BS EN 60191-6-3-2001 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - .pdf

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1、BRITISH STANDARD BS EN 60191-6-3:2001 IEC 60191-6-3:2000 Mechanical standardization of semiconductor devices Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of quad flat packs (QFP) The European

2、 Standard EN 60191-6-3:2000 has the status of a British Standard ICS 31.080.01; 31.240 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBS EN 60191-6-3:2001 This British Standard, having been prepared under the direction of the Electrotechnical Sector Committee, was published un

3、der the authority of the Standards Committee and comes into effect on 15 May 2001 BSI 05-2001 ISBN 0 580 37243 X National foreword This British Standard is the official English language version of EN 60191-6-3:2000. It is identical with IEC 60191-6-3:2000. The UK participation in its preparation was

4、 entrusted by Technical Committee EPL/47, Mechanical standardization, to Subcommittee EPL/47/4, Semiconductors, which has the responsibility to: A list of organizations represented on this subcommittee can be obtained on request to its secretary. From 1 January 1997, all IEC publications have the nu

5、mber 60000 added to the old number. For instance, IEC 27-1 has been renumbered as IEC 60027-1. For a period of time during the change over from one numbering system to the other, publications may contain identifiers from both systems. Cross-references Attention is drawn to the fact that CEN and CENE

6、LEC Standards normally include an annex which lists normative references to international publications with their corresponding European publications. The British Standards which implement these international or European publications may be found in the BSI Standards Catalogue under the section enti

7、tled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Complia

8、nce with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related i

9、nternational and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front cover, the EN title page, pages 2 to 17 and a back cover. The BSI copyright date displayed in this document indicates when the document was last issued. Amend

10、ments issued since publication Amd. No. Date CommentsEUROPEAN STANDARD EN 60191-6-3 NORME EUROPENNE EUROPISCHE NORM December 2000 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central S

11、ecretariat: rue de Stassart 35, B - 1050 Brussels 2000 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60191-6-3:2000 E ICS 31.080.01 English version Mechanical standardization of semiconductor devices Part 6-3: General rules for

12、the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) (IEC 60191-6-3:2000) Normalisation mcanique des dispositifs semiconducteurs Partie 6-3 : Rgles gnrales pour la prparation des dessins dencombrement

13、 des dispositifs semiconducteurs montage en surface - Mthodes de mesure pour les botiers plats quadrangulaires (QFP) (CEI 60191-6-3:2000) Mechanische Normung von Halbleiterbauelemente Teil 6-3: Allgemeine Regeln fr die Erstellung von Gehusezeichnungen von SMD-Halbleitegehusen - Meverfahren fr QFP-Ge

14、husemae (IEC 60191-6-3:2000) This European Standard was approved by CENELEC on 2000-11-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-da

15、te lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under

16、 the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Iceland, Ir

17、eland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom.Foreword The text of document 47D/370/FDIS, future edition 1 of IEC 60191-6-3, prepared by SC 47D, Mechanical standardization of semiconductor devices, of IEC TC 47, Semiconductor devices, was subm

18、itted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6-3 on 2000-11-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2001-08-01 latest date by whi

19、ch the national standards conflicting with the EN have to be withdrawn (dow) 2003-11-01 Annexes designated “normative“ are part of the body of the standard. In this standard, annex ZA is normative. Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 60

20、191-6-3:2000 was approved by CENELEC as a European Standard without any modification. _ Page2 EN6019163:2000 BSI 05-2001 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring meth

21、ods for package dimensions of quad flat packs (QFP) 1 Scope This part of IEC 60191 stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E. 2 Normative references The following normative documents contain provisions which, through reference in this text, c

22、onstitute provisions of this part of IEC 60191. For dated references, subsequent amendments to, or revisions of, any of these publications do not apply. However, parties to agreements based on this part of IEC 60191 are encouraged to investigate the possibility of applying the most recent editions o

