ASTM F1844-1997(2016) Standard Practice for Measuring Sheet Resistance of Thin Film Conductors For Flat Panel Display Manufacturing Using a Noncontact Eddy Current Gage《采用非接触式涡流计测量.pdf
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1、Designation: F1844 97 (Reapproved 2016)Standard Practice forMeasuring Sheet Resistance of Thin Film Conductors ForFlat Panel Display Manufacturing Using a Noncontact EddyCurrent Gage1This standard is issued under the fixed designation F1844; the number immediately following the designation indicates
2、 the year oforiginal adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.1. Scope1.1 This practice describes methods for measuring t
3、he sheetelectrical resistance of sputtered thin conductive films depos-ited on large insulating substrates (glass or plastic), used inmaking flat panel information displays.1.2 This practice is intended to be used with Test MethodsF673. This practice pertains to a “manual” measurementprocedure in wh
4、ich an operator positions the measuring headon the test specimen and then personally activates the testapparatus. The resulting test data may be tabulated by theoperator, or, alternatively, sent to a computer-based datalogging system. Both Methods I and II of Test Methods F673(paragraphs 3.1 through
5、 3.3.3 of Test Methods F673) areapplicable to this practice.1.3 Sheet resistivity in the range 0.020 to 3000per square(sheet conductance in the range 3 by 104to 50 mhos persquare) may be measured by this practice. The sheet resistanceis assumed to be uniform in the area being probed.NOTE 1Typical ma
6、nual test units, as described in this practice,measure and report in the units “mhos per square”; this is the inverse of“ohms per square.”1.4 This practice is applicable to flat surfaces only.1.5 This practice is non-destructive. It may be used onproduction panels to help assure production uniformit
7、y.1.6 The values stated in SI units are to be regarded asstandard. No other units of measurement are included in thisstandard.1.7 This standard does not purport to address all of thesafety concerns, if any, associated with its use. It is theresponsibility of the user of this standard to establish ap
8、pro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.2. Referenced Documents2.1 ASTM Standards:2F673 Test Methods for Measuring Resistivity of Semicon-ductor Slices or Sheet Resistance of Semiconductor Filmswith a Noncontact Eddy-Current Gage
9、 (Withdrawn 2003)33. Summary of Practice3.1 This practice describes the preferred means of applyingTest Methods F673 to measure the electrical sheet resistance ofthin films on very large, flat, nonconducting substrates. Thesubstrate, oriented with the conducting thin film up, is placedbetween the tr
10、ansducers of the eddy current sensor assembly atthe point of interest. The test arrangement is illustrated in Fig.1.3.2 Atypical conductance apparatus is described in detail ina paper by Miller, Robinson, and Wiley.4This paper alsodiscusses skin-depth as a function of thickness and resistivity.3.3 A
11、 typical apparatus operates as follows: when a speci-men is inserted into the fixed gap between the two parallelsensing elements, or transducers, in a special oscillator circuit,eddy currents are induced in the specimen by the alternatingfield between the transducers. The current needed to maintainc
12、onstant voltage in the oscillator is determined internally; thiscurrent is a function of the specimen conductance.3.4 Further details are given in Test Methods F673, para-graphs 3.1 through 3.3.3.3.5 This practice includes calibration procedures for usingNIST Silicon Standard Reference Material5to e
13、nsure properoperation before testing panels.1This practice is under the jurisdiction of ASTM Committee F01 on Electronicsand is the direct responsibility of Subcommittee F01.17 on Sputter Metallization.Current edition approved May 1, 2016. Published May 2016. Originallyapproved in 1997. Last previou
14、s edition approved in 2008 as F1844 97(2008).DOI: 10.1520/F1844-97R16.2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM
15、 website.3The last approved version of this historical standard is referenced onwww.astm.org.4Miller, G.L., Robinson, D. A. H., and Wiley, J. D., “Contactless Measurementof Semiconductor Conductivity by Radio Frequency-Free-Carrier PowerAbsorption,” Review of Scientific Instruments , Vol 47, No. 7,
16、July 1976.5Available from NIST, 100 Bureau Dr., Stop 3460, Gaithersburg, MD 20899.Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States14. Significance and Use4.1 Resistivity is a primary quantity for characterization andspecification of co
17、ated glass plates used for flat panel displays.Sheet resistance is also a primary quantity for characterization,specification, and monitoring of thin film fabrication processes.4.2 This practice requires no specimen preparation.4.3 The eddy current method is non-destructive to the thinfilm being mea
18、sured. Special geometrical correction factors,needed for some four-point probe electrical resistivitymeasurements, are not required to derive the true sheetresistance so long as the transducers have a continuous layer ofconductive thin film between them.4.4 Test Methods F673 refers to a testing arra
19、ngement inwhich the transducers and specimen (a semiconductor gradesilicon wafer) are rigidly positioned. Similar apparatus iscommercially available for testing large glass or plasticsubstrates, not envisioned in the scope of Test Methods F673.Ahand held probe can also be used, depending on throat d
20、epthrequired.4.5 For use as a referee method, the probe and measuringapparatus must first be checked and qualified before use by theprocedures of Test Methods F673 (9.1.1 through 9.1.3 and9.1.4.2 through 9.1.4.5), then this practice is used.4.6 For use as a routine quality assurance method, thisprac
21、tice may be employed with periodic qualifications of probeand measuring apparatus by the procedures of Test MethodsF673 (9.1.1 through 9.1.3 and 9.1.4.2 through 9.1.4.5). Theparties to the test must agree upon adequate qualificationintervals for the test apparatus.5. Apparatus5.1 Eddy Current Sensor
22、 Assembly See Fig. 1 and TestMethods F673.5.1.1 Different transducer designs may be required to coverthe full range of sheet resistance values.NOTE 2Three transducers will generally cover the ranges of interest.For convenience these are denoted “High” (15 to 3000 per square),“Low” (0.2 to 15 per squ
23、are) and “Extra Low” (0.035 to 0.2 persquare).NOTE 3The usual “High” range transducer diameter is approximately12.7 to 15.2 mm. The “Low” and “Extra Low” diameter is approximately10.1 to 12.7 mm.Avery large transducer, 63.5-mm diameter, may be usedfor all ranges for thicker than normal substrates (u
24、p to approximately 2.54mm) and for calibration and measurement ease.5.2 Electrical Measuring Apparatus The electrical appa-ratus must meet the requirements of Test Methods F673,paragraphs 6.1 through 6.4.5.3 Specimen Support The flat panel to be tested must besupported firmly to ensure that the thin
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