ASTM B374-2006(2011) Standard Terminology Relating to Electroplating《电镀的相关标准术语》.pdf

《ASTM B374-2006(2011) Standard Terminology Relating to Electroplating《电镀的相关标准术语》.pdf》由会员分享，可在线阅读，更多相关《ASTM B374-2006(2011) Standard Terminology Relating to Electroplating《电镀的相关标准术语》.pdf（9页珍藏版）》请在麦多课文档分享上搜索。

1、Designation: B374 06 (Reapproved 2011)Endorsed by AmericanElectroplaters SocietyEndorsed by NationalAssociation of Metal FinishersStandard Terminology Relating toElectroplating1This standard is issued under the fixed designation B374; the number immediately following the designation indicates the ye

2、ar oforiginal adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.INTRODUCTIONThese definitions correspond to interpretations as app

3、lied to electroplating and do not necessarilycorrespond to the definitions used in other fields.1. Referenced Documents1.1 ASTM Standards:2B368 Test Method for Copper-AcceleratedAceticAcid-SaltSpray (Fog) Testing (CASS Test)2. Terminologyabrasive blastinga process for cleaning or finishing bymeans o

4、f an abrasive directed at high velocity against thework piece.activatorin diffusion coatings, a chemical, usually a halidesalt, that enters into a reaction with the source or masteralloy, depositing the source on the substrate.activationelimination of a passive condition on a surface.activity (ion)t

5、he ion concentration corrected for deviationsfrom ideal behavior. Concentration multiplied by activitycoefficient.addition agenta material added in small quantities to asolution to modify its characteristics. It is usually added to aplating solution for the purpose of modifying the character ofa dep

6、osit.adhesionthe attractive force that exists between an elec-trodeposit and its substrate that can be measured as the forcerequired to separate an electrodeposit and its substrate.adhesion, practical, nthe force or work required to detachor remove a coating from the underlayer or substrate; it canb

7、e measured in terms of peel, pull, or shear strength as anexperimentally determined quantity.aluminizingforming of an aluminum or aluminum alloycoating on a metal by hot dipping, hot spraying, or diffusion.amorphousnoncrystalline, or devoid of regular structure.amperethe current that will deposit si

8、lver at the rate of0.0011180 g/s. Current flowing at the rate of 1 C/s.angstrm unit (A)108cm.aniona negatively-charged ion.anodethe electrode in electrolysis, at which negative ionsare discharged, positive ions are formed, or other oxidizingreactions occur.anode corrosiondissolution of anode metal b

9、y the electro-chemical action in an electrolytic cell.anode efficiencycurrent efficiency of a specified anodicprocess.anode film(1) the layer of solution in contact with the anodethat differs in composition from that of the bulk of thesolution. (2) The outer layer of the anode itself consisting ofox

10、idation or reaction products of the anode metal.anode polarizationSee polarization.anodic coatinga protective, decorative, or functional coat-ing, formed by conversion of the surface of a metal in anelectrolytic oxidation process.anodizingan electrolytic oxidation process in which thesurface of a me

11、tal, when anodic, is converted to a coatinghaving desirable protective, decorative, or functional prop-erties.anolytethe portion of electrolyte in the vicinity of the anode;in a divided cell, the portion of electrolyte on the anode sideof the diaphragm.anti-pitting agentan addition agent for the spe

12、cific purposeof preventing gas pits in a deposit.autocatalytic platingdeposition of a metal coating by acontrolled chemical reduction, catalyzed by the metal oralloy being deposited.automatic machine (or conveyor)a machine for mechani-cally processing parts through treatment cycles, such ascleaning,

13、 anodizing, or plating.automatic plating: (1) fullplating in which the cathodes areautomatically conveyed through successive cleaning andplating tanks. (2) semiplating in which the cathodes areconveyed automatically through only one plating tank.auxiliary anodea supplementary anode employed during1T

14、his terminology is under the jurisdiction of ASTM Committee B08 onMetallic and Inorganic Coatings and is the direct responsibility of SubcommitteeB08.01 on Ancillary Activities.Current edition approved April 1, 2011. Published April 2011. Originallyapproved in 1961. Last previous edition approved in

15、 2006 as B374 06. DOI:10.1520/B0374-06R10.2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM website.1Copyright ASTM Int

16、ernational, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.electrodeposition to achieve a desired thickness distributionof the deposit.auxiliary cathodeSee thief.back emf (electromotive force)the potential set up in anelectrolytic cell that opposes the flow of cu

