BS EN 60194-2006 Printed board design manufacture and assembly - Terms and definitions《印制板设计、制造和组装 术语和定义》.pdf

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1、 g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58definitionsThe European Standard EN 60194:2006 has the status of a British StandardICS 31.180; 31.1

2、90Printed board design, manufacture and assembly Terms and BRITISH STANDARDBS EN 60194:2006BS EN 60194:2006This British Standard was published under the authority of the Standards Policy and Strategy Committee on 29 September 2006 BSI 2006ISBN 0 580 49212 5Amendments issued since publicationAmd. No.

3、 Date Commentscontract. Users are responsible for its correct application.Compliance with a British Standard cannot confer immunity from legal obligations.National forewordThis British Standard was published by BSI. It is the UK implementation of EN 60194:2006. It is identical with IEC 60194:2006. T

4、he UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly technology.A list of organizations represented on EPL/501 can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a EUROPEAN STAND

5、ARD EN 60194 NORME EUROPENNE EUROPISCHE NORM July 2006 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2006 CENELEC - All rights

6、 of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60194:2006 E ICS 31.180; 31.190 English version Printed board design, manufacture and assembly - Terms and definitions (IEC 60194:2006) Conception, fabrication et assemblage des cartes imprimes - Termes

7、 et dfinitions (CEI 60194:2006) Konstruktion, Herstellung und Bestckung von Leiterplatten - Begriffe und Definitionen (IEC 60194:2006) This European Standard was approved by CENELEC on 2006-06-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the condi

8、tions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in En

9、glish only. A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, C

10、yprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. Foreword The text of the I

11、nternational Standard IEC 60194:2006, prepared by IEC TC 91, Electronics assembly technology, was submitted to the Unique Acceptance Procedure and was approved by CENELEC as EN 60194 on 2006-06-01 without any modification. This European Standard should be used in conjunction with IEC 60050-541 which

12、 provides for basic technical terms for board assembly technology not included in this standard. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2007-06-01 latest date by whic

13、h the national standards conflicting with the EN have to be withdrawn (dow) 2009-06-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 60194:2006 was approved by CENELEC as a European Standard without any modification. _ INTERNATIONAL STANDARD IEC6

14、0194Fifth edition2006-02Printed board design, manufacture and assembly Terms and definitions Reference number IEC 60194:2006(E) PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY TERMS AND DEFINITIONS 1 Scope This International Standard defines the terminology used in the field of printed circuit boards

15、 and printed circuit board assembly products. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any a

16、mendments) applies. IEC 60050(541), International Electrotechnical Vocabulary (IEV) Chapter 541: Printed circuits 3 General The terms have been classified according to the decimal classification code (DCC) and this DCC number appears to the right of the defined term. The DCC numbering is explained f

17、ully in Annex A. In order to avoid two ID numbers, the usual practice of numbering every paragraph (every term and definition) in front of the paragraph has not been followed in this standard. The official IEC number is the number which follows the DCC and the period (21.xxxx). Annex B provides a li

18、st of acronyms listed numerically according to the DCC number. EN 60194:2006 2 4 Terms and definitions Abrasion Resistance 54.1821 The ability of a material to withstand surface wear. Abrasive Trimming 54.1318 Adjusting the value of a film component by notching it with a finely- adjusted stream of a

19、n abrasive material against the resistor surface. Absorption Coefficients 40.1727 The degree to which various materials absorb heat or radiant energy when compared to each other. Absorptivity, Infra-red 40.0087 The ratio (or percentage) of the amount of energy absorbed by a substrate as compared wit

20、h the total amount of incident energy. Accelerated Aging 93.0001 A test in which the parameters such as voltage and temperature are increased above normal operating values to obtain observable or measurable deterioration in a relatively short period of time. Accelerated Life Test 93.0119 See “Accele

21、rated Aging”. Accelerated Test 93.0216 A test to check the life expectancy of an electronic component or electronic assembly in a short period of time by applying physically severe condition(s) to the unit under test. Accelerator 53.0002 See “Catalyst”. Acceleration Factor (AF) 93.0260 The ratio of

