JEDEC JEP170-2013 Guidelines for Visual Inspection and Control of Flip Chip Type Components (FCxGA).pdf

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1、 JEDEC PUBLICATION Guidelines for Visual Inspection and Control of Flip Chip Type Components (FCxGA) JEP170 JANUARY 2013 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of Directo

2、rs level and subsequently reviewed and approved by the JEDEC legal counsel. JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assistin

3、g the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally. JEDEC standards and publications are adopted without regard to whether or not their adoption may invo

4、lve patents or articles, materials, or processes. By such action JEDEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the JEDEC standards or publications. The information included in JEDEC standards and publications represents a soun

5、d approach to product specification and application, principally from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or publication may be further processed and ultimately become an ANSI standard. No claims to be in conforma

6、nce with this standard may be made unless all requirements stated in the standard are met. Inquiries, comments, and suggestions relative to the content of this JEDEC standard or publication should be addressed to JEDEC at the address below, or refer to www.jedec.org under Standards and Documents for

7、 alternative contact information. Published by JEDEC Solid State Technology Association 2013 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 This document may be downloaded free of charge; however JEDEC retains the copyright on this material. By downloading this file the individual a

8、grees not to charge for or resell the resulting material. PRICE: Contact JEDEC Printed in the U.S.A. All rights reserved PLEASE! DONT VIOLATE THE LAW! This document is copyrighted by JEDEC and may not be reproduced without permission. For information, contact: JEDEC Solid State Technology Associatio

9、n 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 or refer to www.jedec.org under Standards-Documents/Copyright Information. JEDEC Publication No. 170 -i- Guidelines for Visual Inspection and Control of Flip Chip Type Components (FCxGA) Introduction With the increased presence of fli

10、p chip type components - ball grid array (FCBGA), pin grid array (FCPGA), land grid array (FCLGA) - in electronic devices ranging from thin/light portable to massively parallel data centers, it is critical to offer clear guidelines for visual inspection and control that ensures quality and reliabili

11、ty of these components. JEDEC Publication No. 170 -ii- Guide(From JEDReliability1 SThis publimpact enconsidereproducts. or visual nin actual p2 Tball grid via a rectaflip chip dsolder joinflip chip pNOTE 1 arrays (PGNOTE 2 constructioNOTE 3 fiducial mthe imagelines for ViEC BoD BaTest Methocope icat

12、ion provd-user produd visual noncFinally, it wonconformitroduct drawierms and Dearray (BGA)ngular array ie: An unpats. (Ref. JESackage (FCThe flip chip pA) per customThe lowercasen, e.g., B for bFCBGA packaarker; fiducproduced forsual Inspecllot JCB-12-ds for Packagides descriptcts and/or apponformi

13、ties sill depict a mies and guidangs and specfinitions package: Aof ball-type cckaged die wD22-B109A)xGA): A pacackage may ber requirement“x” in the abball, L for landges typically hial: An objeuse as a pointion and Co50, formulateed Devices.)ion of defeclications. It ince they shoethod for visunce

14、for dispoifications. package in wonnections, ahose electric. kage consistie configured ts. reviation shou, P for pin. ave a filled epct, placed in t of referencntrol of Flid under the cts observed will also provuld be less dal inspectionsition. Offichich the extll on a commal interconneng of a faced

15、o ball grid arrald be replacedoxy that is disthe field of ve or a measurp Chip Typognizance ofin FCxGA cide illustratiisruptive of qthat can be uial criteria foernal connecon plane. ctions to a suown flip chipys (BGA), lanby a capital lepensed betweiew of an imae. JEDEC Ppe Componethe JC-14.1 ompone

16、nts ton on other duality or relitilized to ider product acctions to the pbstrate are fodie on an ord grid arrays (tter representien the die and aging systemublication NoPnts (FCxGSubcommittehat can adveefects that mability to cusntify these deptance shouackage are mrmed throughganic substraLGA), or

17、pin gng the applicathe substrate., that appears. 170 age 1 A) e on rsely ay be tomer efects ld be ade te. rid ble in JEDEC Publication No. 170 Page 2 2 Terms and dDefinitions (contd) field of view (in metrology): The area of the test sample under metrological examination. land grid array (LGA) packa

