DLA SMD-5962-01506 REV A-2002 MICROCIRCUIT HYBRID DIGITAL-LINEAR 14-BIT DUAL CHANNEL ANALOG TO DIGITAL CONVERTER《混合数字线性的微电路14位双通道类比数位转换器》.pdf

《DLA SMD-5962-01506 REV A-2002 MICROCIRCUIT HYBRID DIGITAL-LINEAR 14-BIT DUAL CHANNEL ANALOG TO DIGITAL CONVERTER《混合数字线性的微电路14位双通道类比数位转换器》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-01506 REV A-2002 MICROCIRCUIT HYBRID DIGITAL-LINEAR 14-BIT DUAL CHANNEL ANALOG TO DIGITAL CONVERTER《混合数字线性的微电路14位双通道类比数位转换器》.pdf（11页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Table I, change limits for SFDR, subgroups 4, 5, and 6 at 21 MHz, SINAD, subgroups 4, 5, and 6 at 21 MHz, and IMD, subgroups 4, 5, and 6. 02-04-10 Raymond Monnin REV SHEET REV SHEET REV STATUS REV A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7

2、 8 9 10 PMIC N/A PREPARED BY Gary Zahn DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Michael C. Jones POST OFFICE BOX 3990 COLUMBUS, OHIO 43216-5000 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Raymond Monnin MICROCIRCUIT, HYBRID,

3、DIGITAL-LINEAR, 14-BIT, DUAL CHANNEL, ANALOG TO DIGITAL CONVERTER AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 01-05-21 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-01506 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E331-02 DISTRIBUTION STATEMENT A. Approved for public releas

4、e; distribution is unlimited. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-01506 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope.

5、This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflec

6、ted in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 - 01506 01 H X X Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 Radiation

7、 hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Ge

8、neric number Circuit function 01 AD13465BZ Dual channel, 14-bit, 65 MSPS, MCM, analog to digital converter 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and req

9、uire QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level is intended for use in space applications. H Standard milit

10、ary quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limited temperature range,

11、 manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C, and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exce

12、ption(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML

13、 certified flow. This product may have a limited temperature range. 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 68 Leaded ceramic chip carrier 1.2.5 Lead finish. The lead fin

14、ish shall be as specified in MIL-PRF-38534. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-01506 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Ab

15、solute maximum ratings. 1/ Analog positive supply voltage (AVCC). 0 V dc to +7.0 V dc Digital positive supply voltage (DVCC) 0 V dc to +7.0 V dc Analog negative supply voltage (AVEE) . 0 V dc to -7.0 V dc Analog input voltage -7.0 V dc to +7.0 V dc Analog input current -10 mA to +10 mA Digital input

16、 voltage (ENCODE) 0 V dc to +7.0 V dc ENCODE, ENCODE differential voltage. 4 V dc Digital output current . -10 mA to +10 mA Gain and offset adjust voltage range. AVEEto AVCCDigital input voltage range. +0.5 V to AVEEPower dissipation (PD). 3.9 W Thermal resistance junction-to-case (JC) . 2.22C/W The

17、rmal resistance junction-to-ambient (JA) 24.3C/W Junction temperature (TJ) +175C Storage temperature . -65C to +150C Lead temperature (soldering, 10 seconds) +300C 1.4 Recommended operating conditions. Analog positive supply voltage (AVCC). +4.85 V dc to +5.25 V dc Digital positive supply voltage (D

18、VCC) +3.14 V dc to +3.47 V dc Analog negative supply voltage (AVEE) . -5.25 V dc to -4.75 V dc Case operating temperature range (TC) -40C to +85C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this

19、drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-3

20、8534 - Hybrid Microcircuits, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-H

21、DBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict

22、between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 1/ Stresses above the absolute maximum rating may cause permanent

23、damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-01506 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OH

24、IO 43216-5000 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests here

25、in or as designated in the device manufacturers Quality Management (QM) plan or as designated for the applicable device class. Therefore, the tests and inspections herein may not be performed for the applicable device class (see MIL-PRF-38534). Furthermore, the manufacturer may take exceptions or us

26、e alternate methods to the tests and inspections herein and not perform them. However, the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be

27、as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified h

28、erein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup a

29、re defined in table I. 3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers vendor similar PIN may also be marked. 3.6 Data. In addition to the general performance requir

30、ements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manual

31、ly tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DSCC-VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a

32、manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturers product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in

33、MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturers Quality Management (QM) plan.

