DLA SMD-5962-94578-1997 MICROCIRCUIT DIGITAL 32-BIT MICROPROCESSOR MONOLITHIC SILICON《硅单片 32位微处理器 数字微型电路》.pdf

《DLA SMD-5962-94578-1997 MICROCIRCUIT DIGITAL 32-BIT MICROPROCESSOR MONOLITHIC SILICON《硅单片 32位微处理器 数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-94578-1997 MICROCIRCUIT DIGITAL 32-BIT MICROPROCESSOR MONOLITHIC SILICON《硅单片 32位微处理器 数字微型电路》.pdf（39页珍藏版）》请在麦多课文档分享上搜索。

1、REVISIONSLTR DESCRIPTION DATE (YR-MO-DA) APPROVEDREV SHEET 35 36 37 38REVSHEET 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34REV STATUSOF SHEETSREVSHET 123456789101121314PMIC N/APREPARED BY Thomas M. Hess DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216 STANDARDMICROCIRCUITDRAWINGTHI

2、S DRAWING IS AVAILABLEFOR USE BY ALLDEPARTMENTSAND AGENCIES OF THEDEPARTMENT OF DEFENSEAMSC N/A CHECKED BYThomas M. HessMICROCIRCUIT, DIGITAL, 32-BIT MICROPROCESSORMONOLITHIC SILICONAPPROVED BYMonica L. PoelkingDRAWING APPROVAL DATE97-02-05SIZEACAGE CODE672685962-94578REVISION LEVELSHEET 1 OF 38DESC

3、 FORM 193JUL 94 5962-E082-97DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGDEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000SIZEA5962-

4、94578REVISION LEVEL SHEET2DESC FORM 193AJUL 941. SCOPE1.1 Scope. This drawing documents three product assurance class levels consisting of space application (device class V), highreliability (device classes M and Q), and nontraditional performance environment (device class N). A choice of case outli

5、nes andlead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of RadiationHardness Assurance (RHA) levels are reflected in the PIN. For device class N, the user is cautioned to assure that the device isappropriate for the application environme

6、nt.1.2 PIN. The PIN is as shown in the following example:5962 - 94578 01 Q X X G0DG0D G0DG0D G0DG0DG0DG0D G0DG0D G0DG0DG0D G0D G0D G0D G0D G0D Federal RHA Device Device Case Lead stock class designator type class outline finishdesignator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (

7、see 1.2.3)/ Drawing number 1.2.1 RHA designator. Device classes N, Q, and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and aremarked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix Aspecified RHA levels and are marked with t

8、he appropriate RHA designator. A dash (-) indicates a non-RHA device.1.2.2 Device type(s). The device type(s) identify the circuit function as follows:Device type Generic number Circuit function Temperature Range Speed01 80502 32-bit Microprocessor -55 C to +125 C 50/100 MHzoo02 80502 32-bit Micropr

9、ocessor -40 C to +110 C 50/100 MHz03 80502 32-bit Microprocessor -40 C to +85 C 50/100 MHzoo04 80502 32-bit Microprocessor -55 C to +125 C 60/120 MHz05 80502 32-bit Microprocessor -40 C to +110 C 60/120 MHzoo06 80502 32-bit Microprocessor -40 C to +85 C 60/120 MHz07 80502 32-bit Microprocessor -55 C

10、 to +125 C 66/133 MHzoo08 80502 32-bit Microprocessor -40 C to +110 C 66/133 MHz09 80502 32-bit Microprocessor -40 C to +85 C 66/133 MHzoo1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows:Device class Device requirements

11、documentationM Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JANclass level B microcircuits in accordance with MIL-PRF-38535, appendix AN Certification and qualification to MIL-PRF-38535 with a nontraditional performanceenvironment 1/Q or V Certification and qualificat

12、ion to MIL-PRF-385351.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:Outline letter Descriptive designator Terminals Package styleX See figures 1 296 Staggered Pin Grid Array1/ Any device outside the traditional performance environment; e.g., an operating t

13、emperature range of -55G28C to +125G28C andwhich requires hermetic packaging.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGDEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000SIZEA5962-94578REVISION LEVEL SHEET3DESC F

14、ORM 193AJUL 941.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes N, Q, and V orMIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 2/Storage Temperature Range -65G28C to +150G28CCase Temperature Under Bias. -65G28C to +125G28C3 V Supply Vol

15、tage with respect to Ground -0.5 V dc to +4.1 V dc3 V Only Buffer Input Voltage with respect to Ground . -0.5 V dc to Vcc + 0.5 V dc(not to exceed 4.6 V)5V Safe Buffer Input Voltage with respect to Ground . -0.5 V dc to 6.5 V dcLead Temperature (soldering 10 seconds) . 300G28CThermal Resistance, Jun

16、ction-to-case (G15 ): Case X . 1.7G28C/W 3/JCThermal Resistance, Junction-to-ambient (G15 ): Case X 16.2G28C/W 3/ 4/JA1.4 Recommended operating conditions.Case Operating Temperature Rangedevice type 01, 04 and 07 -55G28C to +125G28C device type 02, 05 and 08 -40G28C to +110G28C device type 03, 06 an

