DLA MIL-PRF-83531 C-2008 DELAY LINES PASSIVE GENERAL SPECIFICATION FOR.pdf

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1、 Comments, suggestions or questions on this document should be addressed to Defense Supply Center Columbus, ATTN: VAT, Post Office Box 3990, Columbus, OH 43218-3990), or emailed to relaydla.mil. Since contact information can change, you may want to verify the currency of this address information usi

2、ng the ASSIST Online database at assist.daps.dla.mil. AMSC N/A FSC 5999 INCH-POUND MIL-PRF-83531C 7 October 2008 SUPERSEDING MIL-PRF-83531B 15 December 1998 PERFORMANCE SPECIFICATION DELAY LINES, PASSIVE, GENERAL SPECIFICATION FOR This specification is approved for use by all Departments and Agencie

3、s of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the general requirements for fixed passive (tapped and untapped) pulse delay lines. The specification has two product levels, a high reliability screening level “M” and screening level “C”. 1.2 Classification. 1.2.1 Part o

4、r Identifying Number (PIN). Delay lines specified herein (see 3.1) will be identified by a PIN which consists of the military designator, the basic number of the associated specification, and assigned dash number (see 3.1), and a screening level that indicates the level of quality and reliability (s

5、ee 1.3.1). The PIN will be in the following form derived as indicated: Screening Level “M” M83531 /01 -001 Specification sheet number Specification sheet number (note zero) Dash number (See table I) Screening Level “C” C83531 /01 -001 Specification sheet number Specification sheet number (note zero)

6、 Dash number (See table I) Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-83531C 2 1.3.1 Screening level. The screening level is identified by a single letter M or C. Use screening level M for high reliability military applications (see 4.5.

7、2.2) and level C for general-purpose military applications (see 4.4, 4.4.7e, and 4.5.2.1). 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this specif

8、ication or recommended for additional information for examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements documents cited in sections 3 and 4 of this specification, whether or not they are lis

9、ted. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract

10、. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-55342 - Resistors, Fixed, Film, Chip, Nonestablished Reliability, Established Reliability, Space Level, General Specification for. MIL-PRF-55681 - Capacitor, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Established Reliability and Non-Established Re

11、liability, General Specification for. MIL-PRF-83531/1B - Delay Lines, 10-Tap, Dual-In-Line, 14-Pin. MIL-PRF-83531/4 - Delay Lines, 10-Tap, Dual-In-Line, 14-Pin, Surface Mount Device. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-202 - Test Method Standard, Electronic and Electrical Component Parts. MIL-ST

12、D-790 - Established Reliability and High Reliability Qualified Products List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specification. MIL-STD-810 - Environmental Test Methods and Engineering Guidelines. MIL-STD-1285 - Marking of Electrical and Electronic Parts. (Copies of these

13、 documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Non-Government publications. The following documents form a part of this documen

14、t to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. ELECTRONIC INDUSTRIES ASSOCIATION (EIA) STANDARD EIA Standard -557-A - Statistical Process Control Systems. (Copies of this document are available online at ww

15、w.eia.org or from ECA/EIA Standards and Technology, 2500 Wilson Boulevard, Arlington, VA 22201-3834.) Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-83531C 3 2.4 Order of precedence. In the event of a conflict between the text of this docume

16、nt and the references cited herein (except for associated specifications, specification sheets, or MS standards), the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3

17、.1 Specification sheets. The individual item requirements shall be as specified herein and in accordance with the applicable specification sheet. In the event of any conflict between the requirements of this specification and the specification sheet, the latter shall govern. 3.2 Qualification. Delay

18、 lines furnished under this specification shall be products which are authorized by the qualifying activity for listing on the applicable qualified products list at the time of award of contract (see 4.4 and 6.4). 3.3 Qualified Products List (QPL) system. The manufacturer shall establish and maintai

19、n a QPL system for parts covered by this specification. Requirements for this system are specified in MIL-STD-790. Delay lines shall be subjected to and pass all applicable requirements, tests, and inspections specified herein, including qualification and quality conformance inspection requirements.

