DLA SMD-5962-90916 REV B-2008 MICROCIRCUIT DIGITAL ADVANCED CMOS 8-BIT MAGNITUDE COMPARATOR MONOLITHIC SILICON《单片硅8位数值比较器改进的CMOS数字微电路》.pdf

《DLA SMD-5962-90916 REV B-2008 MICROCIRCUIT DIGITAL ADVANCED CMOS 8-BIT MAGNITUDE COMPARATOR MONOLITHIC SILICON《单片硅8位数值比较器改进的CMOS数字微电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-90916 REV B-2008 MICROCIRCUIT DIGITAL ADVANCED CMOS 8-BIT MAGNITUDE COMPARATOR MONOLITHIC SILICON《单片硅8位数值比较器改进的CMOS数字微电路》.pdf（22页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add RHA data. Editorial changes throughout. jak 98-05-06 Monica L. Poelking B Update boilerplate to MIL-PRF-38535 requirements. - LTG 08-07-24 Thomas M. Hess REV SHET REV B B B B B B SHEET 15 16 17 18 19 20 REV STATUS REV B B B B B B B B B B B B

2、B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Marcia B. Kelleher CHECKED BY Thomas J. Ricciuti DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil APPROVED BY Michael A. Frye STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY AL

3、L DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 91-04-08 MICROCIRCUIT, DIGITAL, ADVANCED CMOS, 8-BIT MAGNITUDE COMPARATOR, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-90916 SHEET 1 OF 20 DSCC FORM 2233 APR 97 5962-E442-08 Provided by IHSNot

4、for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90916 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance clas

5、s levels consisting of high reliability (device classes B, Q and M) and space application (device classes S and V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) leve

6、ls is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 R 90916 01 M R A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA d

7、esignator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device classes M, B, and S RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designato

8、r. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54AC520 8-Bit magnitude comparator with enable and pull-up resistors 02 54AC11520 8-Bit magnitude comparator with enable and pul

9、l-up resistors 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircui

10、ts in accordance with MIL-PRF-38535, appendix A B or S Certification and qualification to MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designat

11、or Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device classes M, B, a

12、nd S. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90916 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Suppl

13、y voltage range (VCC) -0.5 V dc to +6.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC + 0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc Clamp diode current (IIK, IOK) 20 mA DC output current (IOUT) . 50 mA DC VCCor GND current (ICC, IGND) . 100 mA Maximum power dissipation

14、(PD) . 300 mW Storage temperature range (TSTG) . -65C to +150C Lead temperature (soldering, 10 seconds). +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 4/ 1.4 Recommended operating conditions. 2/ 3/ 5/ Supply voltage range (VCC) 3.0 V dc to +5.5 V

15、dc Output voltage range (VOUT). +0.0 V dc to VCCMinimum high level input voltage (VIH): VCC= 3.0 V 2.10 V dc VCC= 4.5 V 3.15 V dc VCC= 5.5 V 3.85 V dc Maximum low level input voltage (VIL): VCC= 3.0 V 0.90 V dc VCC= 4.5 V 1.35 V dc VCC= 5.5 V 1.65 V dc Case operating temperature range (TC). -55C to

16、+125C Input rise or fall rate (tr, tf) maximum: VCC= 3.6 V and 5.5 V 0 to 8 ns/V 1.5 Radiation features. Maximum total dose available (dose rate = 50 300 rads(Si)/s) 100k rads(Si) 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximu

17、m levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ Maximum junction temperature shall no

18、t be exceeded except for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. 5/ Operation from 2.0 V dc to 3.0 V dc is provided for compatibility with data retention and battery back-up systems. Data retention implies no input transition and no stored

19、 data loss with the following conditions: VIH 70% VCC, VIL 30% VCC, VOH 70% VCCat -20 A, VOL 30% VCCat 20 A. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90916 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO

20、 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these

21、 documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electroni

22、c Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk,

23、700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents cited in the solicitation or contract. ELECTRONIC INDUSTRIE

24、S ALLIANCE (EIA) JEDEC Standard No. 17 - A Standardized Description Test Procedure for Characterization of LATCH-UP in CMOS Devices. JEDEC Standard No. 20 - Standard for Description of 54/74ACXXXXX and 54/74ACTXXXXX Advanced High-Speed CMOS Devices. (Copies of these documents are available online at

25、 http:/www.jedec.org or from Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, ho

26、wever, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufactu

27、rers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device classes M, B, and S shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified

28、 herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device classes M, B, and S. 3.2.1 Case outlines. The case outlines sh

29、all be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. Provided by IHSNot for Resal

30、eNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90916 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 3.2.5 Switching waveforms and test circuit. The switching waveforms and test c

31、ircuit shall be as specified on figure 4. 3.2.6 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.3 Electrical performance charac

32、teristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. For device classes B and S, a pin-for-pin con

33、ditions and testing sequence for table I parameters shall be maintained and available upon request from the qualifying activity on qualified devices. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgrou

34、p are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking t

35、he “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device classes M, B, and S shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compl

36、iance mark. The certification mark for device classes Q, V, B and S shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.5.2 Correctness of indexing and marking for device classes B and S. For device c

37、lasses B and S, all devices shall be subjected to the final electrical tests specified in table II after PIN marking (marked in accordance with MIL-PRF-38535, appendix A) to verify that they are correctly indexed and identified by PIN. Optionally, an approved electrical test may be devised especiall

38、y for this requirement. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device classes M, B, and S a certificate of compliance

39、shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for

40、device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device classes M, B, and S

41、 in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device classes M, B and S. For device classes M, B and S notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing i

42、s required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made av

43、ailable onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device classes M, B and S. Device classes M, B, and S devices covered by this drawing shall be in microcircuit group number 39 (see MIL-PRF-38535, appendix A). 3.11 Serialization for device class S. All device clas

44、s S devices shall be serialized in accordance with MIL-PRF-38535, appendix A. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90916 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SH

45、EET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ 3/ -55C TC +125C 3.0 V VCC 5.5 V unless otherwise specified Device type 4/ and device class VCCGroup A subgroups Limits 5/ UnitMin Max High level output voltage

46、3006 VOH16/ VIN= VIHor VILVIH= 2.10 V VIL= 0.90 V IOH= -50 A All All 3.0 V1, 2, 3 2.9 V VOH2 6/ VIN= VIHor VILVIH= 3.15 V VIL= 1.35 V IOH= -50 A All All 4.5 V1, 2, 3 4.4 VOH3VIN= VIHor VILVIH= 3.85 V All All 5.5 V1, 2, 3 5.4 VIL= 1.65 V IOH= -50 A M, D, P, L, R 01 B, S, Q, V 1 5.4 VOH4 6/ VIN= VIHor

47、 VILVIH= 2.10 V VIL= 0.90 V IOH= -4.0 mA All All 3.0 V1, 2, 3 2.4 VOH5VIN= VIHor VILVIH= 3.15 V VIL= 1.35 V IOH= -24 mA All All 4.5 V1, 2, 3 3.7 M, D, P, L, R 01 B, S, Q, V 1 3.7 VOH6 6/ VIN= VIHor VILVIH= 3.85 V VIL= 1.65 V IOH= -24 mA All All 5.5 V1, 2, 3 4.7 VOH7 7/ VIN= VIHor VILVIH= 3.85 V VIL=

48、 1.65 V IOH= -50 mA All All 5.5 V1, 2, 3 3.85 M, D, P, L, R 01 B, S, Q, V 1 3.85 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90916 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ 3/ -55C TC +125C 3.0 V VCC 5.5 V unless otherwise specified Device type 4/