DLA DSCC-VID-V62 09630-2009 MICROCIRCUIT DIGITAL-LINEAR IMPROVED 8-CHANNEL DUAL 4-CHANNEL CMOS ANALOG MULTIPLEXERS MONOLITHIC SILICON.pdf

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1、 REVISIONS LTR DESCRIPTION DATE APPROVED Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV PAGE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Phu H. Nguyen DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43218-3990 Original date of drawing Y

2、Y MM DD CHECKED BY Phu H. Nguyen TITLE MICROCIRCUIT, DIGITAL-LINEAR, IMPROVED, 8-CHANNEL/DUAL 4-CHANNEL, CMOS ANALOG MULTIPLEXERS, MONOLITHIC SILICON 09-09-16 APPROVED BY Thomas M. Hess SIZE A CODE IDENT. NO. 16236 DWG NO. V62/09630 REV PAGE 1 OF 14 AMSC N/A 5962-V079-09 Provided by IHSNot for Resal

3、eNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09630 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of an improved, 8-channel/Dual 4-channel, CMOS analog mult

4、iplexers microcircuit, with an operating temperature range of -55C to +125C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering do

5、cumentation: V62/09630 - 01 X B Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 DG408 8-channel, CMOS analog multiplexer 02 DG409 Dual 4-channel, CMOS analog multiplexer 1.2.2 Case outline(s). The c

6、ase outlines are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 16 JEDEC MS012 Small outline 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer: Finish designator Material A Hot solder dip B Tin

7、-lead plate C Gold plate D Palladium E Gold flash palladium Z Other Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09630 REV PAGE 3 1.3 Absolute maximum ratings.

8、1/ Voltage V+ -0.3 V to 44 V GND -0.3 V to 25 V Digital input, S, D (V- - 2V) to (V+ + 2V) or 30 mA (which ever occurs first) 2/ Continuous current (any terminal) . 30 mA Peak current, S, D (pulsed at 1 ms, 10% duty cycle max) 100 mA Operating temperature range -55C to +125C Storage temperature rang

9、e . -55C to +150C Junction temperature +150C Lead temperature (soldering , 10 sec) +300C Electro Static Discharge (ESD) Human Body Model (HBM) 2000 V Class 1C Moisture Sensitive Level (MSL) . Level 1 1.4 Thermal data table. Case outline letter X X Units PC Board Single Layer Multi-Layer 3/ Power dis

10、sipation (PD), maximum at +70C 696 1096 mW Power dissipation (PD) derating above +70C 8.7 13.7 mW/C Thermal resistance, junction to case (JC) 32 23 C/W Thermal resistance, junction to ambient (JA) 115 73 C/W 2. APPLICABLE DOCUMENTS JEDEC PUB 95 Registered and Standard Outlines for Semiconductor Devi

11、ces JESD51-7 High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages (Applications for copies should be addressed to the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834 or online at http:/www.jedec.org) 1/ Stresses beyond those listed under “a

12、bsolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute maximum rated conditions for

13、extended periods may affect device reliability. 2/ Signals on S_, D_, EN, A0, A1, or A2 exceeding V+ or V- are clamped by internal diodes. Limit forward current to maximum current ratings. 3/ Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using

14、a four-layer board. For detailed information on package thermal considerations, refer to manufacturers website Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/0963

15、0 REV PAGE 4 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit container sha

16、ll be marked with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and ph

17、ysical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2. 3.5.3 Truth table. The truth ta

18、ble shall be as shown in figure 3. 3.5.4 Functional diagram. The functional diagram shall be as shown in figure 4. 3.5.5 Test circuits and timing waveforms. 3.5.5.1 Transition time. The transition time shall be as shown in figure 5. 3.5.5.2 Enable switching time. The enable switching time shall be a

19、s shown in figure 6. 3.5.5.3 Break before make interval. The break before make interval shall be as shown in figure 7. 3.5.5.4 Charge injection. The charge injection shall be as shown in figure 8. 3.5.5.5 Off isolation. The off isolation shall be as shown in figure 9. 3.5.5.6 Cross talk. The cross t

20、alk shall be as shown in figure 10. 3.5.5.7 Source and drain capacitance. The source and drain capacitance shall be as shown in figure 11. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDEN

