BS EN 61193-1-2002 Quality assessment systems - Registration and analysis of defects on printed board assemblies《质量评定体系 印制板装配件的缺陷登记和分析》.pdf

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1、BRITISH STANDARD BS EN 61193-1:2002 IEC 61193-1:2001 Incorporating Corrigendum No. 1 Quality assessment systems Part 1: Registration and analysis of defects on printed board assemblies The European Standard EN 61193-1:2002 has the status of a British Standard ICS 31.180 NO COPYING WITHOUT BSI PERMIS

2、SION EXCEPT AS PERMITTED BY COPYRIGHT LAWBS EN 61193-1:2002 This British Standard, having been prepared under the direction of the Electrotechnical Sector Policy and Strategy Committee, was published under the authority of the Standards Policy and Strategy Committee on 6 May 2002 BSI 14 May 2002 ISB

3、N 0 580 39443 3 National foreword This British Standard is the official English language version of EN 61193-1:2002. It is identical with IEC 61193-1:2001. The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly technology, which has the responsibili

4、ty to: A list of organizations represented on this committee can be obtained on request to its secretary. From 1 January 1997, all IEC publications have the number 60000 added to the old number. For instance, IEC 27-1 has been renumbered as IEC 60027-1. For a period of time during the change over fr

5、om one numbering system to the other, publications may contain identifiers from both systems. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Standards Catalogue under the section entitled “Internation

6、al Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a Britis

7、h Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and

8、European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front cover, the EN title page, pages 2 to 22, an inside back cover and a back cover. The BSI copyright date displayed in this document indicates when the document was last issued.

9、Amendments issued since publication Amd. No. Date Comments 13939 Corrigendum No.1 14 May 2002 Correction to IEC date on covers.EUROPEAN STANDARD EN 61193-1 NORME EUROPENNE EUROPISCHE NORM February 2002 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Ele

10、ctrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2002 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61193-1:2002 E ICS 31.190 English version Quality asses

11、sment systems Part 1: Registration and analysis of defects on printed board assemblies (IEC 61193-1:2001) Systme dassurance de la qualit Partie 1: Enregistrement et analyse des dfauts sur les cartes imprimes quipes (CEI 61193-1:2001) Qualittsbewertungssysteme Teil 1: Protokollierung und Analyse von

12、Fehlern auf bestckten Leiterplatten (IEC 61193-1:2001) This European Standard was approved by CENELEC on 2002-02-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard withou

13、t any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language

14、 made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Ge

15、rmany, Greece, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom.EN 69113-:10022 - 2 - Foreword The text of document 91/265/FDIS, future edition 1 of IEC 61193-1, prepared by IEC TC 91, Electronics assembly technology, was submit

16、ted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 61193-1 on 2002-02-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2002-11-01 latest date by which t

17、he national standards conflicting with the EN have to be withdrawn (dow) 2005-02-01 Annexes designated “normative“ are part of the body of the standard. Annexes designated “informative“ are given for information only. In this standard, annexes A and ZA are normative and annexes B, C and D are inform

18、ative. Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 61193-1:2001 was approved by CENELEC as a European Standard without any modification. _ Page2 EN611931:2002 2002lirpA81ISB 2egaP 2002:139116NE 2002yaM3ISB 2egaP 2002:139116NE BSI6May2002 Page2

19、EN611931:2002 BSI6May200269113-CEI 1:0210 3 CONTENTS INTRODUCTION 4 1 Scope 5 2 Normative references. 5 3 Terms and definitions 6 4 Defect registration . 9 4.1 Accept criteria 9 4.2 Counting of defects. 9 4.3 Post-soldering defect registration 10 4.3.1 Defects found after testing.10 4.4 Defect subdi

20、vision .10 4.4.1 Defect sources.10 4.4.2 Defect registration form .10 4.5 Rework immediately prior to soldering .11 4.6 Defect data categories.11 5 Processing the data11 6 Analysis12 Annex A (normative) Subprocesses.13 Annex B (informative) Examples of product defect qualification.14 Annex C (inform

21、ative) Examples of calculations .16 Annex D (informative) Example of registration of defects and processing of the data 18 Annex ZA (normative) Normative references to international publications with their corresponding European publications21 Figure B.1 Registration of defects 15 Figure D.1 Data fo

22、r defect registration18 Figure D.2 Subdivision into type of defect 19 Figure D.3 Subdivision into type of component.19 Figure D.4 Subdivision into defect source.19 Figure D.5 ppm level printed board A, of the past 10 production days 20 Figure D.6 ppm levels of the production per type of board20 Tabl

23、e A.1 Descriptions for subprocesses13 Table C.1 Example 1 (100 % check).16 Table C.2 Example 2 (random check).17 Table D.1 Three subdivisions .19 Page3 EN611931:2002 2002lirpA81ISB 3egaP 2002:139116NE 2002yaM3ISB Page3 EN611931:2002 BSI6May200269113-CEI 1:0210 4 INTRODUCTION This part of IEC 61193 e

24、nables the counting of defects on soldered printed board assemblies in the manufacture of electronic circuits and the associated calculation of ppm (parts per million) data to be carried out in a standard manner. The number of defects occurring during the production process is usually expressed at l

25、ower defect levels in parts per million, commonly indicated as ppm. On the face of it, the meaning of the ppm value of a soldering process is self-evident: a part is, in this context, a soldered joint that is defective, the million refers to a million soldered joints. For a uniform registration of d

26、efects it is emphasized that in this standard the soldering defects are counted immediately after the actual soldering operation (on emergence of the soldered assembly from the soldering machine). By the Pareto analysis method it can be assessed whether the defect should be attributed to the solderi