20、 3.3.1 Statistical Process Control (SPC). As part of the overall MIL-STD-790 QPL system, the manufacturer shall establish an SPC system that meets the requirements of EIA-557. 3.3.2 Electrostatic discharge (ESD) control program. As part of the overall MIL-STD-790 QPL system, the manufacturer shall e

21、stablish and maintain an ESD control system. As a minimum, this program shall address the identification of ESD sensitive (ESDS) sub-components and end items, facilities, training design protection, handling procedures, marking, cleaning, packaging, and verification. 3.4 Materials. The materials sha

22、ll be as specified herein; however, when a definite material is not specified, a material shall be used which will enable the delay lines to meet the performance requirements of this specification. 3.4.1 Flammable materials. Materials used in the construction of delay lines shall be nonflammable and

23、 non-explosive. 3.4.2 Corrosive materials. Corrosive materials used in any of the manufacturing processes shall be removed or neutralized so that no corrosion will result from such use. Materials used in the construction of delay lines shall be non-corrosive. 3.4.3 Solder and soldering flux. Solder

24、and soldering flux shall be of such quality as to enable the delay lines to meet all the requirements of this specification. 3.4.4 Case material. Unless otherwise specified (see 3.1), cases may be of metallic or nonmetallic material. All metallic surfaces shall be protected against corrosion and sha

25、ll be free from blisters and other defects which may affect the protective properties of this finish. 3.4.5 Terminals. The terminals shall facilitate soldering and meet the performance specifications provided within this specification (see 3.1). The use of tin plating is prohibited. Use of tin-lead

26、finishes Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-83531C 4 are acceptable provided that the minimum lead content is 3 percent. For additional information and guidance on terminals, see 6.5. 3.4.5.1 Solder dip/retinning leads. Only the

27、manufacturer (or his authorized category B or C distributor) may solder dip/retin the leads of products supplied to this specification, provided the solder dip process (see appendix A, 3.2.3) has been approved by the qualifying activity. Provided by IHSNot for ResaleNo reproduction or networking per

28、mitted without license from IHS-,-,-MIL-PRF-83531C 5 TABLE I. Qualification inspection. Inspection Requirement paragraph Test method paragraph Number of sample units Number ofallowable failures Q-I Dimensions Thermal shock (50 cycles) Seal Electrical characteristics Visual inspections 1/ 3.5.1 3.6 3

29、.7 3.8 3.5.2 4.6.2 4.6.4 4.6.5 4.6.6 4.6.3 22 2 Q-II Moisture resistance Salt spray (corrosion) (metal cases only) Vibration Shock Electrical characteristics Visual inspection 1/ 3.11 3.12 3.13 3.14 3.8 3.5.2 4.6.9 4.6.10 4.6.11 4.6.12 4.6.6 4.6.3 6 0 Q-III Life Terminal strength Fungus 2/ Electrica

30、l characteristics Dielectric withstanding voltage at reduced barometric pressure Visual inspection 1/ 3.15 3.16 3.17 3.8 3.18 3.5.2 4.6.13 4.6.14 4.6.15 4.6.6 4.6.16 4.6.3 6 0 Q-IV Resistance to soldering heat Flammability 3.19 3.20 4.6.17 4.6.18 4 0 Q-V Resistance to solvents Solderability 3.9 3.10

31、 4.6.7 4.6.8 4 0 1/ The “JAN“ or “J“ marking and PIN are not required on qualification samples. 2/ The fungus test shall not be performed if the manufacturer provides certification that all external materials are non-nutrient to fungus growth or suitably treated to retard fungus growth. 3.4.5.2 Meni

32、scus. Terminals shall be free of case meniscus or other foreign material and shall be solderable for a minimum of .010 inch (0.25 mm) above the seating plane of the delay line. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-83531C 6 3.4.6 Pa

33、ssive circuit elements. Capacitors shall be qualified or screened to MIL-PRF-55681. Resistors shall be qualified or screened to MIL-PRF-55342. The inductor shall be so designed as to allow the delay line to meet the requirements specified herein. 3.4.7 Magnet wire. Magnet wire, when used shall be se

34、lected to enable the part to meet the requirements of this specification. Additional information and guidance on magnet wire is provided in 6.6. 3.4.8 Pure tin. Use of pure tin, plating or otherwise, is prohibited internally and externally (see 6.9). Use of tin-lead finishes are acceptable provided

