ECA EIA-364-1002A-2015 TS-1002A Test Methodology for Assessing the performance of Compliant Contact Terminations used as Free Standing Contacts or in Electrical Connectors and Sock.pdf

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1、 EIA STANDARD TS-1002A Test Methodology for Assessing the performance of Compliant Contact Terminations used as Free Standing Contacts or in Electrical Connectors and Sockets EIA-364-1002A (Revision of EIA-364-1002) September 2015 Electronic Components Industry Association EIA-364-1002A ANSI/EIA-622

2、-B-2015 Approved: September 8, 2015 NOTICE EIA Engineering Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in sele

3、cting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of ECIA from manufacturing or selling products not conforming to such Standards and Publications, nor shall the ex

4、istence of such Standards and Publications preclude their voluntary use by those other than ECIA members, whether the standard is to be used either domestically or internationally. Standards and Publications are adopted by ECIA in accordance with the American National Standards Institute (ANSI) pate

5、nt policy. By such action, ECIA does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the Standard or Publication. This EIA Standard is considered to have International Standardization implications, but the International Electrotechnical Co

6、mmission activity has not progressed to the point where a valid comparison between the EIA Standard and the IEC document can be made. This Standard does not purport to address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user

7、of this Standard to establish appropriate safety and health practices and to determine the applicability of regulatory limitations before its use. (From Standards Proposal No. 5347.06 formulated under the cognizance of the CE-2.0 Committee on EIA National Connector and Sockets Standards.) Published

8、by Electronic Components Industry Association 2015 EIA Standards & Technology Department 2214 Rock Hill Road, Suite 265 Herndon, VA 20170 PLEASE ! DONT VIOLATE THE LAW! This document is copyrighted by the ECIA and may not be reproduced without permission. Organizations may obtain permission to repro

9、duce a limited number of copies through entering into a license agreement. For information, contact: IHS 15 Inverness Way East Englewood, CO 80112-5704 or call USA and Canada (1-877-413-5186), International (303-397-7956) i CONTENTS Clause Page 1 Introduction . 1 1.1 Scope . 1 1.2 Content 1 2 Test b

10、oards 2 2.1 Material . 2 2.2 Board thickness 2 2.3 Number of layers . 2 2.4 Plated through holes 2 2.5 Spacing 2 2.6 Board length 2 3 Test sequence 3 4 Test preparation 4 5 Test procedures and requirements . 4 5.1 General 4 5.2 Visual 4 5.3 Vibration (random) . 5 5.4 Thermal shock . 5 5.5 Humidity .

11、 6 5.6 Temperature life 6 5.7 Mixed flowing gas 7 5.8 Retention force . 7 5.9 Insertion force . 7 5.10 Compliant contact termination resistance 8 5.11 Plated through hole conditioning/integrity . 8 6 Sample size . 9 7 Details to be specified . 9 8 Test documentation . 10 Figure Page 1 Test plan flow

12、 diagram . 3 ii (This page left blank) EIA-364-1002A Page 1 TEST SEQUENCE No. 1002 TEST METHODOLOGY FOR ASSESSING THE PERFORMANCE OF COMPLIANT CONTACT TERMINATIONS USED AS FREE STANDING CONTACTS OR IN ELECTRICAL CONNECTORS AND SOCKETS (From EIA Standards Proposal No. 5347.06, formulated under the co

13、gnizance of the EIA CE-2.0 Committee on National Connector and Socket Standards, and previously published as EIA-364-1002.) 1 Introduction 1.1 Scope This standard establishes the test procedures and test sequences for evaluating compliant contact terminations. The test sequences defined herein shall

14、 be considered generic. Unless otherwise specified in the referencing document, this standard applies to the following types of contacts with compliant contact terminations. Contacts that are supplied as separate items, but may be inserted into a housing Free standing contacts that are not used in a

15、 housing 1.2 Content 1.2.1 This standard shall not be substituted for any standard defining qualification of connectors or sockets. This document does not address other performance characteristics relative to connectors or sockets. Qualification testing described herein is specifically for the termi

16、nation portion of a contact. 1.2.2 The qualification testing established herein is specifically for the compliant contact termination. It includes the assessment of the electrical characteristics between the compliant section and the plated-thru-hole of the test board. It also assesses the mechanica

17、l characteristics (insertion and retention forces) and the plated thru hole integrity (repair and conditioning) when this termination style is used. Figure 1 indicates when these tests shall be performed. EIA-364-1002A Page 2 2 Test boards Unless otherwise specified in the referencing document, all

