DLA SMD-5962-01524-2001 MICROCIRCUIT DIGITAL ADVANCED CMOS OCTAL D-TYPE LATCH WITH THREE-STATE OUTPUTS MONOLITHIC SILICON《单片硅先进CMOS数字微电路八进制D型锁存器与三态输出》.pdf
《DLA SMD-5962-01524-2001 MICROCIRCUIT DIGITAL ADVANCED CMOS OCTAL D-TYPE LATCH WITH THREE-STATE OUTPUTS MONOLITHIC SILICON《单片硅先进CMOS数字微电路八进制D型锁存器与三态输出》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-01524-2001 MICROCIRCUIT DIGITAL ADVANCED CMOS OCTAL D-TYPE LATCH WITH THREE-STATE OUTPUTS MONOLITHIC SILICON《单片硅先进CMOS数字微电路八进制D型锁存器与三态输出》.pdf(18页珍藏版)》请在麦多课文档分享上搜索。
1、REVISIONSLTR DESCRIPTION DATE (YR-MO-DA) APPROVEDREVSHEETREVSHEET 15 16 17REV STATUS REVOF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14PMIC N/A PREPARED BYCharles F. SaffleDEFENSE SUPPLY CENTER COLUMBUSSTANDARDMICROCIRCUITDRAWINGCHECKED BYCharles F. SaffleCOLUMBUS, OHIO 43216http:/www.dscc.dla.milT
2、HIS DRAWING IS AVAILABLEFOR USE BY ALLDEPARTMENTSAPPROVED BYThomas M. Hess MICROCIRCUIT, DIGITAL, ADVANCED CMOS,OCTAL D-TYPE LATCH WITH THREE-STATEAND AGENCIES OF THEDEPARTMENT OF DEFENSE DRAWING APPROVAL DATE01-05-24OUTPUTS, MONOLITHIC SILICONAMSC N/A REVISION LEVEL SIZEACAGE CODE67268 5962-01524SH
3、EET 1 OF 17DSCC FORM 2233APR 97 5962-E 438-01DISTRIBUTION STATEMENT A . Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA 5962-01524DEFENSE SUPPLY CENTER COLUMBUSC
4、OLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 2DSCC FORM 2234APR 971. SCOPE1.1 Scope . This drawing documents two product assurance class levels consisting of high reliability (device classes Q andM) and space application (device class V). A choice of case outlines and lead finishes are available an
5、d are reflected in thePart or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in thePIN.1.2 PIN . The PIN is as shown in the following example:5962 - 01524 01 V X XFederalstock classdesignatorRHAdesignator(see 1.2.1)Devicetype(see 1.2.2)D
6、eviceclassdesignatorCaseoutline(see 1.2.4)Leadfinish(see 1.2.5) / (see 1.2.3)/Drawing number1.2.1 RHA designator . Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels andare marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-P
7、RF-38535, appendix Aspecified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.1.2.2 Device type(s) . The device type(s) identify the circuit function as follows:Device type Generic number Circuit function01 54AC573 Octal D-type latch with three-st
8、ate outputs1.2.3 Device class designator . The device class designator is a single letter identifying the product assurance level asfollows:Device class Device requirements documentationM Vendor self-certification to the requirements for MIL-STD-883compliant, non-JAN class level B microcircuits in a
9、ccordance withMIL-PRF-38535, appendix AQ or V Certification and qualification to MIL-PRF-385351.2.4 Case outline(s) . The case outline(s) are as designated in MIL-STD-1835 and as follows:Outline letter Descriptive designator Terminals Package styleX See figure 1 20 Flat pack1.2.5 Lead finish . The l
10、ead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,appendix A for device class M.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA 5962-01524DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS,
11、OHIO 43216-5000 REVISION LEVEL SHEET 3DSCC FORM 2234APR 971.3 Absolute maximum ratings . 1 / 2 / 3 /Supply voltage range (V CC ) . -0.5 V dc to +7.0 V dcDC input voltage range (V IN ) . -0.5 V dc to V CC + 0.5 V dcDC output voltage range (V OUT ) -0.5 V dc to V CC + 0.5 V dcDC input clamp current (I
