DLA SMD-5962-95584 REV C-2008 MICROCIRCUIT DIGITAL BIPOLAR TTL SYNCHRONOUS 4-BIT UP DOWN COUNTERS MONOLITHIC SILICON《微电路 电片硅数字双极晶体管-晶体管逻辑(TTL)同步4位加 减计数器》.pdf

《DLA SMD-5962-95584 REV C-2008 MICROCIRCUIT DIGITAL BIPOLAR TTL SYNCHRONOUS 4-BIT UP DOWN COUNTERS MONOLITHIC SILICON《微电路 电片硅数字双极晶体管-晶体管逻辑(TTL)同步4位加 减计数器》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-95584 REV C-2008 MICROCIRCUIT DIGITAL BIPOLAR TTL SYNCHRONOUS 4-BIT UP DOWN COUNTERS MONOLITHIC SILICON《微电路 电片硅数字双极晶体管-晶体管逻辑(TTL)同步4位加 减计数器》.pdf（13页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R235-97. 97-03-07 Raymond Monnin B Drawing updated to reflect current criteria. Editorial changes throughout. - les 00-09-19 Raymond Monnin C Update drawing to current requirements. Editorial changes throughout

2、. - gap 08-04-01 Robert M. Heber REV SHET REV SHET REV STATUS REV C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Larry T. Gauder DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Thomas M. Hess COLUMBUS, OHIO 43218-3990 http:/www.dscc.dl

3、a.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking MICROCIRCUIT, DIGITAL, BIPOLAR, TTL, SYNCHRONOUS 4-BIT UP/DOWN COUNTERS, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 95-02-06 MONOLITHIC SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67

4、268 5962-95584 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E619-07 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95584 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FOR

5、M 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (P

6、IN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 95584 01 Q E X Federal stock class designator RHA designator (see 1.2.1) Devicetype (see 1.2.2)Deviceclass designatorCaseoutline (see 1.2

7、.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RH

8、A levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54192 Synchronous 4-bit up/down counters (dual clock with clear) 1.2.3

9、 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance wit

10、h MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 dual in-line-package F GDFP2-F16 or C

11、DFP3-F16 16 flat package 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZ

12、E A 5962-95584 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) -0.5 V dc to +7 V dc Input voltage range . 5.5 V Maximum power dissipation (PD) 489.5 mW 2/ Thermal resistance, junction-

13、to-case (JC) . See MIL-STD-1835 Thermal resistance, junction . 175C Storage temperature range (TSTG) . -65C to +150C Lead temperature, soldering 1.6 mm (1/16 inch) from case for 10 seconds +300C 1.4 Recommended operating conditions. Supply voltage range (VCC) +4.5 V dc min, +5.5 V dc max High level

14、input voltage, (VIH) . +2.0 V dc min Low level input voltage, (VIL) . +0.8 V dc max Operating free-air temperature (TA) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to t

15、he extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test

16、 Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.

17、daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this draw

18、ing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performanc

19、e and affect reliability. 2/ Maximum power dissipation is defined as VCCX ICC, and must withstand the added PDdue to short circuit test; e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95584 DEFENS

20、E SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufact

21、urers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.

22、2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance wi

23、th 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Logic diagram. The logic diagram shall be as specified on figure 2. 3.2.4 Test circuit and switching waveforms. The test circuit and switching waveforms shall be as specified on figure 3. 3

24、.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electr

25、ical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For pa

26、ckages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance

27、 with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as

28、 required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compli

29、ance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets,

30、 for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL

31、-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change th

32、at affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the optio

33、n of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 003 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDA

34、RD MICROCIRCUIT DRAWING SIZE A 5962-95584 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA+125C Group A subgroups Limits Unit unless otherwise specified Min Max High

35、-level output voltage VOHVCC= 4.5 V, VIH= 2.0 V, VIL= 0.8 V, IOH= -0.4 mA 1, 2, 3 2.4 V Low-level output voltage VOLVCC= 4.5 V, VIH= 2.0 V, IOL= 16 mA, VIL= 0.8 V 1, 2, 3 0.4 V Input clamp voltage VIKVCC= 4.5 V, IIN= -12 mA 1, 2, 3 -1.5 V High level input current IIH1VCC= 5.5 V, VIN= 5.5 V 1, 2, 3 1

36、 mA Low level input current IILVCC= 5.5 V, VIN= 0.4 V 1, 2, 3 -1.6 mA High level input current IIH2VCC= 5.5 V, VIN= 2.4 V 1, 2, 3 40 A Short-circuit output current IOSVCC= 5.5 V 1/ 1, 2, 3 -20 -65 mA Supply current (average per flip-flop) ICCVCC= 5.5 V 2/ 1, 2, 3 89 mA Functional test VCC= 4.5 V, 5.

37、5 V See 4.4.1b 7, 8 Maximum clock frequency 3/ fMAXVCC= 5.0 V, RL= 400 , 9 25 MHz tPLH 9 26 Propagation delay time, UP to CO tPHL CL= 15 pF 9 24 ns tPLH 9 24 Propagation delay time, DOWN to BO tPHL 9 24 ns tPLH 9 38 Propagation delay time, UP or DOWN to Q tPHL 9 47 ns tPLH 9 40 Propagation delay tim

38、e, LOAD to Q tPHL9 40 ns Propagation delay time, CLR to Q tPHL 9 35 ns Width of any input pulse tW 20 ns Data setup time tSU 9 20 ns Hold time, data, high or low th 0 ns 1/ Not more than 1 output should be shorted at a time. 2/ ICCis measured with all outputs open, clear and load inputs grounded and

39、 all other inputs at 4.5 V. 3/ fMAXfor QDoutput is guaranteed but not tested.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95584 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHE

40、ET 6 DSCC FORM 2234 APR 97 Device type 01 Case outlines E and F Terminal number Terminal symbol 1 B 2 QB 3 QA 4 DOWN5 UP 6 QC 7 QD 8 GND 9 D 10 C11 LOAD 12 CO 13 BO 14 CLR 15 A 16 VCC FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license

41、 from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95584 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 FIGURE 2. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MI

42、CROCIRCUIT DRAWING SIZE A 5962-95584 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 FIGURE 3. Test circuit and switching waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICR

43、OCIRCUIT DRAWING SIZE A 5962-95584 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 9 DSCC FORM 2234 APR 97 NOTES: 1. All pulse generators have the following characteristics: Z0 50 and for the data pulse generator PRR 500 kHz, duty cycle = 50%; for the load pulse gener

44、ator PRR is two times data PRR, duty cycle = 50%. 2. CLincludes probe and jig capacitance. 3. All diodes are 1N3064 or equivalent. 4. tr= 7 ns, tf= 7 ns. 5. Vref= 1.5 V. 6. RL= 400 . 7. CL= 15 pF. FIGURE 3. Test circuit and switching waveforms. - continued Provided by IHSNot for ResaleNo reproductio

45、n or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95584 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 10 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspec

46、tion procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accor

47、dance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5

48、004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in ac