17、d 09 -40G28C to +85G28CSupply Voltage, V . 3.135 V dc V 3.465 V dcCC3 CCSupply Voltage, V . 2.935 V dc V 3.265 V dcCC2 CC1.5 Digital logic testing for device classes Q and V. Fault coverage measurement of manufacturinglogic tests (MIL-STD-883, test method 5012) 97.6 percent2. APPLICABLE DOCUMENTS2.1

18、 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part ofthis drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issueof the Department of Defense Index of Specifica

19、tions and Standards (DoDISS) and supplement thereto, cited in the solitation.SPECIFICATIONMILITARYMIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.STANDARDSMILITARYMIL-STD-883 - Test Methods and Procedures for Microelectronics.MIL-STD-973 - Configuration Management.MIL-S

20、TD-1835 - Microcircuit Case Outlines.HANDBOOKSMILITARYMIL-HDBK-103 - List of Standard Microcircuit Drawings (SMDs).MIL-HDBK-780 - Standard Microcircuit Drawings.(Unless otherwise indicated, copies of the specification, standards, bulletin, and handbook are available from the StandardizationDocument

21、Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)2/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at themaximum levels may degrade performance and affect reliability.3/ Without heat sink.4/ Zero airflow.Provided by IH

22、SNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGDEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000SIZEA5962-94578REVISION LEVEL SHEET4DESC FORM 193AJUL 942.2 Non Government publications. The following document(s) for a part of this

23、 document to the extent specifiedherein. Unless otherwise specified, the issues of the documents which are DOD adopted are those listed in the issueof the DODISS cited in the solicitation. Unless otherwise specified, the issues of documents not listed in the DODISSare the issues of the documents cit

24、ed in the solicitation.INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS (IEEE)IEEE Standard 1149.1 - IEEE Standard Test Access Port and Boundary Scan Architecture.(Applications for copies should be addressed to the Institute of Electrical and Electronics Engineers, 445 Hoes Lane,Piscataway, NJ 0885

25、4-4150.)(Non-Government standards and other publications are normally available from the organizations that prepare ordistribute the documents. These documents may also be available in or through libraries or other informationalsevices.)2.3 Order of precedence. In the event of a conflict between the

26、 text of this drawing and the references cited herein, the text ofthis drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specificexemption has been obtained.3. REQUIREMENTS3.1 Item requirements. The individual item requirements for devic

27、e classes N, Q, and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in theQM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device

28、 class M shall be inaccordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein.3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified inMIL-PRF-38535 and herein for device classes N, Q, and V

29、 or MIL-PRF-38535, appendix A and herein for device class M.3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein and figure 1.3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.3.2.3 Block diagram. The block diagram shall be as specified o

30、n figure 3.3.2.4 Waveform. The waveform shall be as specified on figure 4.3.2.5 Boundary Scan Instruction Codes. For all devices the boundary scan instruction codes shall be as specifiedon figure 5.3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise spec

31、ified herein, the electricalperformance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operatingtemperature range.3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The

32、electrical testsfor each subgroup are defined in table I.3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be markedas listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space limit

33、ations, themanufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designatorshall still be marked. Marking for device classes N, Q, and V shall be in accordance with MIL-PRF-38535. Marking for device classM shall be in accordance with MIL-PRF

34、-38535, appendix A.3.5.1 Certification/compliance mark. The certification mark for device classes N, Q, and V shall be a “QML“ or “Q“ as required inMIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A.Provided by IHSNot for ResaleNo reproducti

35、on or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGDEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000SIZEA5962-94578REVISION LEVEL SHEET5DESC FORM 193AJUL 94TABLE I. Electrical performance characteristics.Test Symbol Conditions 1/ -55C G06 T G06 +125CC3.135 V G0

36、6 V G06 3.465 VCC32.935 V G06 V G06 3.265 VCC2unless otherwise specifiedGroup AsubgroupsDevicetypeLimits UnitMin MaxInput low voltage VIL3TTL levelApplies to all signalsexcept CLK and PICCLK1,2,3 All -0.3 0.8 VInput high voltage VIH31,2,3 All 2.0 V +0.3CCInput low voltage (5 V) VIL5TTL level;measure

37、d at 4mAApplies to CLK and PICCLKonly1,2,3 All -0.3 0.8Input high voltage (5 V) VIH51,2,3 All 2.0 5.55Output low voltage VOL3Measured at 4 mA. Applies toCLK and PICCLK only1,2,3 All 0.4Output high voltage VOH3Measured at 3 mA. Applies toCLK and PICCLK only1,2,3 All 2.4Input leakage current ILI0 V =

38、VIN CC3(only for inputs withoutpullups or pulldowns)1,2,3 All +/-15 AOutput leakage current ILO0 V = V 3-stateOUT CC3(only for inputs withoutpullups or pulldowns)1,2,3 All +/-15Input leakage current IIHV = 2.4 VIN(only for inputs with pulldowns)1,2,3 All 200Output leakage current IILV = 0.4 VIN(only

