ASTM B813-2000e1 Standard Specification for Liquid and Paste Fluxes for Soldering of Copper and Copper Alloy Tube《铜和铜合金管钎焊用液体和软膏状助溶剂的标准规范》.pdf

《ASTM B813-2000e1 Standard Specification for Liquid and Paste Fluxes for Soldering of Copper and Copper Alloy Tube《铜和铜合金管钎焊用液体和软膏状助溶剂的标准规范》.pdf》由会员分享，可在线阅读，更多相关《ASTM B813-2000e1 Standard Specification for Liquid and Paste Fluxes for Soldering of Copper and Copper Alloy Tube《铜和铜合金管钎焊用液体和软膏状助溶剂的标准规范》.pdf（6页珍藏版）》请在麦多课文档分享上搜索。

1、Designation: B 813 00e1Standard Specification forLiquid and Paste Fluxes for Soldering of Copper andCopper Alloy Tube1This standard is issued under the fixed designation B 813; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision, the ye

2、ar of last revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon (e) indicates an editorial change since the last revision or reapproval.e1NOTEParagraph 11.5 was editorially corrected in December 2001.INTRODUCTIONThis specification covers a series of specific

3、requirements for liquid and paste fluxes. It alsoincorporates a series of test methods that establish the procedures on how to measure these properties.The format of this specification initially defines the specification requirements followed by the specifictest methods in the order in which they ar

4、e to be performed.1. Scope1.1 This specification establishes the requirements and testmethods for liquid and paste fluxes for joining by soldering ofcopper and copper alloy tube and fittings in plumbing, heating,air conditioning, mechanical, fire sprinkler, and other similarsystems.NOTE 1This specif

5、ication does not apply to fluxes intended forelectronic applications.1.2 Solder fluxes are to be tested in accordance with therequirements of this specification by an independent testinglaboratory. Testing, measuring equipment, and inspection fa-cilities shall be of sufficient accuracy and quality t

6、o complywith the requirements of this specification.1.3 UnitsThe values stated in SI units are to be regardedas standard. No other units of measurement are included in thisstandard.1.4 The following hazard caveat pertains to Sections 11-19.This standard does not purport to address the safety problem

7、s,if any, associated with its use. It is the responsibility of the userof this standard to establish appropriate safety and healthpractices and determine the applicability of regulatory limita-tions prior to use.2. Referenced Documents2.1 The following documents of the issue in effect on thedate of

8、materials purchase form a part of this specification tothe extent referenced herein:2.2 ASTM Standards:B 32 Specification for Solder Metal2B 88 Specification for Seamless Copper Water Tube3B 88M Specification for Seamless Copper Water TubeMetric3B 152/B 152M Specification for Copper Sheet, Strip, Pl

9、ate,and Rolled Bar3B 280 Specification for Seamless Copper Tube for AirConditioning and Refrigeration Field Service3B 846 Terminology for Copper and Copper Alloys3D 130 Test Method for Detection of Copper Corrosion fromPetroleum Products by the Copper Strip Tarnish Test4D 1200 Test Method for Viscos

10、ity by Ford Viscosity Cup52.3 Other:1986 Amendments to the Safe Drinking Water Act63. General Requirements3.1 The flux shall be suitable for joining copper tube andfittings by soldering in the size ranges shown in Table 1 ofSpecifications B 88 and B 88M and Tables 4 and 5 of Speci-fication B 280.3.2

11、 The flux shall remain active over the temperature rangeof the soldering operation, removing and excluding oxidesfrom the metal surfaces in the joint.3.3 The flux shall be suitable for use with all solders listedin Table 5 of Specification B 32 as well as the more recentlydeveloped solder alloys sui

12、table for the applications in thescope of this specification.3.4 The flux shall allow the solder to adequately wet andspread on the surfaces being soldered.1This specification is under the jurisdiction of Committee B05 on Copper andCopper Alloys and is the direct responsibility of Subcommittee B05.0

13、4 on Pipe andTube.Current edition approved March 10, 2000. Published May 2000. Originallypublished as B 813 91. Last previous edition B 813 93.2Annual Book of ASTM Standards, Vol 02.04.3Annual Book of ASTM Standards, Vol 02.01.4Annual Book of ASTM Standards, Vol 05.01.5Annual Book of ASTM Standards,

14、 Vol 06.01.6Available from the Superintendent of Documents, Government Printing Office,Washington, DC 20402.1Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.3.5 The flux residue shall be water flushable after soldering.3.6 The flux re

15、sidue shall not be corrosive after soldering.3.7 The flux shall not release toxic fumes during thesoldering operation or toxic substances into the water in thecompleted system.3.8 The flux shall adhere to the copper and copper alloysunder anticipated temperature, joint geometry, joint position,job s

16、ite, and weather conditions.3.9 The flux shall not contain more than 0.2 % lead inaccordance with the 1986 Amendments to the Safe DrinkingWater Act.4. Terminology4.1 For terms related to copper and copper alloys, refer toTerminology B 846 for terms specific to this standard.4.2 Definition:4.2.1 flux

