DLA SMD-5962-89777 REV C-2007 MICROCIRCUIT LINEAR CMOS 8-BIT A D FLASH CONVERTER MONOLITHIC SILICON《硅单片 8位交流 直流动画文件转变器 氧化物半导体线性微型电路》.pdf
《DLA SMD-5962-89777 REV C-2007 MICROCIRCUIT LINEAR CMOS 8-BIT A D FLASH CONVERTER MONOLITHIC SILICON《硅单片 8位交流 直流动画文件转变器 氧化物半导体线性微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-89777 REV C-2007 MICROCIRCUIT LINEAR CMOS 8-BIT A D FLASH CONVERTER MONOLITHIC SILICON《硅单片 8位交流 直流动画文件转变器 氧化物半导体线性微型电路》.pdf(14页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device types 03 and 04. Make changes to table I, figures 1, 2, 3, and 4. Editorial changes throughout. 92-03-20 M. A. Frye B Add device types 05 and 06. Add case outline “L”. Make changes to table I, figures 1, 2, 3, and 4. Editorial changes
2、throughout. 93-04-19 M. A. Frye C Update drawing to current requirements. Editorial changes throughout. drw 07-04-09 Robert M. Heber THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PM
3、IC N/A PREPARED BY Rick Officer DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles E. Besore COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, LINEAR, CMOS, 8-BIT A/D AND AGENCI
4、ES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 90-04-05 FLASH, CONVERTER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-89777 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E307-07 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from I
5、HS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89777 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance w
6、ith MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89777 01 L A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device types. The device types identify the circuit function as fol
7、lows: Device type Generic number Circuit function Maximum sampling frequency 01 MP7684T CMOS 8-bit A/D flash converter 10 MHz 02 MP7684S CMOS 8-bit A/D flash converter 10 MHz 03 MP7684AT CMOS 8-bit A/D flash converter 20 MHz 04 MP7684AS CMOS 8-bit A/D flash converter 20 MHz 05 MP7690AT CMOS 8-bit A/
8、D flash converter 20 MHz 06 MP7690AS CMOS 8-bit A/D flash converter 20 MHz 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 as follows: Outline letter Descriptive designator Terminals Package style L GDIP3-T24 or CDIP4-T24 24 Dual-in-line X GDIP1-T28 or CDIP2-T28 28 Dual-in-l
9、ine 3 CQCC1-N28 28 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Operating supply voltage (VDD) to GND . +6.5 V Positive reference voltage range (+VREF). VDDto GND Negative reference voltage range (-VREF) V
10、DDto GND Input voltage range (VIN) VDDto GND Digital inputs range VDDto GND Digital outputs range VDDto GND Power dissipation (PD) up to +50C . 1000 mW Lead temperature (soldering, 10 seconds) +300C Storage temperature range -65C to +150C Thermal resistance, junction-to-case (JC). See MIL-STD-1835 T
11、hermal resistance, junction-to-ambient (JA) +120C/W 1.4 Recommended operating conditions. Digital circuit supply voltage range (DVDD). +3 V dc to +5 V dc Analog circuit supply voltage range (AVDD) +3 V dc to +5 V dc Positive reference voltage range (+VREF). AVDD 0.5 V dc Negative reference voltage (
12、-VREF) +0 V dc Sample frequency (fS): Device types 01 and 02 10 MHz (50 percent duty cycle) Device types 03, 04, 05 and 06 14 MHz (50 percent duty cycle) Analog input range. -VREFto +VREFProvided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROC
13、IRCUIT DRAWING SIZE A 5962-89777 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing t
14、o the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - T
15、est Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assi
16、st.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
17、this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class
18、level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with
19、 the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. Th
20、ese modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be a
21、s specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Bl
22、ock diagrams. The logic diagrams shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical
23、test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. I
24、n addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be m
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