23、f the normative documents indicated below. For undated references, the latest edition of the normative document referred to applies. Members of IEC and ISO maintain registers of currently valid International Standards. IEC 60191-6:1990, Mechanical standardization of semiconductor devices Part 6: Gen

24、eral rules for the preparation of outline drawings of surface mounted semiconductor device packages 3 Definitions For the purpose of this part of IEC 60191, the definitions of IEC 60191-6 apply. 4 Measuring methods 4.1 The measuring methods described in this standard are for dimension values guarant

25、eed to users on the basis of the following items. a) In general, measuring the dimensions shall be made with the semiconductor packages mounted on printed circuit-board as the guarantee is made to user. b) In general, measurement may be made either by hand or automatically. c) If a specified dimensi

26、on is difficult to measure, the best alternative measuring method is defined as the formal measuring method. d) The dimensions that cannot be measured unless the package is destroyed may be calculated from other dimensions or replaced by representative values. Page3 EN6019163:2000 BSI 05-2001 4.2 Re

27、ference characters and drawing Figure 1 S /2 /2 E H y S f SAB xS A B E 2 1 A 1 A A 2 Z D X4 tSAB n A X4 e b D B D /2 H D /2 HD E H E IEC 1671/2000 Page4 EN6019163:2000 BSI 05-2001 c1 c b1 b A3 L1 Lp c Figure 2 IEC 1672/2000 Seating plane Page5 EN6019163:2000 BSI 05-2001 4.3 Datum The datum shall be

28、defined as follows. S xS A B A B 0.1 |90 - | 2 = Figure 3 Centres of opposite sides of a package, which are defined below, shall be connected together. An angle subtended by the two crossing lines shall be obtained. A difference |90 - of the angle from 90 shall be equally distributed to the sides to

29、 obtain rectangular axes. The rectangular axes are depicted as datum lines A and B of the package. Description of the centres of sides Even number of leads on a package side Odd number of leads on a package side 0,1 0,1 A centre of facing sides of adjacent leads at a position 0,1 mm inside the top o

30、f the leads The centre of leads at a position 0,1 mm inside the top of the leads Figure 4 IEC 1673/2000 IEC 1674/2000 IEC 1675/2000 Page6 EN6019163:2000 BSI 05-2001 4.4 Overall width HE / overall length HD / Package width D / package length E 4.4.1 Description a) As to the overall width and overall

31、length, all lead tops should be located within the range t centring on the position which is at a theoretically correct distance of HE/2 or HD/2 from the datum A or B. b) As to the package width and length, the package end-face should be located within the range f centring on the position which is a

32、t a theoretically correct distance of E/2 or D/2 from the datum A or B. fSAB tSAB X4 A X4 S HD D B D /2 H D /2 Figure 5 IEC 1676/2000 Page7 EN6019163:2000 BSI 05-2001 f t A B HD /2 /2 /2, HE /2, D E Figure 6 4.4.2 Measuring method a) HE/HD 1) Put the package on the surface plate to establish the dat

33、um reference S. 2) Make the datum A and B coincide with the measuring reference. 3) Find the logically precise distances HD/2 and HE/2 from the datum A and B. Then check if the tip of every lead on each package side is within the tolerance t (range) specified as the centre. b) E/D 1) Put the package

34、 on the surface plate to establish the datum reference S. 2) Make the datum A and B coincide with the measuring reference. 3) Find the theoretically precise distances D/2 and E/2 from the datum A and B. Then check if the package edge on each package side is within the tolerance f (range) specified a

35、s the centre. 4.5 Mounting height A 4.5.1 Description Let the height of a package from the seating plane to the top of the package be denoted as the mounting height. The mounting height therefore includes inclination and warping of the package. IEC 1677/2000 Page8 EN6019163:2000 BSI 05-2001 A A Figu

36、re 7 4.5.2 Measuring method a) Put the package on the surface plate to establish the seating plane. From the side or the top, measure the distance to a highest point. b) Let the distance be denoted as the mounting height. IEC 1678/2000 Page9 EN6019163:2000 BSI 05-2001 4.6 Stand-off A1 4.6.1 Descript

