sophistication. - 8 - 62014-1 IEC:2001(E) | Section 1 | | G E N E R A L I N T R O D U C T I O N | |= |= | | T

44、his section gives a general overview of the remainder of this document. | | Sections 2 and 3 contain general information about the IBIS versions and | the general rules and guidelines. Several progressions of IBIS documents | are referenced in Section 2 and in the discussion below. They are IBIS | V

45、ersion 1.1 (ratified August, 1993), IBIS Version 2.1 (ratified as | ANSI/EIA-656 in December, 1995), and IBIS Version 3.2 (this document | ratified in August, 1999). | | The functionality of IBIS follows in Sections 4 through 8. Sections 4 | through 6 describe the format of the core functionality of

46、 IBIS Version 1.1 | and the extensions in later versions. The data in these sections are | contained in .ibs files. Section 7 describes the package model format of | IBIS Version 2.1 and a subsequent extension. Package models can be | formatted within .ibs files or can be formatted (along with the S

47、ection 4 | file header keywords) as .pkg files. Section 8 contains the Electrical | Board Description format of IBIS Version 3.2. Along with Section 4 header | information, electrical board descriptions must be described in separate | .ebd files. | | Section 9 contains some notes regarding the extra

48、ction conditions and data | requirements for IBIS files. This section focuses on implementation | conditions based on measurement or simulation for gathering the IBIS | compliant data. | |= |= | Section 2 | | S T A T E M E N T O F I N T E N T | |= |= | | In order to enable an industry standard method to electronicall