34、 The modification in the QM plan shall not affect the form, fit, or function as described herein. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test

35、 circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the

36、intent specified in test method 1015 of MIL-STD-883. (2) TAas specified in accordance with table I of method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the d

37、iscretion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-01506 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical

38、 performance characteristics. Test Symbol Conditions 1/ -40C 10 pF will degrade performance. 6/ Input capacitance combines die and package capacitance. 7/ Maximum conversion rate allows for variation in ENCODE DUTY CYCLE of 50%, 5%. 8/ Analog input signal equals -1 dBFS; SFDR is the ratio of convert

39、er full scale to worst spur. 9/ Analog input signal power at -1 dBFS; signal-to-noise ratio (SNR) is the ratio of signal level to total noise (first 5 harmonics removed). ENCODE = 65 MSPS. SNR is reported in dBFS, related back to converter full scale. 10/ Analog input signal power at -1 dBFS; signal

40、-to-noise and distortion (SINAD) is the ratio of signal level to total noise plus harmonics. ENCODE = 65 MSPS. 11/ Two tone intermodulation distortion rejection is the ratio of the rms value of either input tone to the rms value of the worst third order intermodulation product; reported in dBFS. 12/

41、 Channel to channel isolation tested with A channel grounded and a full scale signal applied to B channel. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-01506 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 4

42、3216-5000 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 Case outline X. Millimeters Inches Symbol Min Max Min Max A 5.97 0.235 A1 4.45 0.175 A2 0.18 1.02 0.040 0.060 b 0.36 0.51 0.014 0.020 c 0.18 0.25 0.007 0.010 e 1.14 1.40 0.045 0.055 D/E 29.72 30.23 1.170 1.190 D1/E1 27.18 1.070 D2/E2 23.88 24.

43、38 0.940 0.960 D3/E3 20.32 BSC 0.800 BSC NOTES: 1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Pin 1 dot a

44、nd pin numbers are for reference only. FIGURE 1. Case outline(s). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-01506 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 8 DSCC F

45、ORM 2234 APR 97 Device type 01 Device type 01 Device type 01 Case outline X Case outline X Case outline X Terminal number Terminal symbol Terminal number Terminal symbol Terminal number Terminal symbol 1 Shield 24 D6A 47 D8B 2 Channel A analog ground 25 D7A 48 D9B 3 Channel A analog ground 26 Channe

46、l A digital ground 49 D10B 4 A-IN 27 Channel A digital ground 50 D11D 5 A+IN 28 D8A 51 D12B 6 AMP-OUT-A 29 D9A 52 D13B (MSB) 7 AMP-IN-A-1 30 D10A 53 DVCCChannel B 8 AMP-IN-A-2 31 D11A 54 Channel B analog ground 9 Channel A analog ground 32 D12A 55 ENCODE B 10 Channel A analog ground 33 D13A (MSB) 56

47、 ENCODE B 11 AVEEChannel A 34 Data Ready OUT A 57 Channel B analog ground 12 AVCCChannel A 35 Shield 58 AVCCChannel B 13 Channel A analog ground 36 Data Ready OUT B 59 AVEEChannel B 14 ENCODE A 37 D0B (LSB) 60 Channel B analog ground 15 ENCODE A 38 D1B 61 Channel B analog ground 16 Channel A analog

48、ground 39 D2B 62 AMP-IN-B-2 17 DVCCChannel A 40 D3B 63 AMP-IN-B-1 18 D0A (LSB) 41 D4B 64 AMP-OUT-B 19 D1A 42 D5B 65 B+IN 20 D2A 43 Channel B digital ground 66 B-IN 21 D3A 44 Channel B digital ground 67 Channel B analog ground 22 D4A 45 D6B 68 Channel B analog ground 23 D5A 46 D7B FIGURE 2. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-01506 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 R