DLA SMD-5962-92117 REV E-2013 MICROCIRCUIT LINEAR HIGH SPEED LOW POWER DUAL OPERATIONAL AMPLIFIER MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Sheet 3: Paragraph 1.3, Input common mode voltage range (VCM), delete “VS” and substitute “VS”. Sheet 5: Table I, Quiescent power supply current test, IQ, conditions column, delete “VS= 5.0 V” and substitute “VS= 5.0 V, VOUT= 0 V” and delete “VS=
2、 15.0 V” and substitute “VS= 15.0 V, VOUT= 0 V”. Sheet 8: Table I, Settling time test, tS, delete subgroup “9” and substitute subgroup “4”. Table I, Overshoot test, OS, delete subgroup “9” and substitute subgroup “4”. Rise time test, tR, delete subgroups “9, 10, 11” and substitute subgroups “4, 5, 6
3、”. Fall time test, tF, delete subgroups “9, 10, 11” and substitute subgroups “4, 5, 6”. Delete footnote “1/” and substitute “1/ Unless otherwise specified, for dc tests, source resistance (RS) 100 k, and VOUT= 0 V”. Sheet 11: Table IIA, group A test requirements, delete “9, 10, 11 (five times). Grou
4、p B endpoint electrical parameters, delete “9, 10, 11” (two times). Changes in accordance with N.O.R. 5962-R077-93. 93-04-04 M. A. FRYE B Sheet 7: Table I. Slew rate test. Under the “Test” column, delete footnote “7/” entirely. With the symbol of “SR-“ and the condition of “VS= 15 V”, delete the gro
5、up A subgroup 4 value of “200 V/s” and substitute “180 V/s”. Full power bandwidth test. Under the “Test column, footnote “8/” will be renumbered as footnote “7/”. Sheet 8: Table I. Delete footnote “7/” entirely. Rise time test. Under the “Test” column, footnote “9/” will be renumbered as footnote “8
6、/”. Fall time test. Under the “Test” column, footnote “9/” will be renumbered as footnote “8/”. Footnote “8/” will be renumbered as footnote “7/”. Footnote “9/” will be renumbered as footnote “8/”. Changes in accordance with N.O.R. 5962-R194-94. 94-05-25 M. A. FRYE C Drawing updated to reflect curre
7、nt requirements. - ro 01-09-10 R. MONNIN D Drawing updated as part of 5 year review. -rrp 07-04-18 ROBERT M. HEBER E Drawing updated to reflect current MIL-PRF-38535 requirements. - ro 13-09-12 C. SAFFLE REV SHEET REV SHEET REV STATUS REV E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10
8、11 12 PMIC N/A PREPARED BY RICK C. OFFICER DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY CHARLES E. BESORE APPROVED BY MICHAEL A
9、. FRYE MICROCIRCUIT, LINEAR, HIGH SPEED, LOW POWER, DUAL OPERATIONAL AMPLIFIER, MONOLITHIC SILICON DRAWING APPROVAL DATE 92-06-16 AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 67268 5962-92117 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E402-13 Provided by IHSNot for ResaleNo reproduction or networking pe
10、rmitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92117 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device cla
11、ss Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the
12、following example: 5962 - 92117 01 M P A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the
13、MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device
14、 type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 AD827 High speed, low power, dual operational amplifier 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Dev
15、ice requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designa
16、ted in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendi
17、x A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92117 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Su
18、pply voltage (VS) . 18 V dc Input common mode voltage range (VCM) . VSDifferential input voltage 6.0 V dc Internal power dissipation (PD): Case P . 1.3 W 2/ Case 2 1.0 W 2/ Storage temperature range -65C to +150C Lead temperature (soldering, 60 seconds) +300C Junction temperature (TJ) +175C Thermal
19、resistance, junction-to-case (JC) . See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA) . 110C/W 1.4 Recommended operating conditions. Supply voltage range (VS) . 4.5 V dc to 15 V dc Ambient operating temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specificati
20、on, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535
21、 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawi
22、ngs. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between
23、 the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damag
24、e to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Maximum internal power dissipation is specified so that the junction temperature does not exceed +175C. For case P, derate 9 mW/C for TA +32C and for case 2, derate at 6.6 mW/C for TA +25C. P
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