EN 61249-5-4-1996 en Materials for Interconnection Structures Part 5 Sectional Specification Set for Conductive Foils and Films with and without Coatings Section 4 Conductive Inks《.pdf

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1、STD-BSI BS EN h1247-5-4-ENGL 1777 m 1b24bb7 Ob34184 b78 BRITISH STANDARD Materials for interconnection structures Part 5. Sectional specification set for conductive foils and films with or without coatings Section 4. Conductive inks The European Standard EN 61249-5-4 : 1996 has the status of a Briti

2、sh Standard ICs 31.180 m BS EN 61249-5-4 : 1997 IEC 1249-5-4 : 1996 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAW STD=BSI BS EN bL299-5-4-ENGL 1977 = 1b24bb7 Ob34185 509 AmdNo. BS EN 61249-5-4 : 1997 Date Text affected Committees responsible for this British Standard The pre

3、paration of this British Standard was entrusted to Technid Committee EPy52, Printed circuits, upon which the following bodies were represene Feeration of the Electronics Industry GAhBICA (BEAMA Ltd.) National SupeMsing Inspectorate SI PC) Printed Circuit Interconnection Federation Surface Mount and

4、Related Technologies (SMART Group) This British Standard, having been prepared under the direction of the Eieclzotechnicai Sector Board, was published under the authority of the Standards Board and comes int effect on 15 May 1997 O BSI 1997 The following BSI references relate to the work on this sta

5、ndard Committee reference EPU52 Draft for comment 93/210559 DC ISBN O 680 27317 2 STD-BSI BS EN b1249-5-q-ENGL 1997 U lb24bb9 Ob39LBb 440 m BS EN 61249-6-4 : 1997 National foreword This British Standard has been prepared by Technical Committee EPY52, and is the Englzsh ianguage veision of EN 6124954

6、 : 1996 Materials for interconnection structures Part 5 : Sectional speeijkation set for conductive foils and f2m.s with or without coatings Section 4. Conductive inlcs, published by the European Committee for Electsotechnical Standardization (CENELEC). It is identid with IEC 1249-5-4 : 1996 publish

7、ed by the Internatinal Electrotechnical Commission (iEC). This British Standard is published under the direction of the Electrotechnid Sector Board whose Technical Committee EPM2 has the responsibility to: - aid enquirers to understand the text, - present to the responsible internationaiEwopean comm

8、ittee any enquiries on interpretation, or proposals for change, and keep UK interests informed, - monitor related international and European developments and promulgate them in the UK. Cross-references Publication referred to EN 600682-2 (EC 68-2-2 1974) BS EN 600682 Test methods Corresponding Briti

9、sh Standard BS EN 60068 EnvironMM testing BS EN 600682-2 : 1993 Tests B. Dry heat HD 323.2.3 S2 (IEC 6823 : 1969) BS 2011 Environmental testing Part 2.1 Tests Part 2.1Ca : 1977 Test Ca. Damp heat, steady state Part 2.1T : 1981 Test T. Soldemng HD 323.2.20 S3 (IEC 68-2-20 : 1979) NOTE. international

10、and European Standards, as well as overseas standards, are available from Customer Services, BSI, 389 Chiswick High Road, London W4 4AL. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside fro

11、nt cover, pages i and ii, the EN title page, pages 2 to 16, an inside back cover and a back cover. i EUROPEAN STANDARD NORME EUROPEENNE EUROPISCHE NORM EN 61 249-5-4 August 1996 ICs 31.180 Descriptors: Materials for interconnection structures, sectional specification, conductive foils and films, cod

12、uctive inks, requirements English version Materials for interconnection structures Part 5: Sectional specification set for conductive foils and films with or without coatings Section 4: Conductive inks (IEC 1 249-5-4: 1996) Matriaux pour les structures dinterconnexion Teil 5: Rahmenspetifikationen f

13、r Partie 5: Collection de spcifications intermediaires pour feuilles et films conducteurs avec ou sans revtement Section 4: Encres conductrices Druckfarben Materialien fr Verbindungsstrukturen leitfhige Folien und Filme mit oder ohne Beschichtungen Hauptabschnitt 4: Leitfhige - II = a * (CE1 1 249-5

14、-4: 1 996) (IEC 1249-5-4: 1996) =e - E m * This European Standard was approved by CENELEC on 199643742. CENELEC members are bound to comply with the CENKENELEC Internal RegUlatiOnS which stipulate the conditions for giving this European Standard the status of a national standard without any alterati

15、on. Up-todate lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by transl

16、ation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Denmark, Finland, France, Germany, Greece, Iceiand, Ireland

17、, Italy, LUXembOUrg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnicai Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35,

18、 B - 1050 Brussels * 1996 Copyright reserved to CENELEC members Ref. NO. EN 61 249-5-4:1996 E Foreword The text of document 52/602/FDIS, future edition 1 of IEC 1249-5-4, prepared by IEC TC 52, Printed circuits, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 61 249-

19、5-4 on 1996-07-02. The following dates were fixed: - latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 1997-04-01 - latest date by which the national standards conflicting with the EN have to be withdrawn (daw

20、) 1997-04-01 Annexes designated “normative“ are part of the body of the standard. Annexes designated “informative“ are given for information only. In this standard, annexes A and ZA are normative and annexes B and C are informative. Annex 2!A has been added by CENELEC. Endorsement notice The text of

21、 the International Standard IEC 1 249-54: 1996 was approved by CENELEC as a European Standard without any modification. STD-BSI BS EN bL247-5-V-ENGL 2777 Lb24bb7 0b3Y187 L5T Page 3 EN 61249-5-4 : 1996 CONTENTS Clause i Scope . 2 Normative references 3 Requirements . 3.1 Storage properties 3.2 Contai

