DLA SMD-5962-87651 REV C-2006 MICROCIRCUIT MEMORY DIGITAL CMOS 1K X 8 PROGRAMMABLE READ ONLY MEMORY (PROM) MONOLITHIC SILICON《硅单块 互补金属氧化物半导体1K X8可编程序只读存储器 数字主存储器微型电路》.pdf

《DLA SMD-5962-87651 REV C-2006 MICROCIRCUIT MEMORY DIGITAL CMOS 1K X 8 PROGRAMMABLE READ ONLY MEMORY (PROM) MONOLITHIC SILICON《硅单块 互补金属氧化物半导体1K X8可编程序只读存储器 数字主存储器微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-87651 REV C-2006 MICROCIRCUIT MEMORY DIGITAL CMOS 1K X 8 PROGRAMMABLE READ ONLY MEMORY (PROM) MONOLITHIC SILICON《硅单块 互补金属氧化物半导体1K X8可编程序只读存储器 数字主存储器微型电路》.pdf（11页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R026-94. 93-11-05 M. A. Frye B Updated boilerplate. Added device types 02 and 03. Removed programming requirements from drawing. TABLE I. changes. Editorial changes throughout. 94-08-19 M. A. Frye C Boilerplate

2、 update, part of 5 year review. ksr 06-09-13 Raymond Monnin REV SHET REV SHET REV STATUS REV C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Kenneth S. Rice DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. H. Johnson COLUMBUS, OHIO 43218-3990 h

3、ttp:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 88-05-23 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 1K X 8 PROGRAMMABLE READ ONLY MEMORY (PROM), MONOLITHIC SILICON AMSC N/A REVISION LEVEL

4、 C SIZE A CAGE CODE 67268 5962-87651 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E645-06 .Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87651 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION L

5、EVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example

6、: 5962-87651 01 J A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 1/ Circuit function Access time 01 1K X 8-bit PROM 45 02 1K X 8-bit PROM 45 03 1K X 8

7、-bit PROM 30 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style J CDIP2-T24 or GDIP1-T24 24 Dual-in-line K CDFP3-F24 or GDFP2-F24 24 Flat package L CDIP4-T24 or GDIP3-T24 24 Dual-in-line 3 CQCC1-N

8、28 28 Square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 2/ Supply voltage range to ground potential (VCC). -0.5 V dc to +7.0 V dc DC voltage range applied to the outputs in the high Z state -0.5 V dc to +7.0 V dc DC inp

9、ut voltage . -3.0 V dc to +7.0 V dc Maximum power dissipation 1.0 W 3/ Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) . +150C 4/ Storage temperature range (TSTG) -65C to +150C Temperature under bias -55C to +125C Da

10、ta retention . 10 years, minimum 1.4 Recommended operating conditions. Supply voltage range (VCC) . +4.5 V dc minimum to +5.5 V dc maximum Ground voltage (GND) 0 V dc Input high voltage range (VIH) . +2.0 V dc to VCCInput low voltage range (VIL) . -0.5 V dc to +0.8 V dc Case operating temperature ra

11、nge (TC) -55C to +125C 1/ Generic numbers are listed on the Standardized Military Drawing Source Approval Bulletin and in MIL-HDBK-103. 2/ Unless otherwise specified, all voltages are referenced to ground. 3/ Must withstand the added PDdue to short circuit test; e.g., IOS. 4/ Maximum junction temper

12、ature may be inceased to +175C during burn-in and steady state life tests. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87651 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET

13、 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the

14、solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTM

15、ENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 R

16、obbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unl

17、ess a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufactu

18、rer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This

19、 QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance

20、with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Terminal connections. The terminal connections shall

21、be as specified on figure 1. 3.2.2 Truth table. The truth table shall be as specified on figure 2. 3.2.2.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing shall be as specified on figure 2. When required in groups A, B, C, or D (see 4.3)

22、, the devices shall be programmed by the manufacturer prior to test with a checkerboard pattern or equivalent (a minimum of 50 percent of the total number of bits programmed) or to any altered item drawing pattern which includes at least 25 percent of the total number of bits programmed. 3.2.2.2 Pro

23、grammed devices. The requirements for supplying programmed devices are not part of this drawing. 3.2.3 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics

24、are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleN

25、o reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87651 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Conditions Limits Test Symbol -