17、, na chemically active substance that is used toremove and exclude oxides from the joint area during heatingand that ensures that the melted solder will wet the surfaces tobe joined.5. Spreading Factor5.1 Spreading of the solder is determined by measuring theheight (h) of a solder bead on a standard

18、 test sheet followingthe specified heating cycle. Spread factor (SF) is calculated asfollows:SF 5 100 1.0 2 h! (1)where:h = the maximum height of the solder bead, mm.5.2 A flux is considered to have acceptably influenced thespreading of solder on the copper surfaces when the averagespreading factor

19、is at least 50 (see Section 13).5.3 The spreading test shall show a balanced action byforming a regular and even solder layer.6. Aggressiveness Requirements6.1 From a standard test sheet on which a specimen hasbeen prepared with solder (see Section 15), the resistivity ofthe aqueous solution shall b

20、e more than 100 000 V cm.6.2 From a standard test sheet on which a specimen hasbeen prepared without solder (see Section 16), the resistivity ofthe aqueous solution shall be more than 85 000 V cm.7. Corrosiveness Requirements7.1 There shall be a clear indication that in the areas of fluxreaction, th

21、e sheets shall show a corrosion and residue-freesurface comparable with the unwetted areas as determined byvisual inspection in accordance with Section 17.7.2 Corrosiveness shall be reported in accordance with oneof the classifications listed as follows (see Test Method D 130):Classification Descrip

22、tion1 Slight tarnish2 Moderate tarnish3 Dark tarnish8. Viscosity Requirements8.1 The viscosity of liquid fluxes shall be less than 180 s asdetermined using a No. 2 Ford flow cup in accordance withSection 18.9. Residue Flushing Requirements9.1 Flushing of the residue shall be determined by weightloss

23、.9.2 The loss of weight of each sheet shall be determined bycomparing the average weight before and after the test proce-dure. The weight loss of the flux residue shall be more than99 % in accordance with Section 19.% Weight Loss d! 5 100 2c 2 a!b 2 a!3 100 (2)where:a = weight of degreased, flushing

24、-test sheet, g;b = weight of degreased, flushing-test sheet plus theweight of applied flux, g; andc = weight of dried, flushing-test sheet after flushing, g.10. Sampling10.1 Samples of flux taken for the purpose of the tests listedin this specification shall be selected from the stock of themanufact

25、urer and shall be representative of the material beingevaluated.11. Specimen Preparation11.1 Standard Quantity of Solder MetalA standard quan-tity of solder metal shall be a sample of 60:40 tin-lead (AlloyGrade Sn60), measuring 6.0 mm in diameter by 0.86 mm inthickness, weighing approximately 0.21 g

26、, that has beendegreased with trichloroethylene.11.2 Standard Quantity of FluxA standard quantity of fluxshall be 0.003 mL as measured by a precision pipet or othervolumetric measuring devices with equivalent precision.11.3 Standard Test SheetA standard test sheet shall be apiece of copper 35 by 35

27、by 1 mm thick of Copper UNS No.C12200 (deoxidized high residual phosphorus) produced inaccordance with Specifications B 152/B 152M.11.3.1 Preparation:11.3.1.1 The sheet is abraded three times with a waterproofsand or emery paper (Grit No. 360), each time perpendicular tothe previous direction. One c

28、orner of each test sheet shall bebent upwards to permit handling. It is degreased with calciumcarbonate mixed with water to a paste consistency with whichthe test sheet is rubbed using a wad of cotton. The residue isflushed off by a strong jet of tap water. The test sheet isconsidered to be degrease

29、d when it is completely moistened bywater when flushed.11.3.1.2 In any of the following steps in which the testsheets must be handled, use forceps or laboratory tongs. Thesheet is then etched for 15 s in an etching solution formulatedas follows:(a) Etching Solution(1-L etching solution contains 200-

30、gchromic acid anhydride (CrO3) and 125-mL sulfuric acid(specific gravity 1.84) reagent grade, balance distilled water,diluted to 1 L.)(b) Finally, the sheet is rinsed thoroughly with distilled water(60 to 70C), immersed in ethanol (ACS Grade), and allowedto dry.11.4 Resistivity Test SpecimenThe resi

31、stivity test speci-men is the condition of the standard test sheet on which havebeen deposited standard quantities of flux and solder metalB 8132before they are placed in the oven.11.4.1 Preparation:11.4.1.1 Remove test sheet from the liquid ethanol, allow todry, and apply a standard quantity of flu

32、x. With a standardquantity of solder metal, spread the flux to an area of about 15mm in diameter.11.4.1.2 Place the test sheet with flux and solder metal in theoven where it remains for 3 min at a temperature of 275Cfrom the time the solder melts. Remove the specimen andallow to cool to room tempera

33、ture.11.5 Flushing-Test SheetThe flushing-test sheet is a pieceof copper 100 by 100 by 1.0 mm thick of Copper UNS No.C12200 (deoxidized high residual phosphorus) produced inaccordance with Specifications B 152/ B 152M.11.5.1 Preparation:11.5.1.1 The copper sheets shall have raised edges of 3 or 4mm

