DLA SMD-5962-92206-1994 MICROCIRCUIT DIGITAL FAST CMOS 8-INPUT MULTIPLEXER TTL COMPATIBLE INPUTS AND LIMITED OUTPUT VOLTAGE SWING MONOLITHIC SILICON《硅单片 TTL兼容输入及受输出限制的电压摆幅 8输入多路复用器.pdf

《DLA SMD-5962-92206-1994 MICROCIRCUIT DIGITAL FAST CMOS 8-INPUT MULTIPLEXER TTL COMPATIBLE INPUTS AND LIMITED OUTPUT VOLTAGE SWING MONOLITHIC SILICON《硅单片 TTL兼容输入及受输出限制的电压摆幅 8输入多路复用器.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-92206-1994 MICROCIRCUIT DIGITAL FAST CMOS 8-INPUT MULTIPLEXER TTL COMPATIBLE INPUTS AND LIMITED OUTPUT VOLTAGE SWING MONOLITHIC SILICON《硅单片 TTL兼容输入及受输出限制的电压摆幅 8输入多路复用器.pdf（16页珍藏版）》请在麦多课文档分享上搜索。

1、SUD-5762-92206 m 9999996 0064272 751 m LTR DESCRIPTION DATE (YR-MO-DA) APPROVED DRAWING APPROVAL DATE 94-10-06 REVISION LEVEL SHEET dkk SIZE CAGE CODE 5962-92206 A 67268 SHEET 15 I REV STATUS OF SHEETS PMIC NIA STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AG

2、ENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A ESC FORM 193 JUL 91 PREPARED BY Thanh V. Nguyen DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 CHECKED BY 1 Thanh V. Nguyen MICROCIRCUIT, DIGITAL, FAST CMOS, APPROVED BY 8-INPUT MULTIPLEXER, TTL COMPATIBLE INPUTS AND LIMITED OUTPUT VOLTAGE SWING, MO

3、NOLITHIC SILICON Monica L. Poelking SHEET 1 OF 15 5962-E418-94 -. DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-1.1 Scope. This drawing forms a part of a one part - o

4、ne part number documentation systcn (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and spce application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Numbe

5、r (PIN). 1.2.1 of MIL-STD-883, “Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices“. available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. Device class M microcircuits represent non-JAN class 6 microcircuits in accordance with Whe

6、n 1.2 m. The PIN shall be as shown in the following example: I SIZE STANDARD A MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL 7 1 1 1 RHA Devi ce Devi ce Case Lead 5962-92206 SHEET 2 stock class designator type class out line finish designator (see 1.2.1) (s

7、ee 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device class M RHA marked devices shall meet the MIL-1-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. MIL-1-38535 specified RHA levels and shall be marked

8、 with the appropriate RHA designator. non-RHA device. Device classes Q and V RHA marked devices shall meet the A dash (-1 indicates a 1.2.2 Device type(s). lhe device typeCs) shall identify the circuit function as follows: Device type Generic number circuit function 01, 02 54FCT151T 03, 04 54FCT151A

9、T 05, 06 54FCT151CT 8-input multiplexer, TTL compatible inputs and limited output voltage swing 8-input multiplexer, TTL compatible inputs and Limited output voltage swing 8-input multiplexer, TTL compatible inputs and limited output voltage swing 1.2.3 Device class designator. The device class desi

10、gnator shall be a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class El microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-

11、1-38535 1.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835, and as follows: Outline letter Descriptive designator Terminals Package style I E GDIPI-TI6 or CDIP2-Tl6 16 Dua 1-i n- ti ne F GDFP2-FI6 or CDFP3-Fl6 16 Flat pack 2 CQCCI -NZO 20 Square chip carrier 1.2.5 Lead

12、 finish. The lead finish shall be as specified in NIL-STD-883 (see 3.1 herein) for class M or MIL-1-38535 for classes Q and V. designation is for use in specifications when lead finishes A, E, and C are considered acceptable and interchangeable without preference. Finish letter “X“ shall not be mark

13、ed on the microcircuit or its packaging. The “XI Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-92206 b 0064274 524 1.3 Absolute maximum ratings. 11 21 SIZE STANDARD A MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER REVISION LEVEL DA

14、YTON, OHIO 45444 Supply voltage range (V c) - - - - - - - - - - - - - - - - - - DC input voltage range hIN) - - - - - - - - - - - - - - - - - DC output voltage range (Vo T) - - - - - - - - - - - - - - - - DC input clamp current (I Y (VIN = -0.5 V ) - - - - - - - - - DC output clamp current (VOUT -0.

