ASTM F1596-2015 Standard Test Method for Exposure of a Membrane Switch or Printed Electronic Device to Temperature and Relative Humidity《薄膜开关或印刷电子设备暴露于温度和相对湿度的标准试验方法》.pdf

《ASTM F1596-2015 Standard Test Method for Exposure of a Membrane Switch or Printed Electronic Device to Temperature and Relative Humidity《薄膜开关或印刷电子设备暴露于温度和相对湿度的标准试验方法》.pdf》由会员分享，可在线阅读，更多相关《ASTM F1596-2015 Standard Test Method for Exposure of a Membrane Switch or Printed Electronic Device to Temperature and Relative Humidity《薄膜开关或印刷电子设备暴露于温度和相对湿度的标准试验方法》.pdf（3页珍藏版）》请在麦多课文档分享上搜索。

1、Designation: F1596 15Standard Test Method forExposure of a Membrane Switch or Printed ElectronicDevice to Temperature and Relative Humidity1This standard is issued under the fixed designation F1596; the number immediately following the designation indicates the year oforiginal adoption or, in the ca

2、se of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.1. Scope1.1 This test method covers a procedure for temperature andhumidity cycling of a membrane swit

3、ch or printed electronicdevice.1.2 This test method is performed to evaluate the propertiesof materials used in the construction of membrane switch orprinted electronic assemblies as they are influenced by theabsorption and diffusion of moisture and moisture vapor. Thisis an accelerated environmenta

4、l test, accomplished by thecontinuous exposure of the test specimen to high relativehumidity at an elevated temperature.Absorption of moisture bymany materials results in swelling, which destroys their func-tional utility, causes loss of physical strength, and changes inother mechanical properties.

5、Insulating materials which absorbmoisture may suffer degradation of their electrical properties.1.2.1 Physical changes:1.2.1.1 Differential contraction or expansion rates or in-duced strain of dissimilar materials.1.2.1.2 Cracking of surface coatings.1.2.1.3 Leaking of sealed compartments.1.2.1.4 De

6、formation or fracture of components.1.2.2 Chemical changes:1.2.2.1 Separation of constituents.1.2.2.2 Failure of chemical agent protection.1.2.3 Electrical changes:1.2.3.1 Changes in electronic and electrical components.1.2.3.2 Electronic or mechanical failures due to rapid waterof condensate format

7、ion.1.2.3.3 Excessive static electricity.1.3 This test method is not intended to be a thermal shockprocedure; a ramp rate between temperature extremes shouldnot exceed 2C/min.1.4 This standard does not purport to address all of thesafety concerns, if any, associated with its use. It is theresponsibi

8、lity of the user of this standard to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.2. Referenced Documents2.1 ASTM Standards:2F1595 Practice for Viewing Conditions for Visual Inspectionof Membrane SwitchesF1661 Test Method

9、for Determining the Contact BounceTime of a Membrane SwitchF1662 Test Method for Verifying the Specified DielectricWithstand Voltage and Determining the Dielectric Break-down Voltage of a Membrane SwitchF1663 Test Method for Determining the Capacitance of aMembrane Switch or Printed Electronic Devic

10、eF1680 Test Method for Determining Circuit Resistance of aMembrane SwitchF1689 Test Method for Determining the Insulation Resis-tance of a Membrane SwitchF2592 Test Method for Measuring the Force-Displacementof a Membrane Switch3. Terminology3.1 Definitions:3.1.1 membrane switcha momentary switching

11、 device inwhich at least one contact is on, or made of, a flexiblesubstrate.4. Significance and Use4.1 Changes in temperature and humidity during shipping,storage or use can affect the visual appearance, mechanicalintegrity, or electrical functionality of switches. This practicesimulates three diffe

12、rent environments to which membraneswitches may be exposed.4.2 The three industry-recognized switch categories basedon performance levels are Level 1, Level 2, and Level 3 (seesection 9.1).1This test method is under the jurisdiction of ASTM Committee F01 onElectronics and is the direct responsibilit

13、y of Subcommittee F01.18 on PrintedElectronics.Current edition approved June 1, 2015. Published July 2015. Originally approvedin 1995. Last previous edition approved in 2007 as F159607. DOI: 10.1520/F1596-15.2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Custome

14、r Service at serviceastm.org. For Annual Book of ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM website.Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States14.3 Additionally, there may be custom r

