DLA SMD-5962-90910 REV B-2012 MICROCIRCUIT DIGITAL BIPOLAR ADVANCE SCHOTTKY TTL OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLOCK ENABLE MONOLITHIC SILICON.pdf
《DLA SMD-5962-90910 REV B-2012 MICROCIRCUIT DIGITAL BIPOLAR ADVANCE SCHOTTKY TTL OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLOCK ENABLE MONOLITHIC SILICON.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-90910 REV B-2012 MICROCIRCUIT DIGITAL BIPOLAR ADVANCE SCHOTTKY TTL OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLOCK ENABLE MONOLITHIC SILICON.pdf(13页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update to reflect latest changes in format and requirements. Editorial changes throughout. -les 05-07-15 Raymond Monnin B Update drawing as part of 5 year review. - jt 12-10-17 C. SAFFLE THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED R
2、EV SHEET REV SHEET REV STATUS REV B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Larry T. Gauder DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMEN
3、TS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Tim H. Noh APPROVED BY D. R. Cool MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCE SCHOTTKY, TTL, OCTAL EDGE- TRIGGERED D-TYPE FLIP-FLOP WITH CLOCK ENABLE, MONOLITHIC SILICON DRAWING APPROVAL DATE 91-08-26 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 6726
4、8 5962-90910 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E467-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90910 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR
5、97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When a
6、vailable, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 90910 01 M R A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lea
7、d finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA level
8、s and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type. The device type identify the circuit function as follows: Device type Generic number Circuit function 01 54F377 Octal edge-triggered D-type flip-flop with clock enable 1.2.3 Device class d
9、esignator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535
10、, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 dual-in-line S GDFP2-F20 or CDFP3-F20 20 flat 2 CQCC
11、1-N20 20 square chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING
12、 SIZE A 5962-90910 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage range -0.5 V dc to +7.0 V dc Input voltage -0.5 V dc to +7.0 V dc Storage temperature range . -65C to +150C Maximum power dissipation (PD)
13、 2/ 308 mW Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) . +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Minimum high level input voltage (VIH) . 2.0 V dc Maximum
14、 low level input voltage (VIL) 0.8 V dc Minimum setup time (tS): High, ( CE to CP) 4.0 ns Low, ( CE to CP) 5.0 ns Minimum setup time (tS): High, (Dn to CP) . 3.5 ns Low, (Dn to CP) 4.0 ns Minimum hold time (tH): High, ( CE to CP) 1.5 ns Low, ( CE to CP) 2.5 ns Minimum hold time (tH): High or low, (D
15、n to CP) . 1.0 ns Minimum clock pulse witdth (tW): High or low (CP) . 5.0 ns Maximum clock frequency (Fmax): VCC= 5.0 V dc at +25C . 100 MHz VCC= 4.5 to 5.5 V dc at -55/125C 85 MHz Case temperature range (TC) -55C to +125C _ 1/ Stresses above the absolute maximum rating may cause permanent damage to
16、 the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Maximum power dissipation is defined as VCCx ICCand must withstand the added PDdue to short-circuit output test (e.g., IOS). Provided by IHSNot for ResaleNo reproduction or networking permitted w
17、ithout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90910 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handb
18、ooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF
19、 DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents
20、are available online at https:/assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
21、 this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 as
22、 specified herein, or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for n
23、on-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Ca
24、se outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Test circuit and switching waveforms. The test circuit and swit
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