EIA ECA-959-2005 THIN FILM RC SPECIFICATION.pdf
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1、EIA/ECA STANDARD THIN FILM RC SPECIFICATION EIA/ECA-959 JUNE 2005 Ei Electronic Components, Assemblies 8 Materials Association ELECTRONIC COMPONENTS, ASSEMBLIES followed by air drying for 60 to 90 seconds at 93 “C to 121 “C Lead strength: Subject components to three bends of forty five degrees for s
2、urface mount leads. No evidence of breakage of loosening exists when viewed using 1OX magnification. Refer to Mil- Std-883 method 2004, condition B1 Mechanical Vibration: Perfom 10 sweeps for each axis at a rate of one octave per minute. The following condition applies. Sinsoidal Amplitude Frequency
3、 1 Smm(0.059”) 2 to 9 Hertz 5M/sec*2(0.5 1s) 9 to 200 Hertz Refer to Mil-Std-883, method 2007, condition “A” Post electrical testing 25f 5C shall meet the requirements specified in the manufacturer specifications. Mechanical Shock: Apply 70M/s*2(7.lg) half sine, 22ms, 100bumps in each direction of t
4、hree perpendicular axis. (Refer to Mil-Std-883, method 2002, condition “B”. Post electrical testing 25f 5C shall meet the requirements specified in the manufacturer specifications. Temperature Humidity (Biased): 500 hours at 85 f 2 OC, 85% relative humidity. Bias alternate pin. Manufacturer shall sp
5、ecify bias voltage. Post electrical testing 25+ 5C shall meet the requirements specified in the manufacturer specifications. Pressure Pot Test: Immerse the parts for 168 hours 15 PSI and 121 “C. Post electrical testing 25f 5C shall meet the requirements specified in the manufacturer Specifications P
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