DLA SMD-5962-90888-1993 MICROCIRCUIT DIGITAL CMOS MANCHESTER ENCODER-DECODER MONOLITHIC SILICON《硅单块 曼彻斯特编码和解码器 互补金属氧化物半导体数字微型电路》.pdf

《DLA SMD-5962-90888-1993 MICROCIRCUIT DIGITAL CMOS MANCHESTER ENCODER-DECODER MONOLITHIC SILICON《硅单块 曼彻斯特编码和解码器 互补金属氧化物半导体数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-90888-1993 MICROCIRCUIT DIGITAL CMOS MANCHESTER ENCODER-DECODER MONOLITHIC SILICON《硅单块 曼彻斯特编码和解码器 互补金属氧化物半导体数字微型电路》.pdf（20页珍藏版）》请在麦多课文档分享上搜索。

1、REVISIONSLTR DESCRIPTIONDATE (YR-MO-DA)APPROVEDREV SHEETREV SHEETREVSHEET 15 16 17 18 19REV STATUSOF SHEETSREVSHEET 123456789101121314PMIC N/APREPARED BY Thomas M. Hess DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 STANDARDIZEDMILITARYDRAWINGTHIS DRAWING IS AVAILABLEFOR USE BY ALLDEPARTMENTSA

2、ND AGENCIES OF THEDEPARTMENT OF DEFENSEAMSC N/A CHECKED BY Thomas M. HessMICROCIRCUIT, DIGITAL, CMOS,MANCHESTER ENCODER-DECODER,MONOLITHIC SILICONAPPROVED BY Monica L. PoelkingDRAWING APPROVAL DATE 93-05-21 SIZEACAGE CODE672685962-90888REVISION LEVELSHEET 1 OF 19DESC FORM 193JUL 91 5962-E285-93DISTR

3、IBUTION STATEMENT A. Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDIZEDMILITARY DRAWINGDEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444SIZEA5962-90888REVISION LEVEL SHEET2DESC FORM 1

4、93AJUL 911. SCOPE1.1 Scope. This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Twoproduct assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (deviceclasses S and V), and a choice of case outlines

5、and lead finishes are available and are reflected in the Part or IdentifyingNumber (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 ofMIL-STD-883, “Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices“. When available

6、, achoice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.1.2 PIN. The PIN shall be as shown in the following example:5962 - 90888 01 M R X G0DG0D G0DG0D G0DG0DG0DG0D G0DG0D G0DG0DG0D G0D G0D G0D G0D G0D Federal RHA Device Device Case Lead stock class designator type class outl

7、ine finishdesignator (see 1.2.1) (see 1.2.2) designator (See 1.2.4) (see 1.2.5) / (see 1.2.3)/ Drawing number 1.2.1 RHA designator. Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levelsand shall be marked with the appropriate RHA designator. Device classes Q a

8、nd V RHA marked devices shall meet theMIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHAdevice.1.2.2 Device type(s). The device type(s) shall identify the circuit function as follows:Device type Generic number Circuit function01 6

9、409 Manchester encoder-decoder1.2.3 Device class designator. The device class designator shall be a single letter identifying the product assurance levelas follows:Device class Device requirements documentationM Vendor self-certification to the requirements for non-JAN class B microcircuitsin accord

10、ance with 1.2.1 of MIL-STD-883B or S Certification and qualification to MIL-M-38510Q or V Certification and qualification to MIL-I-385351.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:Outline letter Descriptive designator Terminals Package styleR GDIP

11、1-T20 or CDIP2-T20 20 Dual-in-line package 2 CQCC1-N20 20 Square leadless chip carrier1.2.5 Lead finish. The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classesQ and V. Finish letter “X“ shall not be marked on the microcircuit or its packaging. The “X“

12、 designation is for use inspecifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDIZEDMILITARY DRAWINGDEFENSE ELECTRONICS SUPPLY CENTERDAYT

13、ON, OHIO 45444SIZEA5962-90888REVISION LEVEL SHEET3DESC FORM 193AJUL 911.3 Absolute maximum ratings. 1/Supply voltage . +7.0 VInput, Output or I/O voltage range applied GND - 0.5 V to V + 0.5 VCCStorage temperature range . -65G28C to +150G28CJunction temperature +175G28CLead temperature (soldering 10