22、stress in reliability testing to the normal operating condition. Acceptance Quality Level (AQL) 90.0003 The maximum number of defectives likely to exist within a population (lot) that can be considered to be contractually tolerable; normally associated with statistically derived sampling plans. Acce

23、ptance Tests 92.0004 Those tests deemed necessary to determine the acceptability of a product and as agreed to by both purchaser and vendor. Acceptance Inspection (Criteria) 92.0288 An inspection that determines conformance of a product to design specifications as the basis for acceptance. Access Ho

24、le 60.1319 A series of holes in successive layers of a multilayer board, each set having their centres on the same axis. These holes provide access to the surface of the land on one of the layers of the board. (See Figure A.1.) Figure A.1 Access hole Access Protocol 21.0005 An agreed principle for e

25、stablishing how nodes in a network communicate electronically. Accordion Contact 36.0006 A type of connector contact that consists of a flat spring formed into a “Z“ shape in order to permit high deflection without overstress. Accuracy 90.0007 The deviation of the measured or observed value from the

26、 true value. Acid Flux 46.0009 A solution of an acid and an inorganic, organic, or water soluble organic flux. (See also “Inorganic Flux,” “Organic Flux,” and “Water Soluble Organic Flux”.) Acid Number 54.0010 The amount of potassium hydroxide in milligrams that is required to neutralize one gram of

27、 an acid medium. EN 60194:2006 3 Acid Value 54.1217 See “Acid Number” Acid-Core Solder 46.0008 Wire solder with a self-contained acid flux. Actinic Radiation 52.0011 Light energy that reacts with a photosensitive material in order to produce an image. Active Desiccant 30.0397 Desiccant that is eithe

28、r fresh (new) or has been baked according to the manufacturers recommendations to renew desiccant to original specifications. Activated Rosin Flux 46.0012 A mixture of rosin and small amounts of organic-halide or organic-acid activators. (See also “Synthetic Activated Flux”.) Activating 53.0013 A tr

29、eatment that renders nonconductive material receptive to electroless deposition. Activating Layer 53.0014 A layer of material that renders a nonconductive material receptive to electroless deposition. Activator 46.0015 A substance that improves the ability of a flux to remove surface oxides from the

30、 surfaces being joined. Active Device 30.0016 An electronic component whose basic character changes while operating on an applied signal. (This includes diodes, transistors, thyristors, and integrated circuits that are used for the rectification, amplification, switching, etc., of analog or digital

31、circuits in either monolithic or hybrid form.) Active Metal 36.0017 A metal that has a very high electromotive force. Active Trimming 54.1321 Adjusting the value of a film circuit element in order to obtain a specified functional output from the circuit while it is electrically activated. Actual Siz

32、e 90.0018 The measured size. Additive Process 53.1322 A Process for obtaining conductive patterns by the selective deposition of conductive material on clad or unclad base material. (See also “Semi-Additive Process” and “Fully-Additive Process”.) Add-On Component 30.0019 Discrete or integrated packa

33、ged or chip components that are attached to a film circuit in order to complete the circuits function. Adhesion (Pressure Sensitive Tape) 46.2038 The bond produced by contact between pressure-sensitive adhesive and a surface. Adhesive 46.1728 A substance such as glue or cement used to fasten objects

34、 together. In surface mounting, an epoxy adhesive is used to adhere SMDs to the substrate. Adhesion Failure 96.0020 The rupture of an adhesive bond such that the separation appears to be at the adhesive-adherent interface. Adhesion Layer 74.0021 The metal layer that adheres a barrier metal to a meta

35、l land on the surface of an integrated circuit. Adhesion Promotion 53.0022 The chemical process of preparing a surface to enhance its ability to be bonded to another surface or to accept an over-plate. Adhesive Coated Substrate 41.0438 A base material upon which an adhesive coating is applied, for t

36、he purpose of retaining the conductive material (either additively applied or attached as foil for subtractive processing), that becomes part of a metal-clad dielectric. Adhesive-Coated Catalyzed Laminate41.1320 A base material with a thin polymer coating, that contains a plating catalyst, that is s