26、55C TC +125C Group A Device Unit 4.5 V dc VCC 5.5 V dc subgroups types Min Max unless otherwise specified VIH= 2.0 V, VIL= 0.8 V Output low voltage VOLIOL= 16 mA, VCC= Min 1, 2, 3 All 0.4 V VIH= 2.0 V, VIL= 0.8 V Output high VOHIOH= -4.0 mA, VCC= Min 1, 2, 3 All 2.4 V voltage Input high voltage 1/ V

27、IH 1, 2, 3 All 2.0 V Input low voltage 1/ VIL 1, 2, 3 All 0.8 V VCC= Max Input leakage IIXVIN= GND to 5.5 V 1, 2, 3 All -10 +10 A current VCC= Max Output leakage IOZVOUT= VOHand VOL 1, 2, 3 All -10 +10 A current Output disabled Output short IOSVCC= Max, VOUT= GND 1, 2, 3 All -20 -90 mA circuit curre

28、nt 2/ 3/ Power supply ICCVCC= Max, IOUT= 0 mA 1, 2, 3 All 120 mA current Input capacitance CINVIN= 0 V, VCC= 5.0 V 4 All 10 pF 2/ f = 1 MHz, TA= +25C See 4.3.1c Output capacitance COUTVOUT= 0 V, VCC= 5.0 V 4 All 10 pF 2/ f = 1 MHz, TA= +25C See 4.3.1c Functional tests See 4.3.1e 7, 8A, 8B All Addres

29、s to output valid tAA See figure 4 4/ 9, 10, 11 01,02 45 ns 03 30 Chip select active to tACS 9, 10, 11 01,02 25 ns output valid 03 20 Chip select inactive tHZCS See figure 4 9, 10, 11 01,02 25 ns to high-Z 2/ 4/ 5/ 03 20 1/ These are absolute values with respect to device ground and all overshoots d

30、ue to system or tester noise are included. 2/ Tested initially and after any design or process change which may affect that parameter, and therefore shall be guaranteed to the limits specified in table I. 3/ For test purposes, not more than one output at a time may be shorted. Short circuit test dur

31、ation should not exceed thirty seconds. 4/ AC tests are performed with input rise and fall times of 5 ns or less, timing reference levels of 1.5 V, output loading of the specified IOL/IOH, and loads shown in figure 3. 5/ Transition is measured at steady-state high level -500 mV or steady-state low l

32、evel +500 mV on the output from 1.5 V level on the input and the output load in figure 3 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87651 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION

33、 LEVEL C SHEET 5 DSCC FORM 2234 APR 97 Device types ALL Case Outlines J, K, L 3 Terminal Number Terminal Symbol 1 A7NC 2 A6A73 A5A64 A4A55 A3A46 A2A37 A1A28 A0A19 O0A010 O1NC 11 O2O012 GND O113 O3O214 O4GND 15 O5NC 16 O6O317 O7O418 CS4O519 CS3O620 CS2O7 21 CS1NC 22 A9CS423 A8CS324 VCCCS225 - CS126 -

34、 A927 - A828 - VCCNC = no connection FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87651 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSC

35、C FORM 2234 APR 97 Read or output disable CS4CS3CS2CS1Outputs Read VIHVIHVILVILData out Output disable X X VIHX High Z Output disable X VILX X High Z Output disable VILX X X High Z Mode Output disable X X X VIHHigh Z FIGURE 2. Truth table. NOTES: 1. CLincludes probe and jig capacitance. CL= 30 pF fo

36、r all switching characteristics except tHZCS, for which CL= 5 pF. 2. Tests are performed with rise and fall times of 5 ns or less. FIGURE 3. Output load circuit and test conditions. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUI

37、T DRAWING SIZE A 5962-87651 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 FIGURE 4. Switching waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 59

38、62-87651 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be mark

39、ed. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance t

40、o MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order

41、to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements here

42、in. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawi

43、ng. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Data retention. A data retention str

44、ess test shall be completed as part of the vendors reliability monitors. This test shall be done initially and after any design or process change which may affect data retention. The methods and procedures may be vendor specific, but will guarantee the number of years listed in section 1.3 herein ov

45、er the full military temperature range. The vendors procedure shall be kept under document control and shall be made available upon request. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening

46、 shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level c