35、that the minimum lead continent is 3 percent. Acceptance or approval of any constituent material shall not be construed as a guaranty of the acceptance of the finished product (see 4.6.1). 3.5 Interface and physical dimensions. Delay lines shall meet the interface and physical dimensions specified (

36、see 3.1), and shall meet all performance requirements and product characteristics specified herein. 3.5.1 Dimensions. When delay lines are inspected in accordance with 4.6.2, the dimensions shall be within the tolerances specified on the applicable specification sheet (see 3.1). 3.5.2 Visual inspect

37、ion. When delay lines are inspected in accordance with 4.6.3, they shall not exhibit flaking, pitting, blistering, peeling, cracks, bursting, bulging, or other defects. The delay lines shall also meet the requirements of 3.1, 3.22, and 3.23. 3.6 Thermal shock. When delay lines are tested as specifie

38、d in 4.6.4, not more than 10 percent of the surface shall have peeling, flaking, chipping, cracking, or other impairment of the protective finish; no evidence of other physical damage such as cracks, bursting, or bulging of the case; or other defects that would affect the mechanical or electrical op

39、eration, and there shall be no electrical discontinuity. 3.7 Seal. When delay lines are tested as specified in 4.6.5 there shall be no evidence of continuous air bubble flow or compound leakage. 3.8 Electrical characteristics. Delay lines shall be capable of meeting all the electrical requirements s

40、pecified (see 3.1 and 3.8.1 through 3.8.8). 3.8.1 Delay time. When tested in accordance with 4.6.6.1.1, the overall specified delay time of the line shall be as specified. The input-to-tap and tap-to-sequential tap shall be as specified (see 3.1). 3.8.2 Rise time. When measured in accordance with 4.

41、6.6.1.2, the rise time of pulses taken at the point of maximum delay shall not exceed the value specified (see 3.1). The rise time measured at the taps shall not exceed the rise time required at the point of maximum delay. 3.8.3 Voltage attenuation. When measured in accordance with 4.6.6.1.3, the vo

42、ltage attenuation of pulses taken at the point of maximum delay with respect to the input pulse amplitude shall not exceed the value specified (see 3.1). The voltage attenuation measured at the taps shall not exceed the voltage attenuation required at the point of maximum delay. 3.8.4 Distortion. Un

43、less otherwise specified (see 3.1), when measured in accordance with 4.6.6.1.4, the all encompassing distortion of pulses appearing at the point of maximum delay shall not exceed 15 percent. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-835

44、31C 7 3.8.5 Delay time variation with temperature. When tested in accordance with 4.6.6.1.5, the delay time variation with temperature shall not exceed the value specified (see 3.1). 3.8.6 DC resistance. When delay lines are tested as specified in 4.6.6.1.6, the dc resistance shall be as specified (

45、see 3.1). 3.8.7 Nominal characteristic impedance. When tested in accordance with 4.6.6.1.7, nominal characteristic impedance shall be as specified on individual specification sheets (see 3.1). 3.8.8 Insulation resistance. Unless otherwise specified (see 3.1), when delay lines are tested in accordanc

46、e with 4.6.6.1.8, the minimum insulation resistance shall be 1,000 megohms (M). 3.9 Resistance to solvents. When delay lines are tested as specified in 4.6.7, there shall be no evidence of mechanical damage, and the markings shall remain legible. The paint or exterior finish shall not soften, peel,

47、or show other signs of deterioration. 3.10 Solderability. When delay lines are tested as specified in 4.6.8, they shall meet the applicable criteria for terminal evaluation in the test method. 3.11 Moisture resistance. When tested in accordance with 4.6.9, there shall be no evidence of other physica

48、l damage that would affect the mechanical or electrical operation of the delay line. There shall be no evidence of electrical discontinuity. 3.12 Salt spray (corrosion) (metal cases only) (when specified, see 3.1). When delay lines are tested as specified in 4.6.10, there shall be no evidence of cor

49、rosion as exhibited by any visible degradation of the surfaces that can be attributed to flaking, pitting, blistering, or otherwise loosened protective coating or metal surface. 3.13 Vibration. When delay lines are tested as specified in 4.6.11, there shall be no leakage of filling material and no evidence of other physical damage such as cracks, bursting, or bulging of the case. There shall be no ev