17、rrent, caused bysuch factors as concentration polarization and electrodefilms. See emf (electromotive force).ball burnishingSee barrel burnishing.barrel burnishingthe smoothing of surfaces by means oftumbling the work in rotating barrels in the presence ofmetallic or ceramic shot, and in the absence

18、 of abrasive. Inball burnishing, the shot consists of hardened steel balls.barrel electroplatingan electroplating process in whichelectrodeposits are applied to articles in bulk in a rotating,oscillating, or otherwise moving container.barrel finishing (or tumbling)bulk processing in barrels, ineithe

19、r the presence or absence of abrasives or burnishingshot, for the purpose of improving the surface finish.barrel plating (or cleaning)plating or cleaning in which thework is processed in bulk in a rotating container.barrel processingmechanical, chemical, cleaning, or elec-trolytic treatment of artic

20、les in bulk or in a rotating,oscillating, or otherwise moving container.barrier layerin anodizing aluminum, the thin, pore-free,semiconducting aluminum oxide region nearest the metalsurface and distinct from the main anodic oxide coatingwhich has a pore structure.base metal(1) See basis metal;(2) in

21、 diffusion coatings, themetal present in the largest proportion in an alloy.basis metal (or material)material upon which coatings aredeposited.bipolar electrodean electrode that is not directly connectedto the power supply but is so placed in the solution betweenthe anode and the cathode that the pa

22、rt nearest the anodebecomes cathodic and the part nearest the cathode becomesanodic.black oxidea finish on metal produced by immersing a metalin hot oxidizing salts or salt solutions.blastingSee sand blasting; grit blasting; wet blasting.blistera dome-shaped imperfection or defect, resulting fromlos

23、s of adhesion between a metallic deposit and the sub-strate.blooma visible exudation or efflorescence on a surface.blue dipa solution, once widely used, containing a mercurycompound used to deposit mercury upon a metal by immer-sion, usually prior to silver plating.blueingthe formation of a thin oxi

24、de film on steel, either byheating in air, or by immersion in oxidizing solutions.bright dip (nonelectrolytic)a solution used to produce abright surface on a metal.bright electroplatinga process that produces an electrode-posit having a high degree of specular reflectance in theas-plated condition.b

25、right electroplating rangethe range of current densitieswithin which an electroplating solution produces a brightdeposit under a given set of operating conditions.bright platinga process that produces an electrodeposithaving a high degree of specular reflectance in the as-platedcondition.bright plat

26、ing rangethe range of current densities withinwhich a given plating solution produces a bright plate.brighteneran addition agent that leads to the formation of abright plate, or that improves the brightness of the deposit.bright-throwing powerthe measure of the ability of aplating solution or a spec

27、ified set of plating conditions todeposit uniformly bright electroplate upon an irregularlyshaped cathode.bronzingthe application of a chemical finish to copper orcopper alloy surfaces to alter the color.brush platinga method of plating in which the platingsolution is applied with a pad or brush, wi

28、thin which is ananode and which is moved over the cathode to be plated.brush polishing (electrolytic)a method of electropolishing(q.v.) in which the electrolyte is applied with a pad or brushin contact with the part to be polished.buffera compound or mixture that, when contained insolution, causes t

29、he solution to resist change in pH. Eachbuffer has a characteristic limited range of pH over which itis effective.buffingthe smoothing of a surface by means of a rotatingflexible wheel to the surface of which fine, abrasive particlesare applied in liquid suspension, paste, or grease stick form.build

30、ing upelectroplating for the purpose of increasing thedimensions of an article.burn offthe unintentional removal of an autocatalytic de-posit from a nonconducting substrate, during subsequentelectroplating operations, owing to the application of excesscurrent or a poor contact area.burnishingthe smo

31、othing of surfaces by rubbing, accom-plished chiefly by the movement rather than the removal ofthe surface layer.burnt deposita rough, noncoherent or otherwise unsatisfac-tory deposit produced by the application of an excessivecurrent density and usually containing oxides or otherinclusions.bus (bus

32、 bar)a rigid conducting section, for carrying currentto the anode and cathode bars.butler finisha finish composed of fine, uniformly distributedparallel lines, having a characteristic luster usually producedwith rotating wire brushes or cloth wheels with appliedabrasives.calomel half cell (calomel e

33、lectrode) a half cell containinga mercury electrode in contact with a solution of potassiumchloride of specified concentration that is saturated withmercurous chloride (calomel).calorizingimparting resistance to oxidation to an iron orsteel surface by heating in aluminum powder at 800 to1000C (1470