39、 for inputs with pullups)1,2,3 All -400Supply current ICC3100 MHz, 3.465 V 2/ 1,2,3 01,02,03 170 mA120 MHz, 3.465 V 2/ 04,05,06 220133 MHz, 3.465 V 2/ 07,08.09 255Supply current ICC2100 MHz, 3.265 V 2/ 1,2,3 01,02,03 1885 mA120 MHz, 3.265 V 2/ 04,05,06 2300133 MHz, 3.265 V 2/ 07,08,09 2575Capacitanc

40、e input CINSee 4.4.1c 4 All 15 pFCapacitance output CO4 All 20Capacitance I/O CI/O4 All 25Capacitance CLK input CCLK4 All 15Capacitance test input CTIN4 All 15Capacitance test output CTOUT4 All 20Capacitance test clock CTCK4 All 15Functional tests See 4.4.1b 7,8 AllSee footnotes at end of table.Prov

41、ided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGDEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000SIZEA5962-94578REVISION LEVEL SHEET6DESC FORM 193AJUL 94TABLE I. Electrical performance characteristics - Continued.Test Sy

42、mbol Conditions 1/-55C G06 T G06 +125CC3.135 V G06 V G06 3.465 VCC32.935 V G06 V G06 3.265 VCC2unless otherwise specifiedGroup AsubgroupsDevicetypeLimits UnitMin MaxFrequency Max. core freq. = 100 MHzat 1/29,10,11 01-03 25 50 MHzCLK period t1a9,10,11 01-03 20 40 nsCLK period stability t1b3/ 4/ 9,10,

43、11 01-03 250 psCLK high time t2V = 2 V 3/IN9,10,11 01-03 4.0 nsCLK low time t3V = 0.8 V 3/IN9,10,11 01-03 4.0CLK fall time t4V = 2.0 V - 0.8 V 3/ 5/IN9,10,11 01-03 0.15 1.5CLK rise time t5V = 2.0 V - 0.8 V 3/ 5/IN9,10,11 01-03 0.15 1.5G0AAG0AG0ADG0AG0ASG0A, PWT, PCD,G0ABG0AG0AEG0AG0AOG0A -G0A7G0A ,

44、M/G0AIG0AG0AOG0A, D/G0ACG0A,G0ACG0AG0AAG0AG0ACG0AG0AHG0AG0AEG0A, SCYC, W/G0ARG0A,valid delayt6a9,10,11 01-03 1.0 7.0AP valid delay t6b9,10,11 01-03 1.0 8.5A3-A31, G0ALG0AG0AOG0AG0ACG0AG0AKG0A valid delay t6c9,10,11 01-03 1.1 7.0G0AAG0AG0ADG0AG0ASG0A, AP, A3-A31,PWT, PCD, G0ABG0AG0AEG0AG0AOG0A -G0A7G

45、0A ,M/G0AIG0AG0AOG0A, D/G0ACG0A, W/G0ARG0A,G0ACG0AG0AAG0AG0ACG0AG0AHG0AG0AEG0A, SCYC, G0ALG0AG0AOG0AG0ACG0AG0AKG0A float delayt73/ 9,10,11 01-03 10.0G0AAG0AG0APG0AG0ACG0AG0AHG0AG0AKG0A, G0AIG0AG0AEG0AG0ARG0AG0ARG0A, G0AFG0AG0AEG0AG0ARG0AG0ARG0A, G0APG0AG0ACG0AG0AHG0AG0AKG0A valid delayt86/ 9,10,11 0

46、1-03 1.0 8.3BREQ, HLDA, G0ASG0AG0AMG0AG0AIG0AG0AAG0AG0ACG0AG0ATG0A validdelayt9a6/ 9,10,11 01-03 1.0 8.0G0AHG0AG0AIG0AG0ATG0A valid delay t10a9,10,11 01-03 1.0 8.0G0AHG0AG0AIG0AG0ATG0AG0AMG0A valid delay t10b9,10,11 01-03 1.1 6.0PM0-1, BPO-3 valid delay t11a9,10,11 01-03 1.0 10.0PRDY valid delay t11

47、b9,10,11 01-03 1.0 8.0DO-D63, DPO-7 write datavalid delayt129,10,11 01-03 1.3 8.5DO-D63, DPO-3 write datafloat delayt133/ 9,10,11 01-03 10.0A5-A31 setup time t147/ 9,10,11 01-03 6.5See footnotes at end of table.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from

48、 IHS-,-,-STANDARDMICROCIRCUIT DRAWINGDEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000SIZEA5962-94578REVISION LEVEL SHEET7DESC FORM 193AJUL 94TABLE I. Electrical performance characteristics - Continued.Test Symbol Conditions 1/-55C G06 T G06 +125CC3.135 V G06 V G06 3.465 VCC32.935 V G06 V G06 3.265 VCC2unless otherwise specifiedGroup AsubgroupsDevicetypeLimits UnitMin MaxA5-A31 hold time t159,10,11 01-03 1.0 nsINV, AP setup time t16a9,10,11 01-03 5.0G0AEG0AG0AAG0AG0ADG0AG0ASG0A setup time t16b9,10,11 01-