BS EN 61193-3-2013 Quality assessment systems Selection and use of sampling plans for printed board and laminate end-product and in-process auditing《质量评定体系 印刷电路板和层板制成品和过程审核的抽样方案的选择.pdf

《BS EN 61193-3-2013 Quality assessment systems Selection and use of sampling plans for printed board and laminate end-product and in-process auditing《质量评定体系 印刷电路板和层板制成品和过程审核的抽样方案的选择.pdf》由会员分享，可在线阅读，更多相关《BS EN 61193-3-2013 Quality assessment systems Selection and use of sampling plans for printed board and laminate end-product and in-process auditing《质量评定体系 印刷电路板和层板制成品和过程审核的抽样方案的选择.pdf（68页珍藏版）》请在麦多课文档分享上搜索。

1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationBS EN 61193-3:2013Quality assessment systemsPart 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing BS EN 61193-3:2013 BRIT

2、ISH STANDARDNational forewordThis British Standard is the UK implementation of EN 61193-3:2013. It is identical to IEC 61193-3:2013.This edition includes information regarding sampling procedures for inspection by attributes. The international committee responsible for sampling procedures is ISO TC

3、69-5.The users attention is drawn to BS 6001-1 Sampling procedures for inspection by attributes for further information. Sampling schemes indexed by acceptance quality limit (AQL) for lot-by-lot inspection also provides useful information on sampling procedures.The UK participation in its preparatio

4、n was entrusted to Technical Committee EPL/501, Electronic Assembly Technology.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its corr

5、ect application. The British Standards Institution 2013. Published by BSI Standards Limited 2013.ISBN 978 0 580 62104 8 ICS 31.190 Compliance with a British Standard cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standards Policy and Stra

6、tegy Committee on 30 June 2013. Amendments/corrigenda issued since publicationDate Text affected EUROPEAN STANDARD EN 61193-3 NORME EUROPENNE EUROPISCHE NORM April 2013 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee

7、 fr Elektrotechnische Normung Management Centre: Avenue Marnix 17, B - 1000 Brussels 2013 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61193-3:2013 E ICS 31.190 English version Quality assessment systems - Part 3: Selection and

8、 use of sampling plans for printed board and laminate end-product and in-process auditing (IEC 61193-3:2013) Systme dassurance de la qualit - Partie 3: Choix et utilisation de plans dchantillonnage pour cartes imprimes et produits finis stratifis et audits en cours de fabrication (CEI 61193-3:2013)

9、Qualittsbewertungssysteme - Teil 3: Auswahl und Anwendung von Stichprobenanweisungen fr Endprodukte von Leiterplatten und Laminaten und fertigungsbegleitende Auditierung (IEC 61193-3:2013) This European Standard was approved by CENELEC on 2013-02-28. CENELEC members are bound to comply with the CEN/

10、CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Cent

11、re or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same statu

12、s as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania,

13、 Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. EN 61193-3:2013 - 2 - Foreword The text of document 91/1061/FDIS, future edition 1 of IEC 61193-3, prepared by IEC TC 91 “Electronics assembly techno

14、logy“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 61193-3:2013. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2013-11-28 latest date by

15、 which the national standards conflicting with the document have to be withdrawn (dow) 2016-02-28 Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such pat

16、ent rights. Endorsement notice The text of the International Standard IEC 61193-3:2013 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60068-2-20 NOTE Harmonized

17、as EN 60068-2-20. IEC 60068-2-38 NOTE Harmonized as EN 60068-2-38. IEC 61189-2 NOTE Harmonized as EN 61189-2. IEC 61189-3 NOTE Harmonized as EN 61189-3. IEC 61193-1 NOTE Harmonized as EN 61193-1. IEC 61193-2 NOTE Harmonized as EN 61193-2. IEC 62326-1 NOTE Harmonized as EN 62326-1. IEC 62326-4-1 NOTE

18、 Harmonized as EN 62326-4-1. ISO 14001 NOTE Harmonized as EN ISO 14001. BS EN 61193-3:2013- 3 - EN 61193-3:2013 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part, are normatively referen

19、ced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modificat

20、ions, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60194 2006 Printed board design, manufacture and assembly - Terms and definitions EN 60194 2006 IEC 62326-4 1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectiona

21、l specification EN 62326-4 1997 ISO 9000 2005 Quality management systems - Fundamentals and vocabulary EN ISO 9000 2005 ISO 14560 2004 Acceptance sampling procedures by attributes - Specified quality levels in nonconforming items per million - - BS EN 61193-3:2013 2 61193-3 IEC:2013 CONTENTS FOREWOR

22、D . 4 INTRODUCTION . 6 1 Scope . 7 2 Normative references 7 3 Terms and definitions . 7 4 Sampling methodologies . 9 4.1 General . 9 4.2 Attribute sampling plans. 10 4.2.1 General . 10 4.2.2 Continuous sampling 10 4.2.3 Production lot attributes . 10 4.2.4 Production lot variables 10 4.3 Non-statist