37、ubsequently treated in order to obtain a microporous surface. EN 60194:2006 4 Adhesive-Coated Uncatalyzed Laminate 41.1323 A base material with a thin polymer coating, that does not contain a plating catalyst, that is subsequently treated in order to obtain a microporous surface. Adhesive Transfer (

38、Pressure Sensitive Tape) 75.0558 The transfer of adhesive from its normal position on the pressure sensitive tape to the surface to which the tape was attached, either during unwind or removal. Adsorbed Contaminant 96.0023 A contaminant attracted to the surface of a material that is held captive in

39、the form of a gas, vapour or condensate. Advanced Statistical Method 91.0024 A statistical process analysis and control technique that is more- sophisticated and less widely-applicable than basic statistical methods. Aging 90.0025 The change of a property, e.g. solderability, with time. (See also “A

40、ccelerated Aging”.) Air Contamination 14.0026 See “Air Pollution” Air Pollution 14.0027 Contamination of the atmosphere with substances that are toxic or otherwise harmful. Algorithm 11.0849 A set of procedures for the solution of a problem in a series of steps. Alignment Mark 22.0030 A stylized pat

41、tern that is selectively positioned on a substrate material to assist in alignment. (See Figure A.2). Figure A.2 Alignment mark Aliphatic Solvents 76.0031 “Straight chain“ solvents, derived from petroleum, of low solvent power. Alkaline Cleaner 76.0032 A material blended from alkali hydroxides and a

42、lkaline salts. All Metal Package 33.0579 A hybrid circuit package made solely of metal, without glass or ceramic. Allowable Temperature 75.0609 The temperature range that an electronic circuit or component can perform its intended functions. Alloy, Tin Bismuth (Sn-Bi) 45.1947 An alloy that is used a

43、s a lead free solder and consisting of tin and bismuth as the main constituents. Sn-Bi58 has a low melting point of 138 C, but is not widely used because of its brittle properties. Alloy, Tin Copper (Sn-Cu) 45.1948 An alloy that is used as a lead free solder consisting of tin and copper considered t

44、o be applicable for wave or reflow soldering. Alloy, Tin Silver (Sn-Ag) 45.1949 An alloy that is used as a lead free solder and consisting of tin and silver as the main constituents used as a high temperature solder. Alloy, Tin Silver Bismuth (Sn-Ag-Bi) 45.1950 An alloy that is used as a lead free s

45、older and consisting of tin, silver and bismuth as the main constituents. The Bi in Sn-Ag-Bi alloy reduces the melting temperature. The higher the Bi content is, higher the mechanical strength, but with poorer elongation capability. There is a limit to Bi content. Alloy, Tin Silver Copper (Sn-Ag-Cu)

46、 45.1951 An alloy that is used as a lead free solder consisting of tin, silver and copper as the main constituents. Alloy, Tin Zinc (Sn-Zn) 45.1952 An alloy that is used as a lead free solder and consisting of tin and zinc as the main constituents. Zn09 alloy has the melting point of 199 C, closest

47、to the melting point of Sn-Pb alloy among lead free solders, which allows soldering work at present soldering temperatures, but tends to form a EN 60194:2006 5 stable oxide film, causing difficulty in securing a good solder wetting. Alpha Error 91.0033 The size of a Type I error or the probability o

48、f rejecting a hypothesis that is true. Alphanumerical 25.1729 Pertaining to data that contain the letters of an alphabet, the decimal digits, and may contain control characters, special characters and the space character. Alpha Particle 35.0612 A He4nucleus generated from a nuclear decay that is cap

49、able of generating hole-electron pairs in microelectronic devices and switching cells causing soft errors in some devices. Alternating Current (ac) 21.1793 A current that varies with time, commonly applied to a power source that switches polarity many times per second, in the shape of a sinusoidal, square, or triangular wave. Alternative Hypothesis 93.1324 The supposition that a significant difference exists between the desired results of two comparable popul