18、testing shall be performed using test boards with plated through holes within the recommended size range specified by the qualifying agency, see 2.4. 2.1 Material Unless otherwise specified in the referencing document, the test board shall be glass epoxy, FR 4. 2.2 Board thickness Unless otherwise s

19、pecified in the referencing document, the test board thickness shall be 1.57 millimeters 0.13 millimeter (0.062 inch 0.005 inch). 2.3 Number of layers Unless otherwise specified in the referencing document, the test board shall have two layers. The top and bottom layers shall have annular rings as a

20、pplicable. 2.4 Plated through holes The following shall be specified by the qualifying agency (user or manufacturer). Drilled hole diameter Finished hole diameter Plating requirements as applicable 2.5 Spacing Unless otherwise specified in the referencing document, the spacing between adjacent and r

21、ow-to-row plated through holes shall be 2.54 millimeters (0.100 inch). Solder mask shall be prohibited. 2.6 Board length Unless otherwise specified in the referencing document, the board length shall be 101.6 millimeters (4.0 inches) maximum and 44.5 millimeters (1.75 inches) wide. EIA-364-1002A Pag

22、e 3 3 Test sequences 3.1 The basic test sequences shall be as shown in the test plan flow diagram indicated in figure 1. NOTES 1 For requirements, see clause 5. 2 For test severities and test durations, see clause 5. 3 Test groups 1 and 4 shall be performed for contacts with compliant contact termin

23、ations that are used in a connector system and are being qualified in accordance with a specific product standard. These groups shall be performed with test boards and contacts not assembled to their housings.Figure 1 Test plan flow diagram Sample preparation Insertion force 1stcontact Compliant con

24、tact termination resistance Compliant contact termination resistance Compliant contact termination resistance Compliant contact termination resistance Supplemental Compliant contact termination resistance Vibration random Thermal shock Temperature life Mixed flowing gas Retention force 1stcontact Co

25、mpliant contact termination resistance Compliant contact termination resistance Compliant contact termination resistance Compliant contact termination resistance Hole conditioning Retention force Humidity cycling Retention force(see note 3) Insertion force 3rdcontact Compliant contact termination re

26、sistance Compliant contact termination resistance Retention force (see note 3) Plated through hole integrity Group 1 Group 2 Group 3 Group 4 Group 5 Group 6 Retention forceEIA-364-1002A Page 4 3.2 See clause 5 for test severities, durations and requirements, supplemental test sequences and/or indivi

27、dual tests may be performed to meet application specific issues such as: Power (e.g., t-rise, current cycling, etc.) Solderless wrap (e.g. bending, torque, etc.) Other as required 4 Test preparation 4.1 Unless otherwise specified in the referencing document, soldering leads to contacts with complian

28、t contact terminations for the purpose of creating a series circuit shall be prohibited. 4.2 Contacts with compliant terminations shall have a length such that they protrude from their plated through holes by 1.0 millimeter minimum to facilitate compliant contact termination resistance and retention

29、 tests. 4.3 Supplemental test sequences or individual tests for power applications or to monitor contact interruptions may be performed with mating connectors as may be specified in the referencing document. 4.3.1 In those instances, such as monitoring for contact interruptions or conducting tempera

30、ture life with electrical load, etc. special test board circuitry may be required. 5 Test procedures and requirements 5.1 General 5.1.1 The test severity, duration and requirements as specified herein shall be considered to be “default” levels. Severity, duration and requirements, if different than

31、contained herein, shall be specified by the qualifying agency. 5.1.2 Unless otherwise specified in the referencing document, all tests shall be performed in accordance with the test procedures indicated. Special conditions, requirements and/or techniques that may be required shall be specified by th

32、e qualifying agency and documented in the test report. 5.2 Visual 5.2.1 Procedure Visual examination shall be performed initially and after each environmental stress test. The examination shall be performed under 7x optical magnification. EIA-364-1002A Page 5 5.2.2 Requirement There shall be no evid

33、ence of physical damage, material cracking, etc. 5.3 Vibration (random) 5.3.1 Procedure EIA 364-28, test condition VII, test condition letter E Power spectral density: 0.05 g2/Hz Gs: 4.9 rms Frequency: 20 hertz to 500 Hertz Duration: 45 minutes/axis, 3 axis Fixturing shall restrain the test board. T

34、he contact protruding from what would be the component side of the test board may use damping techniques (only in the instance when contacts are tested without connector housing support). 5.3.2 Requirements Visual: No damage Change in compliant contact termination resistance: +1.0 milliohm 5.4 Therm