21、T NO. 16236 DWG NO. V62/09630 REV PAGE 5 TABLE I. Electrical performance characteristics. 1/ Test Symbol Conditions Device type: All 2/ TALimits 3/ Unit Min Max DUAL SUPPLIES Switch Analog signal range VANALOG4/ -15 15 V Drain source on resistance rDS(ON)IS= -1.0 mA, VD= 10 V 25C 100 -55C to 125C 12

22、5 On resistance matching between channels rDS(ON)IS= -1.0 mA, VD= 10 V 5/ 25C 8 -55C to 125C 10 On resistance flatness rFLATIS= -1.0 mA, VD= 5 V or 0 V 25C 9 -55C to 125C 12 Source off leakage current 6/ IS(OFF)VD= 10 V, VS= 10 V, VEN= 0 V 25C -0.5 0.5 nA -55C to 125C -50 50 Drain off leakage curren

23、t 6/ ID(OFF)VD= 10 V, VS= 10 V, VEN= 0 V Device type 01 25C -1 1 nA -55C to 125C -100 100 Device type 02 25C -1 1 -55C to 125C -50 50 Drain on leakage current 6/ ID(ON)VD= 10 V, VS= 10 V, sequence each switch on Device type 01 25C -1 1 nA -55C to 125C -100 100 Device type 02 25C -1 1 -55C to 125C -5

24、0 50 Input Input current with input voltage high IAHVA= 2.4 V or 15 V -1.0 1.0 A Input current with input voltage low IALVEN= 0 V or 2.4 V, VA= 0 V -1.0 1.0 A Supply Power supply range 5 20 V Positive supply current I+ VEN= VA= 0 V or 4.5 V 25C 30 A -55C to 125C 75 VEN= 2.4 V, VA(ALL)= 0 V or 2.4 V

25、25C 0.5 mA -55C to 125C 2 Negative supply current I- VEN= 2.4 V, VA(ALL)= 0 V or 2.4 V 25C -1 1 A -55C to 125C -10 10 Dynamic Transition time tTRANSSee figure 5 25C 175 ns -55C to 125C 250 Break before make interval tOPENSee figure 7 25C 10 Enable turn on time tON(EN)See figure 6 25C 150 -55C to 125

26、C 225 Enable turn off time tOFF(EN)See figure 6 25C 150 -55C to 125C 300 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09630 REV P

27、AGE 6 TABLE I. Electrical performance characteristics - Continued. 1/ Test Symbol Conditions Device type: All 2/ TALimits 3/ Unit Min Max DUAL SUPPLIES (continued) Dynamic (continued) Charge injection 4/ Q CL= 1.0 nF, VS= 0 V, RS= 0 See figure 8 25C 15 pC Off isolation 7/ VISOVEN = 0 V, RL= 1 k, f =

28、 100 kHz, See figure 9 25C -75 TYP dB Cross talk between input channels VCTVEN= 2.4 V, f = 100 kHz, VGEN= 1 VP-P, RL= 1 k, See figure 10 25C -92 TYP dB Logic input capacitance CINf = 1 MHz 25C 8 TYP pF Source OFF capacitance CS(OFF)f = 1 MHz, VEN= VS= 0 V, See figure 11 25C 3 TYP Drain OFF capacitan

29、ce CD(OFF)f = 1 MHz, VEN= 0.8 V VD= 0 V, See figure 11 Device type 01 26 TYP Device type 02 14 TYP Drain ON capacitance CD(ON)+ CS(ON)f = 1 MHz, VEN= 2.4 V VD= 0 V, See figure 11 Device type 01 37 TYP Device type 02 25 TYP SINGLE SUPPLY (V+ = 12 V, V- = 0 V) Switch Analog signal range VANALOG4/ 0 12

30、 V Drain source on resistance rDS(ON)IS= -1.0 mA, VD= 3 V or 10 V 25C 175 Dynamic Transition time 4/ tTRANSVS1= 8 V, VS8= 0 V, VA= 0 V See figure 5 25C 450 ns Enable turn ON time 4/ tON(EN)VAL= 0 V, VS1= 5 V, See figure 6 25C 600 Enable turn OFF time 4/ tOFF(EN)VAL= 0 V, VS1= 5 V, See figure 6 25C 3

31、00 Charge injection Q CL= 1.0 nF, VS= 0 V, RS= 0 , See figure 8 25C 2 TYP pC 1/ Testing and other quality control techniques are used to the extent deemed necessary to assure product performance over the specified temperature range. Product may not necessarily be tested across the full temperature r