23、ical sampling plans 11 4.4 Defining c = 0 plans . 11 5 Classification of attributes . 16 5.1 General . 16 5.2 Classification assignment 17 5.3 Classification and adjustment of sampling plan criteria . 18 5.4 Process control 18 6 Defects and process deviation indicator (PDI) evaluation . 19 6.1 Gener

24、al . 19 6.2 Process control and process improvement requirements 19 7 Inspection plans 19 7.1 General . 19 7.2 Zero acceptance number-based sampling plans . 20 7.3 Responsible authority 20 7.4 Application. 20 7.5 Sampling plan specification 20 7.6 Submission of product . 21 8 Classification of defec

25、ts 23 8.1 General . 23 8.2 Customers detail specification (CDS) data . 23 9 Percent defectives per million opportunities . 23 9.1 General . 23 9.2 Classes of DPMO 24 9.2.1 General . 24 9.2.2 DPMO-1 Functional non-conformances only 24 9.2.3 DPMO-2 Electrical non-conformances . 24 9.2.4 DPMO-3 Visual/

26、mechanical non-conformances . 24 9.2.5 DPMO-4 hermetic non-conformances 24 9.2.6 DPMO-5 all non-conformances 24 9.3 Estimation of DPMO 24 9.3.1 General . 24 9.3.2 DPMO reporting . 24 9.4 DPMO calculations 25 BS EN 61193-3:201361193-3 IEC:2013 3 9.4.1 General . 25 9.4.2 Sampling requirements 25 10 Us

27、e of sampling plans . 25 10.1 General . 25 10.2 Grouping of tests . 25 10.3 Categorization . 26 10.4 In-process testing and control 26 10.5 Indirect measuring methods . 27 Annex A (informative) Example of consensus sampling plan for three levels of conformance to requirements of IEC 62326-4 multilay

28、er printed boards . 28 Annex B (informative) Example of consensus sampling plan . 49 Annex C (informative) Operating characteristics curves and values . 52 Bibliography 60 Figure 1 Typical OC curve for c 0 plan . 13 Figure 2 OC curve comparisons between c 0 and c = 0 plans . 14 Figure 3 Systematic p

29、ath for implementing process control . 19 Figure 4 Non-conforming attributes with specification requirements 22 Figure C.1 Lot size 2 to 8 . 53 Figure C.2 Lot size 9 to 15 . 53 Figure C.3 Lot size 16 to 25 54 Figure C.4 Lot size 26 to 50 54 Figure C.5 Lot size 51 to 90 55 Figure C.6 Lot size 91 to 1

30、50 55 Figure C.7 Lot size 151 to 280 56 Figure C.8 Lot size 281 to 500 56 Figure C.9 Lot size 501 to 1 200 . 57 Figure C.10 Lot size 1 201 to 3 200 57 Figure C.11 Lot size 3 201 to 10 000 58 Figure C.12 Lot size 10 001 to 35 000 58 Figure C.13 Lot size 35 000 to 150 000. 59 Figure C.14 Lot size 150

31、001 to 500 000 . 59 Table 1 Inspection plan comparison 14 Table 2 Risk management index values (Associated AQ Limits) 15 Table 3 Sample size selection guideline . 16 Table 4 Worst-case use environments 17 Table 5 General sample plan criteria per industry markets/technology sectors 21 Table 6 Process

32、 control 27 Table A.1 Performance requirements . 28 Table B.1 Guideline for qualification and conformance inspection . 50 Table C.1 Lot sizes 52 Table C.2 Small lot characteristics 52 BS EN 61193-3:2013 4 61193-3 IEC:2013 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ QUALITY ASSESSMENT SYSTEMS Part 3:

33、 Selection and use of sampling plans for printed board and laminate end-product and in-process auditing FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The o

34、bject of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifica

35、tions (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations lia

36、ising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters expre

37、ss, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committ

38、ees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National

39、 Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not

40、 provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have th

41、e latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever

42、, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications

43、 is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard I

44、EC 61193-3 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this standard is based on the following documents: FDIS Report on voting 91/1061/FDIS 91/1080/RVD Full information on the voting for the approval of this standard can be found in the report on vo

45、ting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. BS EN 61193-3:201361193-3 IEC:2013 5 A list of all parts of the IEC 61193 series, under the general title Quality assessment systems, can be found on the IEC website. The committee

46、 has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition,

47、or amended. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. BS EN 61193-3:2013 6 61193-3 IEC:2

48、013 INTRODUCTION A clear description in IEC standards and specifications and their reference to sampling plans in order to insure adherence to customer requirements is essential. All the details should be clear as to their implementation or adjustment for evaluation of the product to be shipped, the

49、 use of process control and SPC, or the applicability for using these principles in controlled experimentation. The general characteristics of these principles relate to a gradual reduction that might be needed in examining the product being manufactured. As such, they are sometimes referred to as the logical steps to process improvement. These steps are as follows. a) STATISTICAL SAMPLING: where, when, and why To determine a proper