34、to avoid loss of flux. The sheets shall be degreased withtrichloroethylene, flushed with water, and dried at a tempera-ture of 50C. Every sheet shall be weighed to 10-mg accuracyusing a standard laboratory balance.12. Test Methods12.1 The properties enumerated in this specification shall bedetermine

35、d in accordance with the test methods given inSections 13-19.13. Spreading Test13.1 ScopeThe influence of the flux on the spreading ofthe fluid solder is indicated by the spreading factor obtained bythe conditions detailed in Section 17.13.2 Apparatus:13.2.1 OvenThe performance characteristics of th

36、e ovenshall be such that the temperature has an accuracy of 62.5C.The oven shall be equipped with a sight glass for visiblecontrol of the melting of the solder. It shall be possible tomeasure the oven temperature in close proximity to the testsheet. The test sheet shall be capable of being placed in

37、 theoven and removed from it exactly horizontally. To reducecooling when the preheated test sheet is removed from theoven, it is placed on a plate in an exact horizontal position soas to be pushed in and out. The oven must be easy to heat to thepreset temperature.13.2.2 Gilson Precision Pipet,3to25L

38、.13.3 Spreading Factor Procedure:13.3.1 The spreading factor test specimen is the condition ofthe standard test sheet with a standard quantity of flux havingbeen heated to 275C for 30 s in the oven. Immediatelyafterwards, a standard quantity of solder metal is placed overthe liquid flux and the test

39、 specimen is replaced in the oven.13.3.2 The period for which the test sheet shall be outsidethe oven for application of the solder metal shall not exceed 10s.13.3.3 Remove test sheet from the ethanol, allow to dry, andapply a standard quantity of flux. Spread the flux with astandard quantity of sol

40、der metal to an area of about 15 mm indiameter and then remove the solder metal.13.3.4 Heat the test sheet with flux for 30 s in an oven at275C. Afterwards, replace the standard quantity of soldermetal that was used to spread the flux on the test sheet and heatthe assembly for 3 min at a temperature

41、 of 275C in the oven.13.3.5 After the test specimen has cooled to room tempera-ture and been cleaned, measure the solder height by means ofa flat micrometer three times, average the values, and calculatethe spreading factor as in 5.1.13.4 CalculationAfter five tests, the highest and lowestfigures ar

42、e excluded. Calculate the average of the remainingthree.14. Aggressiveness Test14.1 ScopeThe aggressiveness of the flux is determinedby means of a resistivity test by measuring the resistivity in Vcm of an aqueous solution of the flux residue. The conductivitycell to be used shall be kept immersed i

43、n distilled water atambient temperature for a minimum of 24 h before use.14.2 Apparatus:14.2.1 Ohmmeter (Must Be Suitable for Use with Liquids)Cell constant shall be specified.14.2.2 Beakers100 mLfor this test shall be acid/alkaliresistant, cleaned, and degreased. Finally, they shall be rinsedthorou

44、ghly with distilled water.14.2.3 ThermometersThe temperatures shall be measuredwith cleaned thermometers having a scale that will accuratelyregister the temperatures. The thermometer shall be immersedin a clean graduate measuring cylinder, filled with distilledwater for a minimum of 24 h before use.

45、14.3 CalculationAfter five tests, the highest and lowestfigures are excluded and the average of the other three is used.15. Resistivity TestSoldered (see 6.1)15.1 Procedure:15.1.1 Clean seven watch glasses and seven graduatedbeakers thoroughly by washing in hot water detergent solution,rinsing sever

46、al times with tap water followed by rinsing threetimes with distilled water. Then add approximately 50 mL ofdistilled water to each beaker, cover with a watch glass, andboil for 2 min. Discard the water and repeat this boiling withfresh distilled water. Place each clean beaker upside down ontissue p

47、aper until they are needed. Fill each beaker to the75-mL mark with distilled water. Immerse the beakers in awater bath maintained at 25C. When this temperature isreached, measure the resistivity of the distilled water in eachbeaker. Make sure that the resistivity of the distilled water ineach beaker

48、 is not less than 500 000 V cm. If the resistivity ofthe water in any beaker is less than 500 000 V cm, repeat thecomplete process just described. Retain two of these beakers ascontrols.15.1.2 For determination of the resistivity, five of the testspecimens indicated in 11.4 are used. After cooling t

49、he lastsheet, five of the sheets (see 13.3.5) are placed in separatebeakers filled with 75-mL distilled water. The test sheets areplaced with the soldered surface down. The beakers are thencovered with watch glasses. Heat all seven beakers simulta-neously. As the contents of each beaker comes to a boil, timethe boiling for 1 min. The beakers are then allowed to cool for10 min. They are then cooled rapidly until a temperature of25C has been reached. When this temperature is reached, thetest sheets are removed. Determine the resistivity of theaqueous s