15、equirements thatvary by application, therefore, these requirements can bedetermined by customer and vendor agreement and be estab-lished as a Level 4.4.4 This practice defines the duration of a single cycle.Multiple cycles may be appropriate depending on the require-ments of the application.5. Appar

16、atus5.1 Closed system, with temperature and humidity control.35.2 The formation of condensation during rising tempera-ture cycles is acceptable; the formation of ice during lowtemperature cycling is not acceptable.6. Test Specimens6.1 The specimens shall be finished switches as deliveredand mounted

17、to an actual or agreed upon substrate.7. Conditioning7.1 Condition all specimens for 72 h at 20 to 25C (68 to77F) and 20 to 80 % relative humidity (RH) immediately priorto exposure, or prior to temperature and humidity cycling. Thisis to enable the specimens to stabilize.8. Pre-Test Setup8.1 Take pr

18、e-test measurements per these test methods, or asspecified, and record results.8.1.1 Force Displacement per Test Method F2592.8.1.2 Circuit Resistance per Test Method F1680.8.1.3 Contact Bounce per Test Method F1661.8.1.4 Insulation Resistance per Test Method F1689.8.1.5 Capacitance per Test Method

19、F1663.8.1.6 Visual Inspection per Practice F1595.9. Procedure9.1 Subject the preconditioned specimens to the exposuretest cycle as illustrated in Table 1.9.2 Return to room temperature and prepare for post-testmeasurements.10. Post-Test Measurements10.1 Take post-test measurements using the same pro

20、ce-dures and test points as used in 8.1 and record results.11. Report11.1 Report the changes in test measurements betweenPre-test (8.1) and Post-test (10.1).11.1.1 Test Conditions:11.1.1.1 Test level.11.1.1.2 Ramp rate.11.1.1.3 Condensing or non-condensing environment.12. Keywords12.1 membrane switc

21、h; printed electronic device; relativehumidity (RH); temperature3A closed system such as a Tenney T3ORC, Despatch EC 619, or Espec EMX,available from Tenney, Inc., Union, NJ 07083; Despatch Industries, Minneapolis,MN 55440-1320; ESPEC Corp., Grand Rapids, MI 49509, have been foundsatisfactory for th

22、is purpose.F1596 152ASTM International takes no position respecting the validity of any patent rights asserted in connection with any item mentionedin this standard. Users of this standard are expressly advised that determination of the validity of any such patent rights, and the riskof infringement

23、 of such rights, are entirely their own responsibility.This standard is subject to revision at any time by the responsible technical committee and must be reviewed every five years andif not revised, either reapproved or withdrawn. Your comments are invited either for revision of this standard or fo

24、r additional standardsand should be addressed to ASTM International Headquarters. Your comments will receive careful consideration at a meeting of theresponsible technical committee, which you may attend. If you feel that your comments have not received a fair hearing you shouldmake your views known

25、 to the ASTM Committee on Standards, at the address shown below.This standard is copyrighted by ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959,United States. Individual reprints (single or multiple copies) of this standard may be obtained by contacting ASTM

26、at the aboveaddress or at 610-832-9585 (phone), 610-832-9555 (fax), or serviceastm.org (e-mail); or through the ASTM website(www.astm.org). Permission rights to photocopy the standard may also be secured from the Copyright Clearance Center, 222Rosewood Drive, Danvers, MA 01923, Tel: (978) 646-2600;

27、http:/ 1 Exposure Test CycleLevel 1 40C (40F) to 85C (185F) Level 2 25C (13F) to 70C (158F)72 h at 85C (185F)Adry heat 72 h at 70C (158F)A24 h at 38C (100F)Aand 95 % RHB24 h at 38C (100F)Aand 95 % RHB8 h at 40C (40F) 8 h at 25C (13F)A40 h at 85C (185F)Adry heat 40 h at 70C (158F)A24 h at 38C (100F)A

28、and 95 % RHB24 h at 38C (100F)Aand 95 % RHB72 h at 40C (40F)Adry heat 72 h at 25C (13F)ALevel 3 10C (14F) to 55C (131F) Level 4 (Custom Requirement)72 h at 55C (131F)ASee 4.324 h at 38C (100F)Aand 95 % RHA8 h at 10C (14F)A40 h at 55C (131F)A24 h at 38C (100F)Aand 95 % RHA72 h at 10C (14F)AATesting to be performed in non-condensing manner unless otherwise specified.BPlace these samples in a rack at a 45 angle to allow condensate to drain from samples and arrange to allow adequate air flow between samples.F1596 153