15、5 V and +7.0 V) - - - - DC output source current (IyH) (per output) - - - - - - - - - DC output sink current (IoL - - - - - - - - - - (per output) DC V current (IcC) - - - - - - - - - - - - - - - - - - - - Grou$ current (IGND) - - - - - - - - - - - - - - - - - - - - Storage temperature range (TsfG -

16、 - - - - - - - - - - - - - - ) _- Case temperature under bias Lead temperature (soldering, I!%conds) - - - - - - - - - - - Thermal resistance, junction-to-case (OJc) - - - - - - - - - - Junction temperature (TJ) - - - - - - - - - - - - - - - - - - Maximum power dissipation (PD) - - - - - - - - - - -

17、 - - - - - 1.4 Recommended operating conditions. 21 I/ Supply voltage range (Vc ) - - - - - - - - - - - - - - - - - - input voltage range (VI,.$ - - - - - - - - - - - - - - - - - - Output voltage range (VOUT) - - - - - - - - - - - - - - - - - Maximum low level input voltage (VIL) - - - - - - - - - -

18、 - - Minimum high level input voltage (VI ) - - - - - - - - - - - - Case operating temperature range (T Y - - - - - - - - - - - - Maximum input rise or fall rate (Atfbv): - - - - - - - - Maximum high level output current (IOH) - - - - - - - - - - - Maximum low level output current (IoL) - - - - - -

19、- - - - - - (from VIN = 0.3 V to 2.7 V, 2.7 V to 0.3 V) 5962-92206 SHEET 3 -0.5 V dc to +7.0 V dc -0.5 V dc to Vcc + 0.5 V d -0.5 V dc to VCc + 0.5 V dc 41 -20 UIA *20 mA -30 mA +70 mA *260 mh +550 mh 41 -65C to +150C -65C to +135DC +3m0c See MIL-STD-1835 +175C 500 mU +4.5 V dc to +5.5 V dc +O.O V d

20、c to Vcc +O.O V dc to Vcc 0.8 V 2.0 v -55OC to +1%5“C 5.0 ns/V -12 mA 32 mA 1.5 Digital logic testing for device classes Q and V. Fault coverage measurement of manufacturing Logic tests (MIL-STD-883, test method 5012) - - - - - - - - XX percent 51 2. APPLICABLE DOCUMENTS 2.1 Government specification

21、, standards, bulletin, and handbook. Unless otherwise specified, the following specification, standards, bulletin, and handbook of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the exten

22、t specified herein. I DESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- SPECIFICATION HILITARY MIL-1-38535 STANDARDS MILITARY MIL-STD-883 HIL-STD-973 MIL-STD-I 835 BULLETIN MILITARY M IL-BUL-103 HANDBOOK MIL I TA RY MIL-HDBK-780

23、SIZE STANDARD A MI CROC I RCUI T DRAWING REVISION LEVEL DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 Integrated Circuits, Manufacturing, General Specification for. 5962-92206 SHEET 4 Test Methods and Procedures for Hicroelectronics. Configuration Management. Microcircuit Case Outlines List o

24、f Standardized Military Drawings (SMDs) Standardized Military Drawings. (Copies of the specification, standards, bulletin, and handbook required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activ

25、ity.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing shall take precedence. 3. REQUIREMENTS 3.1 The individual item requirements for device class M shall be in accordance with 1.2.1 of MIL-STD-883, “Provi

26、sions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices“ and as specified herein. device manufacturers Quality Management (QM) plan, and as specified herein. Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-1-38535,

27、 the 3.2 Desiqn, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-STO-883 (see 3.1 herein) for device class M and MIL-1-38535 for device classes Q and V and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with

28、 1.2.4 herein. 3.2.2 Terminal connections. 3.2.3 Truth table. 3.2.4 Logic diagram. 3.2.5 Switching waveforms and test circuit. The terminal connections shall be as specified on figure 1. The truth table shall be as specified on figure 2. The logic diagram shall be as specified on figure 3. The switc

29、hing waveforms and test circuit shall be as specified on figure 4. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise Specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall

30、 apply over the full case operating temperature range. and limits are as specified in table I. Test conditions for these specified characteristics 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup a

31、re defined in table I. 3.5 Harking. The part shall be marked with the PIN listed in 1.2 herein. Marking for device class M shall be in accordance with MIL-STD-883 (see 3.1 herein). MIL-BUL-103. In addition, the manufactureis PIN may also be marked as listed in Harking for device classes Q and V shal