14、 sec) +300G28CPower dissipationCase R 602 mWCase 2. 595 mWThermal resistance, Junction-to-case See MIL-STD-18351.4 Recommended operating conditions.Operating temperature range -55G28C to +125G28CSupply voltage range 4.5 V G06 V G06 5.5 VCCInput rise and fall times 50 ns max1.5 Digital logic testing

15、for device classes Q and V. Fault coverage measurement of manufacturinglogic tests (MIL-STD-883, test method 5012) 2/ percent 2. APPLICABLE DOCUMENTS2.1 Government specifications, standards, bulletin, and handbook. Unless otherwise specified, the following specifications,standards, bulletin, and han

16、dbook of the issue listed in that issue of the Department of Defense Index of Specifications andStandards specified in the solicitation, form a part of this drawing to the extent specified herein.SPECIFICATIONSMILITARYMIL-M-38510 - Microcircuits, General Specification for.MIL-I-38535 - Integrated Ci

17、rcuits, Manufacturing, General Specification for.STANDARDSMILITARYMIL-STD-480 - Configuration Control-Engineering Changes, Deviations and Waivers.MIL-STD-883 - Test Methods and Procedures for Microelectronics.MIL-STD-1835 - Microcircuit Case Outlines.BULLETINMILITARYMIL-BUL-103 - List of Standardize

18、d Military Drawings (SMDs).HANDBOOKMILITARYMIL-HDBK-780 - Standardized Military Drawings.(Copies of the specifications, standards, bulletin, and handbook required by manufacturers in connection with specificacquisition functions should be obtained from the contracting activity or as directed by the

19、contracting activity.)1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at themaximum levels may degrade performance and affect reliability.2/ Values will be added when they become available.Provided by IHSNot for ResaleNo reproduction or netw

20、orking permitted without license from IHS-,-,-STANDARDIZEDMILITARY DRAWINGDEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444SIZEA5962-90888REVISION LEVEL SHEET4DESC FORM 193AJUL 912.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, t

21、he textof this drawing shall take precedence.3. REQUIREMENTS3.1 Item requirements. The individual item requirements for device class M shall be in accordance with 1.2.1 ofMIL-STD-883, “Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices“ and as specified herein. The i

22、ndividual item requirements for device classes B and S shall be in accordance with MIL-M-38510 and as specified herein. For device classes B and S, a full electrical characterization table for each device type shall be included in this SMD. Theindividual item requirements for device classes Q and V

23、shall be in accordance with MIL-I-38535, the device manufacturersQuality Management (QM) plan, and as specified herein.3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specifiedin MIL-M-38510 for device classes M, B, and S and MIL-I-385

24、35 for device classes Q and V and herein.3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein.3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.3.2.3 Block diagram. The block diagram shall be as specified on figure 2.3.2.4 Radiation

25、 exposure circuit. The radiation exposure circuit shall be specified when available.3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, theelectrical performance characteristics and postirradiation parameter limits are as specified in t

26、able I and shall apply over thefull case operating temperature range.3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electricaltests for each subgroup are defined in table I.3.5 Marking. The part shall be marked with the PIN listed

27、 in 1.2 herein. Marking for device class M shall be in accordancewith MIL-STD-883 (see 3.1 herein). In addition, the manufacturers PIN may also be marked as listed in MIL-BUL-103. Marking for device classes B and S shall be in accordance with MIL-M-38510. Marking for device classes Q and V shall be

28、inaccordance with MIL-I-38535.3.5.1 Certification/compliance mark. The compliance mark for device class M shall be a “C“ as required in MIL-STD-883(see 3.1 herein). The certification mark for device classes B and S shall be a “J“ or “JAN“ as required in MIL-M-38510. Thecertification mark for device

29、classes Q and V shall be a “QML“ as required in MIL-I-38535.3.6 Certificate of compliance. For device class M, a certificate of compliance shall be required from a manufacturer in orderto be listed as an approved source of supply in MIL-BUL-103 (see 6.7.3 herein). For device classes Q and V, a certi

30、ficate ofcompliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing(see 6.7.2 herein). The certificate of compliance submitted to DESC-EC prior to listing as an approved source of supply forthis drawing shall affirm that the manufacturers