18、ge: A package in which the external connections to the package are made via a rectangular array of land-type connections, all on a common plane. organic substrate: A substrate with laminate materials constructed with glass fibers that are carbon-based epoxies. pin grid array (PGA) package: A package

19、 in which the external connections to the package are made via a rectangular array of pin-type connections, all on a common plane. 3 Informative Reference Documents JESD16-A, Assessment of Average Outgoing Quality Levels in Parts Per Million (PPM) JESD47, Stress-Test-Driven Qualification of Integrat

20、ed Circuits JESD22-B109A, Flip Chip Tensile Pull JESD22-B101B, External Visual Examination JESD22-B118, Semiconductor Wafer and Die Backside External Visual Inspection 4 Assembly Process Flow (illustration purpose) A typical assembly flow for flip chip packaging for FCxGA (FCBGA, FCLGA, and FCPGA) i

21、s shown in Figure 4.1. NOTE Steps in grey may/may not be part of the flow depending on package type. Yellow demarks focus of this document Figure 4.1 Assembly Process Flow 4.1 Wafer Dicing To mechanically separate the functional Die (Wafer = Individual Dice) Wafer Dicing Chip Attach Epoxy Underfill

22、Heat Spreader Attach Electrical Test Visual Inspection xGA Ball /Pin Attach JEDEC Publication No. 170 Page 3 4 Assembly Process Flow (illustration purpose) (contd) 4.2 Chip/Component Attach To place die on package and form the electrical and mechanical connections between the die/package by reflowin

23、g the solder at high temperature to form a high-quality solder joint. Die Side Capacitors can also be placed and joints formed at this operation. 4.3 Epoxy Underfill To fill the cavity under the die and around the die perimeter with epoxy. This seals the area and provides mechanical support for the

24、die-to- package interconnects. 4.4 Heat Spreader Attach/Cure Thermal interface material is placed on top of the die and the Heat Spreader is attached with sealant (and cured). This is done to control thermal performance especially for products which have higher rates of heat generation or are very t

25、emperature sensitive. JEDEC PuPage 4 4 A4.5 ETo performspecificat4.6 VTo performfunctionalcombinatiblication Nossembly Prolectrical / Fuelectrical tions, and cateisual Inspectinspectionsfailures. Thion of both. . 170 cess Flow (ilnctional Tesest in order togorize compions against visus can be donelu

26、stration puting isolate manuonents accordal criteria, espwith automarpose) (contfacturing deing to deviceecially for itted inspectiotd) efects, ensure performancems that mayns systems, mproduct meete. not represenanual inspes performanct electrical octions or some or e JEDEC Publication No. 170 Page

27、 5 5 Types of Defects Defects that can negatively impact end-user products are shown in Table 5.1, and designated as Tier 1. Conversely, Table 5.2 will list defects that may be treated as visual nonconformities since they are expected to less disruptive of quality or reliability of customer products

28、. Note: in addition to actual images of these defects, generic illustrations have been included in Tables 5.1 and Table 5.2 for clarification purposes. Table 5.1 Tier 1 Defects Defect: Package Type Description Defect Illustration Defect Images Associated Risks Die Damage / Die Crack BGA LGA PGA Mech

29、anical damage to Silicon Die Can cause electrical opens / Die Cracking (propagating from damage location) Component Damage BGA LGA PGA Mechanical Damage to Die-Side or Land-Side Components. Can cause electrical performance degradation. Bent / Missing Pin Only PGA Pin Interconnect is tilted or missin

30、g Can cause PGA socket insertion error (Bent Pin) or electrical signal disruption (missing pin) Blister / Delamination BGA LGA PGA Substrate blistering is predominantly due to moisture Can cause electrical opens or loss of margin in long term reliability. Deformed / Merged Ball Only BGA Any severely

31、 deformed, missing or merged (to adjacent BGA) ball. Can cause electrical open or short JEDEC Publication No. 170 Page 6 5 Types of Defects (contd) Table 5.2 Tier 2 Defects Defect: Package Type Description Defect Illustration Defect Images Associated Risks Laser Mark Defects or Missing / Unreadable

32、Mark BGA LGA PGA Defects from Traceability Marking While this is not considered a functional defect, many manufacturers use this mark for traceability. Inability to read the mark is a manufacturing disruption. Stain / Discoloration on the Heat Spreader BGA LGA PGA Non-uniformity on the heat spreader

