DLA SMD-5962-88698 REV D-2006 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED LOW POWER SCHOTTKY TTL SYNCHRONOUS 4-BIT UP DOWN COUNTER MONOLITHIC SILICON《硅单片同步4位向上 向下计数器双极化数字微电路》.pdf
《DLA SMD-5962-88698 REV D-2006 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED LOW POWER SCHOTTKY TTL SYNCHRONOUS 4-BIT UP DOWN COUNTER MONOLITHIC SILICON《硅单片同步4位向上 向下计数器双极化数字微电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-88698 REV D-2006 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED LOW POWER SCHOTTKY TTL SYNCHRONOUS 4-BIT UP DOWN COUNTER MONOLITHIC SILICON《硅单片同步4位向上 向下计数器双极化数字微电路》.pdf(11页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R345-92. - tvn 92-10-05 Monica Poelking B Changes in accordance with NOR 5962-R137-96. - les 96-06-05 Michael A. Frye C Add a new package outline letter F. - tdn 97-08-07 Raymond Monnin D Update to current requ
2、irements. Editorial changes throughout. - gap 06-06-05 Raymond Monnin REV SHET REV SHET REV STATUS REV D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Larry Gauder DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Raymond Monnin COLUMBUS, OHIO 4321
3、8-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Dan DiCenzo MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW POWER SCHOTTKY TTL, SYNCHRONOUS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 88-08-24 4-BIT UP/DOWN COUNTER, MONOLITHIC SILICON A
4、MSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-88698 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E337-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88698 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO
5、43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in
6、the following example: 5962-88698 01 E X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ALS193A Synchronous 4-bit up/down counters
7、 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E CDIP1-T16 or GDIP1-T16 16 Dual-in-line package F GDFP2-F16 or CDFP3-F16 16 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead fi
8、nish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range . -0.5 V dc minimum to +7.0 V dc maximum Input voltage range -1.5 V dc at -18 mA to +7.0 V dc Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds) +300C
9、Junction temperature (TJ) +175C Maximum power dissipation (PD) 1/ 121 mW Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 1.4 Recommended operating conditions. Supply voltage range (VCC) +4.5 V dc minimum to +5.5 V dc maximum Minimum high level input voltage (VIH) . +2.0 V dc Maximum low
10、 level input voltage (VIL): TC= +125C . +0.7 V dc TC= -55C . +0.8 V dc TC= +25C . +0.8 V dc High level output current (IOH) -0.4 mA Low level output current (IOL) . 4 mA Case operating temperature range (TC) . -55C to +125C Input setup time tsu: Data before LOAD . 25 ns minimum Clear inactive before
11、 UP or DOWN 20 ns minimum LOAD inactive before UP or DOWN . 20 ns minimum _ 1/ Maximum power dissipation is defined as VCCx ICC, and must withstand the added PDto short circuit test; e.g., IO. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD
12、MICROCIRCUIT DRAWING SIZE A 5962-88698 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions - Continued. Input hold time th: Data after LOAD . 5 ns minimum UP high after DOWN 5 ns minimum DOWN high after UP . 5 n
13、s minimum Input pulse width tw: CLR high . 10 ns minimum LOAD low . 25 ns minimum UP or DOWN, high or low . 30 ns minimum 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent sp
14、ecified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Stan
15、dard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil
16、;quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes pr
17、ecedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and a
18、s specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers ap
19、proved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications sha
20、ll not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE
21、 A 5962-88698 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline
22、(s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specifie
23、d herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are
24、 described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space l
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