35、al shock 5.4.1 Procedure EIA 364-32, method A, test condition VII Lower temperature: 55C +0C / -5C Upper temperature: +105C +3C / -0C Number of cycles: 100 cycles Dwell time: The weight of a fully loaded test board shall be measured and recorded. The dwell time shall be established in accordance wit

36、h EIA 364-32, table 1. An acceptable alternative is to record the time for the fully loaded board to reach the specified temperature level and add 10 minutes. The recording thermocouple shall be placed at the base of the contact/plated through hole in the center of the test board. EIA-364-1002A Page

37、 6 5.4.2 Requirements Visual: No damage Change in compliant contact termination resistance: +1.0 milliohm 5.5 Humidity 5.5.1 Procedure EIA 364-31 Temperature: 5C to 85C Humidity: 80 to 95% Ramp up/down time: 2.0 hours Dwell time: 1.0 hour Test duration: 500 hours Dwell times may be modified if the a

38、lternate technique as described in 5.4.1 is used. 5.5.2 Requirements Visual: No damage Change in compliant contact termination resistance: +1.0 milliohm 5.6 Temperature Life 5.6.1 Procedure EIA 364-17 Temperature: +105C 3C Test Duration: 300 hours 5.6.2 Requirements Visual: No damage Change in compl

39、iant contact termination resistance: +1.0 milliohm EIA-364-1002A Page 7 5.7 Mixed flowing gas 5.7.1 Procedure EIA 364-65, class IIA Test duration: 10 days 5.7.2 Requirements Visual: No damage Change in compliant contact termination resistance: +1.0 milliohm Corrosion rates as determined via the coup

40、on/weight gain technique shall be recorded in the test report. 5.8 Retention force 5.8.1 Procedure EIA 364-29, method C Rate: 25.4 millimeters / minute (1.0 inch / minute) maximum Direction: Opposite to the insertion direction 5.8.2 Requirements 0.025 inch square contact (solderless wrap) 33 newtons

41、 (7.5 pounds) 0.025 inch square contact (non wrap) 22 newtons (5.0 pounds) 0.025 inch square contact 9 newtons (2.0 pounds) 5.9 Insertion force 5.9.1 Procedure The insertion fixture shall be axially aligned to the mating tip of the contact. A cylinder type fixture may be used. Rate: 25.4 millimeters

42、 / minute (1.0 inch / minute) maximum Direction: Axial. The contact shall be inserted until the compliant section is midway through the thickness of the test board. In the event of a stopping flange on the contact, the contact shall be inserted so that the flange is not less than 0.127 millimeter (0

43、.005 inch) from the annular ring of the plated through hole. EIA-364-1002A Page 8 5.9.2 Requirements 0.025 inch square contact 200 newtons (45.0 pounds) 0.025 inch square contact 111 newtons (25.0 pounds) 5.10 Compliant contact termination resistance 5.10.1 Procedure EIA 364-23 Test current: 100 mil

44、liamperes maximum Test voltage: 20 millivolts maximum open circuit voltage Unless otherwise specified in the referencing document, current and voltage probes shall be connected to the annular ring on the test board. A second set of current/voltage probes shall be placed on the portion of the pin pro

45、truding from the termination side of the test board. 5.10.2 Requirements Initial compliant contact termination resistance measurement: 1.0 milliohm NOTE For test boards that are thicker than that specified in 2.2 or in those instances where the pin does not protrude from the plated through hole, the

46、 above requirement may have to be modified to account for the additional bulk resistance of the resulting measurement area. When this condition exists, it shall be noted in the test report. 5.11 Plated through hole conditioning/integrity 5.11.1 Procedure EIA 364-96 Number of conditioning cycles: thr

47、ee An untested contact shall be inserted for each cycle. The forces for the second contact shall not be monitored. Each contact shall be inserted in the same plated through hole and in the same plane/attitude as the first contact. EIA-364-1002A Page 9 5.11.2 Requirements Change in compliant contact

48、termination resistance: +1.0 milliohm Plated through hole integrity Radial distortion: The average hole distortion shall not exceed 37.5 micrometer (0.0015 inch) nor shall any distortion exceed 50 micrometers (0.002 inch). Remaining plating: There shall be evidence that there is continuous copper be

49、tween the compliant section and the non-conductive board material. There shall be no evidence of physical damage to the test board/plated through hole such as cracks in the barrel or pad lifting, etc. See EIA-364-96, figures 1 and 2. 6 Sample size Unless otherwise specified in the referencing document, the sample size shall be as follows: 6.1 Test group 1: 60 free standing contacts 50 for insertion, retention fo