31、 product meets, for device class M, the requirements of MIL-STD-883 (see 3.1herein), or for device classes Q and V, the requirements of MIL-I-38535 and the requirements herein.3.7 Certificate of conformance. A certificate of conformance as required for device class M in MIL-STD-883 (see 3.1 herein)o

32、r device classes B and S in MIL-M-38510 or for device classes Q and V in MIL-I-38535 shall be provided with each lot ofmicrocircuits delivered to this drawing.3.8 Notification of change for device class M. For device class M, notification to DESC-EC of change of product (see 6.2herein) involving dev

33、ices acquired to this drawing is required for any change as defined in MIL-STD-480.3.9 Verification and review for device class M. For device class M, DESC, DESCs agent, and the acquiring activity retainthe option to review the manufacturers facility and applicable required documentation. Offshore d

34、ocumentation shall be madeavailable onshore at the option of the reviewer.3.10 Microcircuit group assignment for device classes M, B, and S. Device classes M, B, and S devices covered by thisdrawing shall be in microcircuit group number 105 (see MIL-M-38510, appendix E).3.11 Serialization for device

35、 class S. All device class S devices shall be serialized in accordance with MIL-M-38510.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDIZEDMILITARY DRAWINGDEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444SIZEA5962-90888REVISION LEVEL SHEET

36、5DESC FORM 193AJUL 91TABLE I. Electrical performance characteristics. G0DG0D G0D G0DG0D G0DTest G0D Symbol G0D Conditions 1/ G0D Group A G0DDevice G0D Limits G0D UnitG0DG0D -55G28C G06 T G06 +125G28C G0D subgroups G0D type G0D G0D CG0DG0D unless otherwise specified G0DG0D G0DG0DG0D G0DG0D G0DG0DG0D

37、Min G0D Max G0D G0DG0D G0D G0DG0DG0DG0DG0DG0D G0D G0DG0DG0DG0D Input high voltage G0D V G0DV = 4.5 V G0D 1, 2, 3 G0D All G0D.7 V G0DG0D V IH CC CCG0DG0D G0D G0DG0DG0DG0D G0DG0D G0D G0DG0DG0DG0DG0DG0D G0D G0DG0DG0DG0D Input low voltage G0D V G0DV = 4.5 V G0D 1, 2, 3 G0D All G0DG0D .2 V G0D V IL CC CC

38、G0DG0D G0D G0DG0DG0DG0D G0DG0D G0D G0DG0DG0DG0DG0DG0D G0D G0DG0DG0DG0D Input high voltage RG09eG09sG09eG09 tG09 G0D V G0DV = 5.5 V G0D 1, 2, 3 G0D All G0DV-G0DG0D V IHR CC CCG0DG0D G0D G0DG0D 0.5 G0DG0D G0DG0D G0D G0DG0DG0DG0DG0DG0D G0D G0DG0DG0DG0D Input low voltage RG09eG09sG09eG09 tG09 G0D V G0DV

39、 = 4.5 V G0D 1, 2, 3 G0D All G0DG0DGND G0D V ILR CCG0DG0D G0D G0DG0DG0D +0.5 G0D G0DG0D G0D G0DG0DG0DG0DG0DG0D G0D G0DG0DG0DG0D Input high voltage Clock G0D V G0DV = 5.5 V G0D 1, 2, 3 G0D All G0DV G0DG0D V IHC CC CCG0DG0D G0D G0DG0D -0.5 G0DG0D G0DG0D G0D G0DG0DG0DG0DG0DG0D G0D G0DG0DG0DG0D Input lo

40、w voltage Clock G0D V G0DV = 4.5 V G0D 1, 2, 3 G0D All G0DG0D GND G0D V ILC CCG0DG0D G0D G0DG0DG0D +0.5 G0D G0DG0D G0D G0DG0DG0DG0DG0DG0D G0D G0DG0DG0DG0D Input leakage current G0D I G0DV = V or GND G0D 1, 2, 3 G0D All G0D -1.0 G0D 1.0 G0D G29A IINC(except I ) G0DG0DV = 5.5 V G0DG0DG0DG0DG0D XCG0DG0