27、ng process proper or to another cause. In order to manage the ppm values to be calculated, there is a need to understand the mathematical significance of the number of defects found in a batch of a particular size (i.e. smaller than the size of the entire lot of products) and its consequences for th

28、e entire lot. Mentioning the ppm value of a certain soldering process, without reference to the number of soldered joints and without giving the level of confidence is of little use. For making ppm calculations, several methods are described by which the maximum ppm level to be expected can be deter

29、mined, for example: by using the formula that describes the binomial distribution to construct this distribution; by using graphs or tables from the literature. Page4 EN611931:2002 2002lirpA81ISB 4egaP 2002:139116NE 2002yaM3ISB Page4 EN611931:2002 BSI6May200269113-CEI 1:0210 5 QUALITY ASSESSMENT SYS

30、TEMS Part 1: Registration and analysis of defects on printed board assemblies 1 Scope This part of IEC 61193 defines methods of registration and analysis of defects on soldered printed board assemblies. Methods are described to allow effective comparison of perform- ance between products, processes

31、and production locations and can serve as a basis for general quality improvement. The standard specifies defect data collection in two categories. Category 1 ppm data: this category provides data for registration purposes intended to enable overall performance comparison of assembly operations. Cat

32、egory 2 ppm data: this category provides data intended for individual subprocess assessment, analysis and control purposes. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For unda

33、ted references, the latest edition of the referenced document (including any amendments) applies. IEC 60194, Printed board design, manufacture and assembly Terms and definitions IEC 61191-1, Printed board assemblies Part 1: Generic specification Requirements for soldered electrical and electronic as

34、semblies using surface mount and related assembly technologies IEC 61191-2, Printed board assemblies Part 2: Sectional specification Requirements for surface mount soldered assemblies IEC 61191-3, Printed board assemblies Part 3: Sectional specification Requirements for through-hole mount soldered a

35、ssemblies IEC 61191-4, Printed board assemblies Part 4: Sectional specification Requirements for terminal soldered assemblies IEC 61192-1, Product performance requirements Part 1: Generic standard Workmanship requirements and guidelines for soldered electronic assemblies 1 IEC 61192-2, Product perfo

36、rmance requirements Part 2: Sectional standard Workmanship requirements and guidelines for soldered surface mount electronic assemblies 1 _ 1To be published. Page5 EN611931:2002 2002lirpA81ISB 5egaP 2002:139116NE 2002yaM3ISB Page5 EN611931:2002 BSI6May200269113-CEI 1:0210 6 IEC 61192-3, Product perf

37、ormance requirements Part 3: Sectional standard Workmanship requirements for through-hole mount soldered assemblies 2 IEC 61192-4, Product performance requirements Part 4: Sectional standard Workmanship requirements for terminal soldered connections 2 3 Terms and definitions For the purposes of this

38、 part of IEC 61193 the definitions in IEC 60194 3and the following apply. Where appropriate, an alpha-numerical code has been assigned to the term in order to assist the registration and disposition of defects or process deviation indicators. 3.1 general characterizations conditions or attributes of

39、 the final electronic assembly that may be compared to the require- ments of the appropriate documentation or performance specification 3.1.1 defect registration uniform registration system for collecting information on electronic assembly attributes that can be accredited to a subprocess or a final

40、 product configuration, made before any touch-up or repair process 3.1.2 subprocesses major manufacturing functions used to produce electronic assemblies that are an integral part of the manufacturing process to which process deviation indicators or defects defining non- conforming attributes may be

41、 assigned 3.1.3 printed board solder joint electrical/mechanical connection to a printed board or other interconnecting structure that employs solder for the joining of two or more metal surfaces NOTE See also the definitions of cold soldered connection, disturbed soldered connection, excess soldere

42、d connection, insufficient soldered connection, overheated soldered connection, preferred soldered connection and rosin soldered connection in IEC 60194. 3.2 solder paste application (P0) subprocess used to apply solder paste to a land pattern on a printed board or interconnecting structure for the

43、purpose of attaching components using solder reflow techniques 3.2.1 paste misalignment (P1) image of solder paste geometric profiles positioned so that they are not registered to the land pattern on the printed board/interconnecting structure used to mount components _ 2To be published. 3Certain de

44、finitions of IEC 60194 have been translated into French. Page6 EN611931:2002 2002lirpA81ISB 6egaP 2002:139116NE 2002yaM3ISB Page6 EN611931:2002 BSI6May200269113-CEI 1:0210 7 3.2.2 excessive paste (P2) solder paste geometric profiles that consist of greater paste volume than that defined by the assem

45、bly process details 3.2.3 insufficient/no paste (P3) solder paste geometric profiles that consist of less paste volume than that defined by the assembly process details 3.2.4 paste smearing (P4) solder paste application that results in the paste being spread over the mounting surface in an uncontrol

46、led manner rather than having a neat and well-defined geometric profile 3.2.5 paste bridging (P5) solder paste geometric profiles that are touching or have merged across more than one conductive pattern 3.2.6 paste deposit shape (P6) specific solder paste geometric profile located on the printed boa

47、rd mounting surface as determined by forcing the solder paste through the stencil opening 3.3 adhesive application (A0) subprocess used to apply adhesive to the surface of a printed board or interconnecting structure for the purpose of securing components in a manner that prevents component movement

48、 during the assembly attachment process 3.3.1 adhesive misalignment (A1) image of the adhesive geometric profiles that are not positioned on the base substrate according to the prescribed location defined in the assembly process details 3.3.2 excessive adhesive (A2) adhesive geometric profiles that

49、consist of greater volume than that defined by the assembly process details 3.3.3 insufficient/no adhesive (A3) adhesive geometric profiles that consist of less volume than that defined by the assembly process details or are not present at all as required 3.3.4 adhesive stringing/contamination (A4) adhesive ap