DLA SMD-5962-11220 REV A-2013 MICROCIRCUIT HYBRID LINEAR SINGLE CHANNEL DC-DC CONVERTER.pdf

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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Replace paragraph 3.2.3 with standard verbiage. For case outline X, remove min dimensions and correct max dimensions for symbols A, B, and C. For case outline Y, remove min dimensions and correct max dimensions for symbols A, C, D, and E. For cas

2、e outline X, switch J and K. For case outline Y, switch L and M. Remove figure 3 “Radiation exposure circuits” Updated paragraph 6.7. -gc 13-07-24 Charles F. Saffle REV SHEET REV A A A A SHEET 15 16 17 18 REV STATUS REV A A A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMI

3、C N/A PREPARED BY Greg Cecil DLA LAND AND MARITIME STANDARD MICROCIRCUIT DRAWING CHECKED BY Greg Cecil COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil/ THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Charles F. Saffle MICROCIRCUIT, HYBRID, LINEAR, SINGLE CHANNEL, DC-DC C

4、ONVERTER AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 11-10-25 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-11220 SHEET 1 OF 18 DSCC FORM 2233 APR 97 5962-E505-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MI

5、CROCIRCUIT DRAWING SIZE A 5962-11220 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes w

6、hich are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 P 11220 01 K X X Federal RHA Device Device Case Lead stock class d

7、esignator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate

8、RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 SVTR283R3S DC-DC converter, 20W, +3.3V output 02 SVTR2805S DC-DC converter, 30W, +5V output 03 SVTR2812S DC-DC conv

9、erter, 40W, +12V output 04 SVTR2815S DC-DC converter, 40W, +15V output 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qu

10、alification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level is intended for use in space applications. H Standard military quality class level. This level

11、is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flo

12、w, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C, and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the de

13、vice acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may ha

14、ve a limited temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-11220 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The

15、case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 10 Dual-in-line Y See figure 1 10 Dual-in-line Flange mount 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum r

16、atings. 1/ Input voltage (continuous) . +50 V dc Input voltage (transient, 1 second) +80 V dc Power dissipation (PD, full load, TC= +125C) . 13 W Output power 40 W Junction temperature rise to case . +15C Storage temperature range . -65C to +150C Lead temperature (soldering, 10 seconds) . +270C 1.4

17、Recommended operating conditions. Input voltage range . +15 V dc to +50 V dc Case operating temperature range (TC). -55C to +125C 1.5 Radiation features. Maximum total dose available (dose rate = 30 - 300 rad(Si)/s) . 30 krad (Si) 3/ Maximum total dose available (dose rate 10 mrad(Si)/s) LDR: Compon

18、ents: 30 krad (Si) 3/ 4/ Hybrid: 5/ Single event phenomenon (SEP) effective linear energy threshold (LET): SEL, SEB, SEGR, SEFI . 44 MeV-cm2/mg 2/ 6/ 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of t

19、his drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Te

20、st Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. 1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Single even

21、t performance is tested with minor transients only; no dropouts, shutdowns, latch up or burn out. 3/ Bipolar device types may degrade from displacement damage from radiation which could affect RHA levels. These device types have not been characterized for displacement damage. 4/ Components: The bipo

22、lar, BiCMOS linear and mixed signal semiconductor components have been tested to High Dose Rate (HDR) Condition C (30-300 rad(Si)/s) and Low Dose Rate (LDR) per condition D of MIL-STD-883, method 1019. The difference between HDR and LDR test results has been compared to determine if the semiconducto

23、rs exhibit ELDRS effect. Low dose rate sensitivity was not demonstrated. 5/ Hybrid: Hybrid devices have been tested at HDR. LDR testing on the device has not been completed. 6/ See table IB. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MI

24、CROCIRCUIT DRAWING SIZE A 5962-11220 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are ava

25、ilable online at http:/quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following documents form a part of this document to the extent specified herein. AMERICAN SOCIETY FOR TESTIN

26、G AND MATERIALS (ASTM) ASTM F 1192 - Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices. 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this dr

27、awing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MI

28、L-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device manufacturers Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein,

29、however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 3.2 Design, construction, and physical dimensions. Th

30、e design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Radiation

31、 exposure circuits. The radiation exposure circuits shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the elect

32、rical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in ta

33、ble I. 3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers vendor similar PIN may also be marked. 3.6 Data. In addition to the general performance requirements of MIL-PR

34、F-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and f

35、or those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DLA Land and Maritime-VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a

36、 manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime-VA shall affirm that the manufacturers product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conforman

37、ce as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-11220 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-399

38、0 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the for

39、m, fit, or function as described herein. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under do

40、cument revision level control and shall be made available to either DLA Land and Maritime-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-S

41、TD-883. (2) TAas specified in accordance with table I of method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. c. PIND testin

42、g, method 2020, condition A, of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-11220 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 TABLE IA. Elec

43、trical performance characteristics. Test Symbol Conditions 1/ 2/ 3/ 4/ 5/ 6/ -55C TC+125C VIN= +28 V dc 5% Full Load unless otherwise specified Group A subgroups Device type Limits Unit Min Max Output Voltage VOUTIOUT= 6.06 A 1 01 3.25 3.35 V dc 2,3 3.2 3.4 IOUT= 6 A 1 02 4.95 5.05 2,3 4.875 5.125 I

44、OUT= 3.33 A 1 03 11.88 12.12 2,3 11.7 12.3 1,2,3 7/ 11.66 12.3 IOUT= 2.67 A 1 01 14.85 15.15 2,3 14.625 15.375 1,2,3 7/ 14.565 15.4 Output Current 8/ 9/ IOUTVIN= 15 V dc to 50 V dc 1,2,3 01 6.06 A 02 6.00 03 3.33 04 2.67 VOUTRipple Voltage VRIP BW = 20 Hz to 10 MHz 1,2,3 All 50 mVp-p VOUTLine Regula

45、tion VRLINEVIN= 15 V dc to 50 V dc 1,2,3 All 20 mV VOUTLoad Regulation VRLOADNo Load to Full Load 1,2,3 All 50 mV Input Current IINIOUT= 0, Inhibit (Pin 1) = 0 1,2,3 All 6 mA IOUT= 0, Inhibit (Pin 1) = open 90 IINRipple Current IRIPBW = 20 Hz to 10 MHz 1,2,3 All 50 mAp-p 1 7/ 50 2,3 7/ 70 Efficiency

46、 Eff IOUT= 6.06 A 1,2,3 01 65 % IOUT= 6 A 02 72 IOUT= 3.33 A 03 76 IOUT= 2.67 A 04 77 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-11220 DLA LAND AND MARITIME COLUMBUS, OHIO

47、43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 TABLE IA. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ 2/ 3/ 4/ 5/ 6/ -55C TC+125C VIN= +28 V dc 5% Full Load unless otherwise specified Group A subgroups Device type Limits Unit Min Max Isolation ISO 500 V dc

48、, TC= +25C 1 All 100 M Capacitive Load 10/ CLNo effect on DC performance, TC= +25C 1 01,02 1000 F 03,04 500 Short Circuit Power Dissipation PDShort Circuit 1,2,3 01,02 16 W 03,04 14 Switching Frequency FS1,2,3 All 400 550 kHz Synchronization Frequency FSYNCVH VL= 5 V, Duty Cycle = 20% - 80% 1,2,3 All 500 600 kHz VOUTStep Load Transient VTLOAD50% Load to 100% Load 4,5,6 01 400 mV pk 02 500 03,04 700 VOUTStep Load Transient Recovery 11/ TTLOAD50% Load to 100% Load 4,5,6 A