DLA SMD-5962-85016 REV D-2007 MICROCIRCUIT DIGITAL CMOS PROGRAMMABLE INTERRUPT CONTROLLER MONOLITHIC SILICON《硅单片14级二进计数器 高速氧化物半导体数字微型电路》.pdf
《DLA SMD-5962-85016 REV D-2007 MICROCIRCUIT DIGITAL CMOS PROGRAMMABLE INTERRUPT CONTROLLER MONOLITHIC SILICON《硅单片14级二进计数器 高速氧化物半导体数字微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-85016 REV D-2007 MICROCIRCUIT DIGITAL CMOS PROGRAMMABLE INTERRUPT CONTROLLER MONOLITHIC SILICON《硅单片14级二进计数器 高速氧化物半导体数字微型电路》.pdf(16页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Revise table I limits. Revise figure 3 waveforms. Make editorial changes. 87-03-16 N. A. Hauck B Updated boilerplate and added Intersil as source of supply CAGE code 34371. - LTG 00-08-09 Monica L. Poelking C Update boilerplate to MIL-PRF-38535 r
2、equirements. - LTG 01-06-05 Thomas M. Hess D Update boilerplate to current MIL-PRF-38535 requirements. - CFS 07-07-06 Thomas M. Hess REV SHET REV D SHET 15 REV STATUS REV D D D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Greg A. Pitz DEFENSE SUPPLY CEN
3、TER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck MICROCIRCUIT, DIGITAL, CMOS, PROGRAMMABLE INTERRUPT CONTROLLER, AND AGENCIES OF THE DEPARTMENT OF DEFENSE
4、DRAWING APPROVAL DATE 86-06-18 MONOLITHIC SILICON AMSC N/A REVISION LEVEL SIZE A CAGE CODE 67268 5962-85016 D SHEET 1 OF 15 DSCC FORM 2233 APR 97 5962-E509-07 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-8
5、5016 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identif
6、ying Number (PIN). The complete PIN is as shown in the following example: 5962-85016 01 Y X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Frequency Cir
7、cuit function 01 82C59A-5 5 MHz CMOS programmable interrupt controller 02 82C59A 8 MHz CMOS programmable interrupt controller 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style Y GDIP1-T28 or CDIP
8、2-T28 28 Dual-in-line 3 CQCC1-N28 28 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage (referenced to ground) +8.0 V dc 1/ Input, output, or I/O voltage applied GND -0.5 V dc to VCC+0.5 V dc Stor
9、age temperature range (TSTG) . -65C to +150C Maximum power dissipation (PD) . 1 W Lead temperature (soldering, 10 seconds) +275C Maximum junction temperature (TJ) +150C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Temperature under bias -55C to +125C 1.4 Recommended operating condition
10、s. Supply voltage range (VCC) . +4.5 V dc to +5.5 V dc 1/ Case operating temperature range (TC) -55C TC +125C Frequency of operation: Device type 01 . 5 MHz Device type 02 . 8 MHz Data float after RD/INTA (tRHDZ) reference number 14: 2/ Device type 01 . 10 ns minimum, 100 ns maximum Device type 02 .
11、 10 ns minimum, 85 ns maximum _ 1/ All voltages are referenced to VSS. 2/ The reference number refers to the parameter being measured on figure 3. The parameter being measured uses test condition 2 on figure 4. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from
12、 IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-85016 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form
13、a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE S
14、TANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are availa
15、ble online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references ci
16、ted herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appen
17、dix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML pr
18、oduct in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or fu
19、nction of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physic
20、al dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Functional block diagram. The functional block d
21、iagram shall be as specified on figure 2. 3.2.4 Switching waveforms. The switching waveforms shall be as specified on figure 3. 3.2.5 AC test circuit and waveform. The AC test circuit and waveform shall be as specified on figure 4. 3.3 Electrical performance characteristics. Unless otherwise specifi
22、ed herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup ar
23、e described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-85016 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall
24、 be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of no
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