37、ion Let a distance from the seating plane to the lowest point of a package be denoted as the stand-off. A1 A1 Figure 8 4.6.2 Measuring method a) Put the package on the surface plate to establish the reference surface (seating plane). b) Measure a distance from the reference surface to the lowest poi

38、nt of the package. IEC 1679/2000 Page10 EN6019163:2000 BSI 05-2001 4.7 Body thickness A2 4.7.1 Description The body thickness is defined as a distance between two parallel planes, tangent to the highest and lowest points of the body. A2 A2 Figure 9 4.7.2 Measuring method a) Put the package which is

39、accurately dimensioned between surface plates which are larger than the package vertically in parallel. Never touch the leads. b) Measure the total thickness including the surface plates with a micrometer and subtract the thickness of surface plates from the total thickness so as to obtain the thick

40、ness of the package. IEC 1680/2000 Page11 EN6019163:2000 BSI 05-2001 4.8 Lead widths b and b1, lead thickness c and c1 4.8.1 Description The outmost width and outmost thickness in a range of 0,1 to 0,25 mm from the tip of the stable shape of the lead having little burrs and crushing shall be defined

41、 as the lead width and lead thickness. The lead width and lead thickness, as shown in the right-hand figure, include burrs, crushing, and sagging. In this case, the outmost width and outmost thickness after surface plating shall be defined as b and c, and the outmost width and outmost thickness plat

42、ing shall be defined as b1 and c1 respectively. 0,1 0,15 X X b c c1 b1 Figure 10 4.8.2 Measuring method a) Lead widths b and b1 1) Put the package on the surface plate. 2) Make the lead centre intersect perpendicularly to the measuring reference. 3) Measure the lead width (shown above) from the uppe

43、r surface. b) Lead thickness c and c1 1) Put the package on the surface plate. 2) Measure the lead thickness (shown above) from the side. b1 and c1 may be measured before plating. 4.8.3 Remarks a) b1 and c1 may be measured before the lead is processed. If this occurs, after processing, measure b1 an

44、d c1 at the position within the above range. b) The lead thickness may be measured at eight points on the four corners of the package as representative values. Section X-X IEC 1681/2000 Page12 EN6019163:2000 BSI 05-2001 4.9 Soldered portion length Lp 4.9.1 Description The distance in a mounting dire

45、ction from a cross-point (a) of a plane A 3 from, and in parallel with, the seating plane with an inside surface of a descending portion of the lead to a tip (b) of the lead. A 3 (b) L p (a) Figure 11 4.9.2 Measuring method a) Put the package on the surface plate to establish the datum reference S (

46、seating plane). b) Make the datum parallel with the measuring reference. c) Observe the lead toward the package side (in the seating plane direction). Measure positions of points (a) and (b) in the seating plane direction. 4.9.3 Remarks As this measuring method can be done from the side, the values

47、of the leads observable from the side are allowed as representative values. IEC 1682/2000 Page13 EN6019163:2000 BSI 05-2001 4.10 Positional tolerance of terminal tips 4.10.1 Description a) Obtain positions of tips of leads at points of 0,1 mm inside the tips. b) Obtain differences from the theoretic

48、al positions. c) The differences are defined as the positional tolerance of terminal tips. d) The positional tolerance depends on the terminal width. e) The positional tolerance value = (b max. b nom. + x) /2 xS A B A B S Figure 12 A 0,1 Figure 13 Actual lead centre Theoretical centre IEC 1684/2000

49、IEC 1683/2000 Page14 EN6019163:2000 BSI 05-2001 4.10.2 Measuring method a) Put the package on the seating plane (surface plate or virtual plane). b) Make the datum parallel with the measuring reference. c) Obtain positions of ends of leads at points of 0,1 mm inside the tips. d) Obtain differences from the theoretical centres of the leads. e) Check the differences within positional tolerance. NOTE Positional tolerance depends on