ASTM E801-2006(2011) 5000 Standard Practice for Controlling Quality of Radiological Examination of Electronic Devices《电子器件射线检测质量控制方法》.pdf
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1、Designation: E801 06 (Reapproved 2011)Standard Practice forControlling Quality of Radiological Examination ofElectronic Devices1This standard is issued under the fixed designation E801; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revisio
2、n, the year of last revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.This standard has been approved for use by agencies of the Department of Defense.1. Scope1.1 This practice relates
3、to the radiological examination ofelectronic devices for internal discontinuities, extraneous ma-terial, missing components, crimped or broken wires, anddefective solder joints in cavities, in the encapsulating materi-als, or the boards. Requirements expressed in this practice areintended to control
4、 the quality and repeatability of the radio-logical images and are not intended for controlling the accept-ability or quality of the electronic devices imaged.NOTE 1Refer to the following publications for pertinent informationon methodology and safety and protection: Guides E94 and E1000, and“Genera
5、l Safety Standard for Installation Using Non-Medical X Ray andSealed Gamma Ray Sources, Energies Up to 10 MeV Equipment Designand Use,” Handbook No. 114.21.2 If a nondestructive testing agency as described inPractice E543 is used to perform the examination, the testingagency should meet the requirem
6、ents of Practice E543.1.3 This standard does not purport to address all of thesafety concerns, if any, associated with its use. It is theresponsibility of the user of this standard to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior
7、to use.2. Referenced Documents2.1 ASTM Standards:3E94 Guide for Radiographic ExaminationE543 Specification for Agencies Performing Nondestruc-tive TestingE1000 Guide for RadioscopyE1255 Practice for RadioscopyE1316 Terminology for Nondestructive Examinations3. Terminology3.1 DefinitionsRefer to Term
8、inology E1316, Section D.4. Direction of Radiation4.1 When not otherwise specified, the direction of thecentral beam of radiation shall be as perpendicular (65%)aspossible to the surface of the film or detector.5. Image Quality Indicators (IQIs)5.1 The quality of all levels of radiological examinati
9、onshall be determined by IQIs conforming to the followingspecifications:5.1.1 The IQIs shall be fabricated of clear acrylic plasticwith steel covers, lead spheres, gold or tungsten wires, and leadnumbers. The steel covers serve as shims.5.1.1.1 The IQIs shall conform to the requirements ofFig. 1.5.1
10、.1.2 The IQIs shall be permanently identified with theappropriate IQI number as shown in Fig. 1. The number shallbe affixed by mounting a 0.125-in. (3.18-mm) tall lead numberon the flat bottom of a 0.250-in. (6.35-mm) diameter hole. Theidentification number shall be located as shown in Fig. 1 andsha
11、ll be of sufficient contrast to be clearly discernible in theradiological image.5.1.1.3 Each semiconductor IQI will have a serial numberpermanently etched or engraved on it. Each serial number willbe traceable to the calibration image supplied by the manufac-turer. The manufacturer shall radiograph
12、the IQI with leadmarkers identifying the serial number. See Fig. 2.6. Application of the Image Quality Indicator (IQI)6.1 The application of the IQIs shall be made in such amanner as to simulate as closely as possible the device beingexamined. To accomplish this objective, a set of eight IQIs isprov
13、ided. These provide a range of cover thickness (of steelshim stock) that is radiologically equivalent to the range ofdevices from glass diodes or plastic-encapsulated circuits(number one) to large power or hybrid circuit devices (numbereight). Wire size increases with shim stock thickness because1Th
14、is practice is under the jurisdiction of ASTM Committee E07 on Nonde-structive Testing and is the direct responsibility of Subcommittee E07.01 onRadiology (X and Gamma) Method.Current edition approved Dec. 1, 2011. Published March 2012. Originallyapproved in 1981. Last previous edition approved in 2
15、006 as E801 - 06. DOI:10.1520/E0801-06R11.2Available from National Institute of Standards and Technology (NIST), 100Bureau Dr., Stop 1070, Gaithersburg, MD 20899-1070, http:/www.nist.gov.3For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at servicea
16、stm.org. For Annual Book of ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM website.1Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.higher power devices that have thicker coverings normally u
17、selarger interconnecting wires than small signal devices that usethin coverings. Particle size is normally independent of devicetype, so these remain constant.6.2 The IQI used shall be the one with a radiographicdensity or grey level nearest to that of the electronic devicebeing examined. The radiog
18、raphic density or grey level ismeasured on an area of the IQI image that contains no wire orFIG. 1 Image Quality Indicator for Electron DevicesDimensions, in. (mm)a. 0.187 ( 4.750) f. 1.00 (25.40) k. 1.125 (28.575)b. 0.375 ( 9.525) g. 0.375 ( 9.525) l. 1.313 (33.350)c. 0.500 (12.700) h. 0.500 (12.70
19、0) m. 1.50 (38.10)d. 0.625 (15.875) i. 0.625 (15.875) n. 0.125 ( 3.175)e. 0.813 (20.650) j. 0.938 (23.825) p. 0.250 ( 6.350)Particle Diameter, in. (mm)G. 0.015(0.381) J. 0.006(0.152)H. 0.010(0.254) K. 0.004(0.102)I. 0.008(0.203) L. 0.002(0.051)Shim and Wire SpecificationsIQINumberShimThickness, in.
20、(mm)Wire Diameters, in. (mm)ABCDEF1 0 0.002 0.001 0.0005 0.0005 0.001 0.0020 (0.051) (0.025) (0.0127) (0.0127) (0.025) (0051)2 0.002 0.002 0.001 0.0005 0.0005 0.001 0.002(0.051) (0.051) (0.025) (0.0127) (0.0127) (0.025) (0.051)3 0.005 0.002 0.001 0.0005 0.0005 0.001 0.002(0.127) (0.051) (0.025) (0.0
21、127) (0.0127) (0.025) (0.051)4 0.007 0.002 0.001 0.0005 0.0005 0.001 0.0020.178 (0.051) (0.025) (0.0127) (0.0127) (0.025) (0.051)5 0.010 0.003 0.002 0.001 0.001 0.002 0.003(0.254) (0.076) (0.051) (0.025) (0.025) (0.051) (0.076)6 0.015 0.003 0.002 0.001 0.001 0.002 0.003(0.381) (0.076) (0.051) (0.025
22、) (0.025) (0.051) (0.076)7 0.025 0.005 0.003 0.002 0.002 0.003 0.005(0.635) (0.127) (0.076) (0.051) (0.051) (0.076) (0.127)8 0.035 0.005 0.003 0.002 0.002 0.003 0.005(0.889) (0.127) (0.076) (0.051) (0.051) (0.076) (0.127)NOTE 1Use additional layers of shim material as required. The layers shall be 1
23、 by 1.625 in. (25.4 by 41.275 mm). The additional shim material shallbe identified by the placement of lead numbers which denote the thickness immediately adjacent to the IQI during exposure, or as an alternative,documented on the radiographic technique.NOTE 2Tolerance is 60.001 in. (0.025 mm) where
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