33、 surface. Primarily considered visual nonconformity and should be minimized. Stain / Discoloration on Die BGA LGA PGA Stain on Bare Die Component Primarily considered visual nonconformity and should be minimized. Note: if there is physical height this could be material build-up that is possible to i

34、mpact thermal performance. NOTE The list of defects from this document is not all inclusive. 6 Visual inspection method Note: The primary focus of this section is related to manual inspection. However, there are many options within the industry to enable automated visual inspections for a variety of

35、 product types. While automated inspections can provide significant value in consistency of detection and disposition vs. manual inspection (due to human to human variation and resulting ongoing training needs), there are also critical challenges of automated inspections systems. These include a req

36、uirement of high discriminatory power to distinguish signal from noise and inspection recipes, greater levels of calibration to the exact level of quality desired. It is highly recommended that if automated systems are pursued, a qualification plan be drafted and completed to instill confidence that

37、 the inspection successfully and repeatedly detects intended defect modes. JEDEC Publication No. 170 Page 7 6 Visual inspection method (contd) 6.1 Basic equipment/apparatus Table 6.1 lists some example of basic equipment for the work area setup and inspection. Each company should define its own requ

38、irements of necessary equipment. Table 6.1 Visual Inspection Equipment/Use Equipment Purpose/Comment Ergo workstation and chair For Inspector safety Safety glasses with permanent side shield Wrist and/or heel ESD ground strap For product protection such as ESD protection or any handling issues Works

39、tation table top ionizer Ionizing air-blow off gun Vacuum pick up or other suitable handling tool Clean room glove To avoid unnecessary contamination Face mask Overhead task light to provide 100-200 foot candle (1000 to 2000 Lux) florescent For consistent inspection environment 3 diopter 1.75 magnif

40、ier with ring light To provide higher magnification for inspection or verification Microscope or other magnifying aids 6.2 Procedure 6.2.1 In tray inspection Make sure the appropriate personal protection equipment is being worn. Make sure all the proper, ESD-free handling procedures are being follow

41、ed Leave the components to be inspected on the tray Hold the tray a distance of 12” to 21” (30.4mm to 533.4 mm) at about 45 degree angle during inspection. Inspection shall be performed perpendicular to the eye and the arm shall be at rest posture. o air gun may be used to blow off loose, dry foreig

42、n materials if appropriate o component should be inspected by naked eye/unaided vision or low power magnification specified by the company Upon completion of the inspection of one side of the component. Place an empty tray on top of the inspected tray to secure components Perform a tray stack flip a

43、nd continue to inspect the other side of the component. o air gun may be used to blow off loose, dry foreign materials if appropriate o component should be inspected by naked eye/unaided vision or low power magnification specified by the company JEDEC Publication No. 170 Page 8 6.2 Procedure (contd)

44、 6.2.2 Out of tray inspection Make sure the appropriate personal protection equipment is being worn. Make sure all the proper, ESD-free handling procedures are being followed Pick up the components by designated appropriate materials handling equipment such as vacuum pick up tool Inspect all sides o

45、f the component based on proper materials handling procedure given by the company 6.3 Potential limitations Considering the nature of visual inspection process where majority of tasks require manual intervention (tool setup, calibration, sample preparation, and inspection), there are limiting factor

46、s from the inherent subjectivity and variability from the operators to the potential effects of external environmental factors such as lighting, noise, and ambience. Finally, operator fatigue and inadequate ergonomic work area may cause gradual loss in inspection accuracy during the course of inspec

47、tion hours. 6.4 Preventive or corrective measures for visual inspection While it is difficult to completely remove human subjectivity from visual inspection process, there are steps that company can take to mitigate the concerns and improve consistence of the operation Training o Each of the inspect

48、or should complete training requirements and be certified. o Trainee should shadow the trainer for certain period of time and able to correctly classify each type of defect mode o Trainee should demonstrate understanding on all equipment that would be used for inspection. Example, ergo workstation,

49、microscope, and other equipment. Inspection criteria development o Inspection criteria need to be design in mind for consistent human execution in high volume environment in addition to product protection. o Criteria should be designed with clear language to minimize open interpretation as much as possible. In today global nature business environment, criteria should also be designed to suit multi-lingual and cultural systems. This often requires engineer involvement from multiple countries to clarify criteria intent and purpose. o Case