41、D G0D G0DG0DG0DG0DG0DG0DV = V or GND G0DG0DG0DG0DG0D IN CCInput leakage current G0D I G0DV = 5.5 V G0D 1, 2, 3 G0D All G0D -20 G0D 20 G0D G29A ICC(I ) G0DG0D G0D G0DG0DG0DG0D XG0DG0D G0D G0DG0DG0DG0DG0DG0D G0D G0DG0DG0DG0D I/O leakage current G0D I G0DV = V or GND G0D 1, 2, 3 G0D All G0D -10 G0D 10

42、G0D G29A O OUT CCG0DG0DV = 5.5 V G0DG0DG0DG0DG0D CCG0DG0D G0D G0DG0DG0DG0DG0DG0DI = -2.0 mA G0DG0DG0DG0DG0DOHOutput high voltage G0D V G0DV = 4.5 V G0D 1, 2, 3 G0D All G0DV G0DG0D VOH CC CC(All except O ) G0DG0D2/ G0DG0DG0D -0.4 G0DG0DXG0DG0D G0D G0DG0DG0DG0DG0DG0D G0D G0DG0DG0DG0D Output low voltag

43、e G0D V G0DI = 2.0 mA G0D 1, 2, 3 G0D All G0DG0D 0.4 G0D V OL OH(All except O ) G0D G0DV = 4.5 V 2/ G0DG0DG0DG0DG0D XCCG0DG0D G0D G0DG0DG0DG0DG0DG0DV = V or GND G0DG0DG0DG0DG0D OUT CCStandby power supply G0D I G0DV = 5.5 V G0D 1, 2, 3 G0D All G0DG0D 100 G0D G29A CCSB CCcurrent G0DG0DOutputs open G0D

44、G0DG0DG0DG0D G0DG0D G0D G0DG0DG0DG0DG0DG0Df = 16 MHz G0DG0DG0DG0DG0DOperating power supply G0D I G0DV = V or GD G0D 1, 2, 3 G0D All G0DG0D 18 G0D mACCOP IN CCcurrent G0DG0DV = 5.5 V, C = 50 pF G0DG0DG0DG0DG0DCC LG0DG0D G0D G0DG0DG0DG0DSee footnotes at end of table.Provided by IHSNot for ResaleNo rep

45、roduction or networking permitted without license from IHS-,-,-STANDARDIZEDMILITARY DRAWINGDEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444SIZEA5962-90888REVISION LEVEL SHEET6DESC FORM 193AJUL 91TABLE I. Electrical performance characteristics - Continued. G0DG0D G0D G0DG0D G0DTest G0D Symbol G0D

46、Conditions 1/ G0D Group A G0DDevice G0D Limits G0D UnitG0DG0D -55G28C G06 T G06 +125G28C G0D subgroups G0D type G0D G0D CG0DG0D unless otherwise specified G0DG0D G0DG0DG0D G0DG0D G0DG0DG0D Min G0D Max G0D G0DG0D G0D G0DG0DG0DG0DG0DG0DV = Open G0DG0DG0DG0DG0D CCInput capacitance G0D C G0Df = 1 MHz G0

47、D 4 G0D All G0DG0D 10 G0D pF ING0DG0DSee 4.4.1.c G0DG0DG0DG0DG0D G0DG0DT = +25G28 C G0DG0DG0DG0DG0DAG0DG0D G0D G0DG0DG0DG0D I/O capacitance G0D C G0DG0D 4 G0D All G0DG0D 12 G0D pF I/OG0DG0D G0D G0DG0DG0DG0D G0DG0D G0D G0DG0DG0DG0DG0DG0D G0D G0DG0DG0DG0D Functional test G0DG0DV = 4.5 V G0D 7, 8 G0D All G0DG0DG0D CCG0DG0DSee 4.4.1.b G0DG0DG0DG0DG0D G0DG0D G0D G0DG0DG0DG0DG0DG0D G0D G0DG0DG0DG0D Output rise time G0D t G0DFrom 1.0 to 3.5 V G0D 9, 10, 11 G0D All G0DG0D 50 G0D ns r(all except clock) G0DG0DC = 50 pF 3/ G0DG0DG0DG0DG0D LG0DG0D G0D G0DG0DG0DG0DG0DG0D G0D G0DG0DG0DG0D Output fall time