34、to 1830F).CASS test (copper accelerated salt spray) an acceleratedcorrosion test for some electrodeposits and for anodiccoatings on aluminum (see Test Method B368).cataphoresisSee electrophoresis.B374 06 (2011)2cathodethe electrode in electrolysis at which positive ionsare discharged, negative ions

35、are formed, or other reducingactions occur.cathode efficiencythe current efficiency of a specified ca-thodic process.cathode filmthe layer of solution in contact with the cathodethat differs in composition from that of the bulk of thesolution.cathode polarization See polarization.catholytethe portio

36、n of the electrolyte in the vicinity of thecathode; in a divided cell the portion of the cathode side ofthe diaphragm.cationa positively-charged ion.caustic dipin diffusion coatings, a strongly alkaline treat-ment applied by dip or spray for neutralizing acid residues.cementationSee pack cementation

37、.chelate compounda compound in which the metal is con-tained as an integral part of a ring structure and is not readilyionized.chelating agenta compound capable of forming a chelatecompound with a metal ion. See chelate compound.chemical millingthe shaping of a work piece by immersionin an etchant e

38、mploying a resist for selective removal ofmaterial.chemical platingdeposition of a metal coating by chemical,non-electrolytic methods. See also immersion plate, con-tact plating.chemical polishingthe improvement in surface smoothingof a metal by simple immersion in a suitable solution. Seebright dip

39、 (nonelectrolytic).chromatinga process for producing a conversion coatingcontaining chromium compounds.chromizinga surface treatment at elevated temperatures,generally carried out in pack, vapor, or salt baths, in whichan alloy is formed by the inward diffusion of chromium intothe base metal.cleanin

40、gthe removal of grease, oxides, or other foreignmaterial from a surface.alkaline cleaning cleaning by means of alkaline solutions.anodic or reverse cleaningelectrolytic cleaning in whichthe work is the anode.cathodic or direct cleaningelectrolytic cleaning in whichthe work is the cathode.diphase cle

41、aning cleaning by means of solutions thatcontain a solvent layer and an aqueous layer. Cleaning iseffected both by solvent and emulsifying action.direct current cleaningSee cathodic or direct cleaning.electrolytic cleaningalkaline cleaning in which a current ispassed through the solution, the work b

42、eing one of theelectrodes.emulsion cleaning cleaning by means of solutions con-taining organic solvents, water, and emulsifying agents.immersionSee soak cleaning.reverse current cleaningSee anodic or reverse cleaning.soak cleaning cleaning by immersion without the use ofcurrent, usually in alkaline

43、solution.solvent cleaning cleaning by means of organic solvents.spray cleaning cleaning by means of spraying.ultrasonic cleaningcleaning by any chemical means aidedby ultrasonic energy.cleaning-emulsifiable solventtwo-stage cleaning systemwherein a concentrate containing organic solvents andsurface-

44、active agents is applied to a surface, subsequentlyemulsified, and removed along with the soil, by waterrinsing.coating cyclespecific time and temperature to achieve de-sired depth of diffusion.coating, diffusionan alloy coating produced by applyingheat to one or more coatings deposited on a metal s

45、ubstrate.colloidal particlean electrically-charged particle, generallysmaller in size than 200 m, dispersed in a second continu-ous phase.color anodizingin anodizing aluminum, formation of acolored coating on aluminum where the colored compound,pigment, or dye is incorporated after the coating has b

46、eenformed.coloring(1) the production of desired colors on metalsurfaces by appropriate chemical or electrochemical action.(2) light buffing of metal surfaces for the purpose ofproducing a high luster. Called “color buffing.”complex ionan ion composed of two or more ions orradicals, both of which are

47、 capable of independent existence,for example, cuprocyanide (Cu(CN)3)=.complexing agenta compound that will combine with me-tallic ions to form complex ions. See complex posite coatinga coating consisting of deposits incorpo-rating particles of another material. See also posite platean electrodeposi

48、t consisting of two or morelayers of metal deposited successively.concentration polarizationthat part of the total polarizationthat is caused by changes in the activity of the potential-determining components of the electrolyte.conductancethe capacity of a medium, usually expressed inmhos, for trans

49、mitting electric current. The reciprocal ofresistance.conducting salta salt added to the solution in order toincrease its conductivity.conductivityspecific conductancethe current transferredacross unit area per unit potential gradient. In the metricsystem, K = amperes per square centimetre divided by voltsper centimetre. The reciprocal of resistivity.contact platingdeposition of a metal by the use of aninternal source of current by immersi