DLA SMD-5962-85063 REV C-2005 MICROCIRCUIT MICROPROCESSOR DIGITAL N-CHANNEL 16-BIT MICROCONTROLLER MONOLITHIC SILICON《硅单片14级二进计数器 高速氧化物半导体数字微型电路》.pdf
《DLA SMD-5962-85063 REV C-2005 MICROCIRCUIT MICROPROCESSOR DIGITAL N-CHANNEL 16-BIT MICROCONTROLLER MONOLITHIC SILICON《硅单片14级二进计数器 高速氧化物半导体数字微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-85063 REV C-2005 MICROCIRCUIT MICROPROCESSOR DIGITAL N-CHANNEL 16-BIT MICROCONTROLLER MONOLITHIC SILICON《硅单片14级二进计数器 高速氧化物半导体数字微型电路》.pdf(16页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add case outline Y. Change to military drawing format. Change AC parameters tAVDV, tRLDV, tLHLL, tAVLL. Change drawing CAGE to 67268. Editorial changes throughout. 87-10-23 Michael A. Frye B Modify paragraphs 3.1 and 3.5.1 to allow product to be
2、marked with “QD” certification mark. Change CSlimit in table I. Add subgroup test option for groups C and D test requirements in table II. Update boilerplate. TVN 00-10-19 Thomas M. Hess C Correct marking requirements in 3.5. Update boilerplate in accordance with MIL-PRF-38535 requirements. - PHN. 0
3、5-04-11 Thomas M. Hess THE ORIGINAL FIRST SHEET OF THIS SMD HAS BEEN REPLACED. REV SHET REV C SHET 15 REV STATUS REV C B C C B B B B B B B B B C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY James E. Jamison STANDARD MICROCIRCUIT DRAWING CHECKED BY Da Di Cenzo DEFENSE SUPPLY
4、CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 85-11-18 MICROCIRCUIT, MICROPROCESSOR, DIGITAL, N-CHANNEL, 16-BIT MICROCONTROLLER, MONOLIT
5、HIC SILICON SIZE A CAGE CODE 67268 85063 AMSC N/A REVISION LEVEL C SHEET 1 OF 15 DSCC FORM 2233 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-APR 97 5962-E179-05 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 complia
6、nt, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 85063 01 Y X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). T
7、he device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 8097 NMOS 16-bit microcontroller 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style Y See
8、 figure 1 68 Ceramic quad flatpack Z CMGA3-P68 68 Pin grid array package X 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage +7 V dc maximum Operating voltage range. -0.3 V dc to +7.0 V Voltage from any pin to VSSor ANGND -0
9、.3 V dc to +7.0 V dc Average output current (any pin) 10 mA maximum Maximum power dissipation (PD) 1.5 W Case temperature under bias. -55C to +125C 1/ Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds). +300C Thermal resistance, junction-to-case (JC): Case Y 5C/W Case Z
10、 See MIL-STD-1835 Maximum junction temperature (TJ) . +200C _ 1/ Case temperature is “instant on”. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85063 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REV
11、ISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Digital supply voltage range (VCC) 4.5 V dc VCC 5.5 V dc Analog supply voltage range (VREF) 4.5 VCC 0.3 V VREF 5.5 VCC+ 0.3 V Power down supply voltage (VPD). 4.5 V VPD 5.5 V Oscillator frequency (fOSC) 6.0 MHz VCC 12
12、MHz Resolution 0.001 VREF1/ 2/ Accuracy 0.004 VREF1/ Differential nonlinearity. 0.002 VREFmaximum 1/ 2/ Integral nonlinearity 0.004 VREFmaximum 1/ 2/ Channel-to-channel matching 1 LSB 3/ Crosstalk (dc to 100 kHz). -60 dB maximum 3/ Case temperature under bias (TC) . -55C to +125C 4/ 2. APPLICABLE DO
13、CUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF D
14、EFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - L
15、ist of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia,
16、 PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtaine
17、d. _ 1/ Testing is done at VREF= 5.120 V 2/ Guaranteed but not tested. 3/ Not tested or guaranteed. 4/ Case temperature is “instant on” Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85063 DEFENSE SUPPLY CENTER C
18、OLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that
19、 is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval i
20、n accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “Q
21、ML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. This drawing has been modified to allow the manufacturer to use the alternate die/fabrication requirements of paragraph A.3.2.2 of MIL-PRF-38535 or other alternative approved by the qual
22、ifying activity. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The te
23、rminal connections shall be as specified on figure . 3.2.3 Truth table(s). The truth table(s) shall be as specified on figure . 3.2.4 Logic diagram(s). The logic diagram(s) shall be as specified on figure . 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical
24、 performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3
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