12、 IK ) (V IN V CC ) . 20 mADC output clamp current (I OK ) (V IN V CC ) 20 mAContinuous output current (I OUT ) (V OUT = 0 to V CC ) . 50 mAContinuous current through V CC or GND 400 mAMaximum power dissipation (P D ) 500 mWStorage temperature range (T STG ) -65 C to +150 CLead temperature (soldering
13、, 10 seconds) . +300 CThermal resistance, junction-to-case ( JC ) See MIL-STD-1835Junction temperature (T J ) . +175 C 4 /1.4 Recommended operating conditions . 2 / 3 / 5 /Supply voltage range (V DD ) . +2.0 V dc to +6.0 V dcInput voltage range (V IN ) . +0.0 V dc to V CCOutput voltage range (V OUT
14、) . +0.0 V dc to V CCCase operating temperature range (T C ) -55 C to +125 CInput rise or fall time rate ( t/ V),V CC = 3.6 V, V CC = 5.5 V . 0 to 8 ns/VMinimum setup time, Dn to LE ( t s ):T C = +25 C, V CC = 3.0 V . 3.0 nsT C = -55 C to +125 C, V CC = 3.0 V . 3.5 nsT C = +25 C, V CC = 4.5 V . 2.5
15、nsT C = -55 C to +125 C, V CC = 4.5 V . 3.0 nsMinimum hold time, Dn to LE ( t h ):T C = +25 C, V CC = 3.0 V . 3.0 nsT C = -55 C to +125 C, V CC = 3.0 V . 3.5 nsT C = +25 C, V CC = 4.5 V . 2.5 nsT C = -55 C to +125 C, V CC = 4.5 V . 3.0 nsMinimum pulse width LE ( t w ):T C = +25 C, V CC = 3.0 V . 4.0
16、 nsT C = -55 C to +125 C, V CC = 3.0 V . 4.5 nsT C = +25 C, V CC = 4.5 V . 3.5 nsT C = -55 C to +125 C, V CC = 4.5 V . 4.0 ns1 / Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at themaximum levels may degrade performance and affect reliability
17、.2 / Unless otherwise n oted, all voltages are referenced to GND.3 / The limits for the parameters specified herein shall apply over the full specified VCC range and case temperature range of-55 C to +125 C. Unused inputs must be held high or low.4 / Maximum junction temperat ure shall not be exceed
18、ed except for allowable short duration burn-in screening conditions inaccordance with method 5004 of MIL-STD-883.5 / Operation from 2.0 V to 3.0 V dc is provided for compatibility with data retention and battery back-up systems. D ataretention implies no input transition and no stored data loss with
19、 the following conditions: V IH 70% V CC , V IL 30% V CC ,V OH 70% V CC -20 A, V OL 30% V CC 20 A.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA 5962-01524DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000 REVI
20、SION LEVEL SHEET 4DSCC FORM 2234APR 972. APPLICABLE DOCUMENTS2.1 Government specification, standards, and handbooks . The following specification, standards, and handbooks form apart of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those l
21、isted inthe issue of the Department of Defense Index of Specifications and Standards ( DoDISS) and supplement thereto, cited in thesolicitation.SPECIFICATIONDEPAR TMENT OF DEFENSEMIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.STANDARDSDEPARTMENT OF DEFENSEMIL-STD-883 -
22、 Test Method Standard Microcircuits.MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.HANDBOOKSDEPARTMENT OF DEFENSEMIL-HDBK-103 - List of Standard Microcircuit Drawings.MIL-HDBK-780 - Standard Microcircuit Drawings.(Unless otherwise indicated, copies of the specification, standar
23、ds, and handbooks are available from the StandardizationDocument Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)2.2 Non-Government publications . The following documents form a part of this document to the extent specified herein. Unless otherwise specified, the issues of
24、the documents which are DoD adopted are those listed in the issue of the DoDISScited in the solicitation. Unless otherwise specified, the issues of documents not listed in the DoDISS are the issues of thedocuments cited in the solicitation.ELECTRONIC INDUSTRIES ALLIANCE (EIA)JEDEC Standard No. 20 -
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