32、ange and all parameters may not necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization and/or design. 2/ V+ = 15 V, V- = -15 V, GND = 0 V, VAH= +2.4 V, VAL= +0.8 V, TA= -55C to 125C (unless otherwise noted). 3/ The algebraic conventio

33、n where the most negative value is a minimum and the most positive value a maximum is used in this data sheet. 4/ Guaranteed by design. 5/ RON= RON(MAX) RON(MIN). On resistance match between channels and flatness are guaranteed only with specified voltages. Flatness is defined as the difference betw

34、een the maximum and minimum value of on resistance as measured at the extremes of the specified analog signal range. 6/ Leakage parameters are 100% tested at the maximum rated hot temperature and guaranteed by correlation at +25C. 7/ Off isolation = 20log VD/VS, where VD= output and VS= input to off

35、 switch. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09630 REV PAGE 7 Case X Dimensions Symbol Inches Millimeters Symbol Inches Millimeters Min Max Min Max Min

36、 Max Min Max A .053 .069 1.35 1.75 E .150 .157 3.80 4.00 A1 .004 .010 0.10 0.25 E1 .228 .244 5.80 6.20 b .014 .019 0.35 0.49 e .050 BSC 1.27 BSC c .007 .010 0.19 0.25 L .016 .050 0.40 1.27 D .386 .394 9.80 10.00 NOTES: 1. D and E do not include mold flash. 2. Mold flash or protrusions not to exceed

37、0.15 mm (.006”). 3. Leads to be coplanar within 0.10 mm (.004”). 4. Meets JEDEC MS012. 5. Controlling dimensions are millimeters. Inch dimensions are given for reference only. FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DE

38、FENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09630 REV PAGE 8 Case outlines: X Terminal number Terminal symbol Terminal number Terminal symbol Device type 01 Device type 02 Device type 01 Device type 02 1 A0 A0 9 S8 DB 2 EN EN 10 S7 S4B 3 V- V- 11 S6 S3B 4 S1

39、S1A 12 S5 S2B 5 S2 S2A 13 V+ S1B 6 S3 S3A 14 GND V+ 7 S4 S4A 15 A2 GND 8 D DA 16 A1 A1 FIGURE 2. Terminal connections. Device type 01 Device type 02 A2 A1 A0 EN ON Switch A1 A0 EN ON Switch X X X 0 None X X 0 None 0 0 0 1 1 0 0 1 1 0 0 1 1 2 0 1 1 2 0 1 0 1 3 1 0 1 3 0 1 1 1 4 1 1 1 4 1 0 0 1 5 Logi

40、c “0” VAL 0.8 V Logic “1” VAH 2.4 V 1 0 1 1 6 1 1 0 1 7 1 1 1 1 8 Logic “0” VAL 0.8 V Logic “1” VAH 2.4 V FIGURE 3. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 1623

41、6 DWG NO. V62/09630 REV PAGE 9 FIGURE 4. Functional diagrams. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09630 REV PAGE 10 FIGURE 5. Transition time. Provided

42、 by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09630 REV PAGE 11 FIGURE 6. Enable switching time. Provided by IHSNot for ResaleNo reproduction or networking permitted wit

43、hout license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09630 REV PAGE 12 FIGURE 7. Break before make interval. FIGURE 8. Charge injection. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFEN

44、SE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09630 REV PAGE 13 FIGURE 9. Off Isolation. FIGURE 10. Crosstalk. FIGURE 11. Source and drain capacitance. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY

45、 CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09630 REV PAGE 14 4. VERIFICATION 4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test requirements as indicated in their internal documentation. Such procedures should incl

46、ude proper handling of electrostatic sensitive devices, classification, packaging, and labeling of moisture sensitive devices, as applicable. 5. PREPARATION FOR DELIVERY 5.1 Packaging. Preservation, packaging, labeling, and marking shall be in accordance with the manufacturers standard commercial pr

47、actices for electrostatic discharge sensitive devices. 6. NOTES 6.1 ESDS. Devices are electrostatic discharge sensitive and are classified as ESDS class 1 minimum. 6.2 Configuration control. The data contained herein is based on the salient characteristics of the device manufacturers data book. The device manufacturer reserves the right to make changes without notice. This drawing will be modified as changes are provided. 6.3 Suggested source(s) of supp