32、l be in accordance with MIL-1-38535. DESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-59b2-9220b m 9999996 0064276 3T7 = MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 3.5.1 Certification/compliance

33、 mark. The compliance atark for device class M shall be a “CI as required in MIL-STO-883 (see 3.1 herein). in MIL-1-38535. The certification mark for device classes Q and V shall be a “QML“ or “QI as required 3.6 Certificate of compliance. For device class Pi, a certificate of compliance shall be re

34、quired from a manufacturer in order to be listed as an approved source of supply in MIL-SUL-I03 (see 6.7.2 herein). classes Q and V, a certificate of compliance shall be required from a QML-38535 Listed manufacturer in order to supply to the requirements of this drawing (see 6.7.1 herein). listing a

35、s an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device class M the requirements of MIL-STD-883 (see 3.1 herein), or for device classes Q and V, the requirements Of NIL-1-38535 and the requirements herein. For device The certificate of compliance

36、 submitted to DESC-EC prior to 3.7 Certificate of conformance. A certificate of conformance as required for device class M in MIL-STD-883 (see 3.1 herein) or for device classes Q and v in MIL-1-38535 shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of chan

37、qe for device class M. For device class M, notification to DESC-EC of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in MIL-STD-973. 3.9 Verification and review for device class M. For device class M, DESC, DESCs agent, and the acq

38、uiring activity Offshore documentation retain the option to review the manufacturers facility and applicable required documentation. shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing sh

39、all be in microcircuit group number 39 (see MIL-1-38535, appendix A). 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. For device class M, sampling and inspection procedures shatl be in accordance with For device classes Q and V, sampling and inspection procedures shall be in accordance

40、MIL-STD-883 (see 3.1 herein). with MIL-1-38535 and the device manufacturers QM plan. 4.2 Screening. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. For device classes Q and V, screeni

41、ng shall be in accordance with MIL-1-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. REVISION LEVEL SHEET li 4.2.1 Additional criteria for device cCass M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, 8, C or D. revision

42、 level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015. The test circuit shall be maintained by the m

43、anufacturer under document (2) TA = +125OC, minimum. b. Interim and final electrical test parameters shall be as Specified in table II herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as

44、 specified in the device manufacturers QM plan in accordance with MIL-1-38535. maintained under document revision level control of the device manufacturers Technology Review Board (TR8) in accordance with MIL-1-38535 and shall be made available to the preparing or acquiring activity upon request. Th

45、e test circuit shaLl specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015. Interim and final electricat test parameters shall be as specified in table XI herein. Additional screening for device class V beyond the requi

46、rements of device class Q shall be as specified in appendix B of MIL-1-38535. The burn-in test circuit shall be b. c. STANDARD I SIZE A 1 5962-92206 DESC FORM 193A JL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING DE

47、FENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 SIZE A 5962-92206 REVISION LEVEL SHEET 6 , TABLE 1. Electrical performance characteristics. - vcc - 4.5 v - Device type All 01, 03 05 Test conditions 21 -55C I TC S +125“C +4.5 v 5 vc.c = +5.5 v unless otherwise specified Group A subgroups Limits 31

48、 Unit Symbo I pl - OH2 Max Vcc-O. 5 For all inputs affecting output under test IOH = -300 PA I 1, 2, 3 V 1, 2, 3 VIN = 2.0 V or 0.8 V 1, 2, 3 2.0 For all other inputs VIN = Vcc or GND 02, o4 o6 1, 2, 3 2.4 IOH = -12 mA IoL = 300 pA I 4.5 v - 4.5 v - 5.5 v 1, 2, 3 0.2 All 01, 03 05 02, o4 o6 Al 1 IoL

49、 = 32 mA For input under test, IIN = -18 mP 0.5 -1.2 vIc- IH For input under test, IIN = -15 J 1, 2, 3 -1.3 1 .o For input under test, VIN = Vcc For all other inputs VIN = Vcc or GND For input under test, VIN = GND For all other inputs VIN = Vcc or GND 3 5.0 IIL 5.5 v - 5.5 v - 5.5 v - 5.5 v - 5.5 v - 5.5 v - All All All -1.0 -5.0 3 - -60 - -225 mA For all inputs, VIN = Vcc or GND VouT = GND 0.25 mA/ 3Hz*Bit Outputs open ALL 1, 2, 3 2.0 mA Fo