22、ners and their markings 3.3 Electrical properties . 3.4 Non-electrical properties . Page 4 4 4 4 4 5 6 Annexes A (normative) Test pattern for insulation resistance measurement 8 B (informative) Conversion table . 9 C (informative) Bibliography 14 ZA (nonnative) Normative references to international

23、publications with their corresponding European publications . 15 * * ul STD-BSI BS EN bL249-5-4-ENGL L997 m Lb24bb9 Ob34L90 971 Page 4 EN 61249-5-4 : 1996 MATERIALS FOR INTERCONNECTION STRUCTURES - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section

24、4: Conductive inks i Scope This specification details requirements for the qualification of conductive inks, and for conductive inks intended for use as a substitute for metallic finishes on contacts. Information in this specification will also provide guidance regarding the suitability of printed b

25、oards which feature conductive inks. Requirements for the release of products using conductive inks should be included in the customer detail specification (CDS). 2 Normative references I The following normative documents contain provisions which, through reference in this text, constitute provision

26、s of this section of IEC 1249-5. At the time of publication, the editions indicated were valid. All normative documents are subject to revision, and parties to agreements based on this section of IEC 1249-5 are encouraged to investigate the possibility of applying the most recent editions of the nor

27、mative documents indicated below. Members of IEC and IS0 maintain registers of currently valid International Standards. IEC 68-2-2: 1974, Environmental testing - Part 2: Tests - Test B: Dry heat IEC 68-2-3: 1969, Basic environmental testing procedures - Part 2: Tests - Test Ca: Damp heat, steady sta

28、te IEC 68-2-20: 1979, Environmental testing - Part 2: Tests - Test T: Soldering 3 Requirements 3.1 Storage properties Conductive inks, or their component compounds, when stored in their original sealed containers under the suppliers specified environmental conditions, shall retain the specified prop

29、erties until the final date for use (see 3.2 b). 3.2 Containers and their markings The conductive ink shall be supplied in sound, clean, dry containers. In addition to any statutory markings, each container in the consignment shall be clearly marked with the following: Page 6 EN 61249-5-4 : 1996 Mat

30、erial a) the type; b) the specified storage temperature and humidity or range thereof, and a final date for use; c) details of mixing and curing conditions; d) a distinct lot or batch number, and date of manufacture; e) the quantity in the container; f) the identity of the manufacturer and place of

31、manufacture. Test condiions Test environment Storage duration Polarisation voltage (=) I 3.3 Electrical properties Paper i phenolic Other substrates 3.3.1 Bulk resistance (93:) X RH 4 - (Ba:)% RH 21 1 O0 (40 i 2) *C (40 i 2) *C The bulk resistance of the cured conductive ink shall not exceed the sup

32、pliers stated maximum. This should be stated in ohms per square. 3.3.2 Contact resistance When tested in accordance with future IEC 1189-2, test 2E16, the contact resistance shall not exceed 100 il, unless othewise permitted by the customers detail specification (CDS). 3.3.3 Insulation resistance be

33、tween conductive patterns When tested in accordance with the conditions given in table 1, the insulation resistance between discrete conductive patterns shall not be less than 100 MR, unless otherwise stated in the customers detail specification (CDS). The test specimens shall be in accordance with

34、annex A of this specification. A minimum of three samples shall be taken. Specimens so tested shall exhibit no electromigration when examined with an approximately 1 Ox magnification. I l I I V days I See annex C (Bibliography). STDDBSI BS EN b1249-5-4-ENGL 1997 m 1b24bb9 Ob34192 744 m Page 6 EN 612

35、49-6-4 : 1996 3.4 Non-electrical properties 3.4.1 Finish The conductive ink, when processed in accordance with the manufacturers instructions, shall produce a visually smooth, uniform film with well defined edges; and without surplus flow or bleed-out. 3.4.2 Adhesion (pressure sensitive tape method)

36、 The material shall be tested in accordance with future IEC 1189-3, test 3x12. When processed in accordance with the material suppliers instructions, there shall be no evidence of conductive ink particles adhering to the tape. There shall be no separation between the conductive ink and the underlyin

37、g materials. 3.4.3 Reslsfance to solvents, fluxes and soldering The cured conductive ink shall not exhibit a degradation in surface characteristics, such as surface roughness, swelling, blistering, softening, and change of colour, or loss of adhesion when tested in accordance with test method 3C04 o

38、f future IEC 1189-3, including the soldering operation. The flux shall be an activated flux (0,2 %) as specified in 6.6.2 of IEC 68-2-20. The test specimen shall be a production board, as agreed between customer and supplier. Three samples shall be taken. 3.4.4 High temperature storage The cured con

39、ductive ink shall not exhibit blistering, loss of adhesion, or cracking when subjected to testing in accordance with test 2P01 of future IEC 1189-2. The test specimen shall be a production board, as agreed between customer and supplier. Three samples shall be taken. The storage duration shall be 56

40、days. The complete test board shall be subjected to (100 t 2) OC. The test board shall be supported during conditioning so that any bow or twist shall not prejudice the test result. 3.4.5 Degree of cure When tested in accordance with future IEC 1189-3, test 3M09, there shatl be no softening or trans

41、fer of the material (other than free surface debris) to the lint-free cloth or cotton wool swab. 3.4.6 Abrasion resistance (pencil hardness) The hardness of the cured conductive ink shall be determined by the pencil test in accordance with future IEC 1189-3, test 3M08. The ink supplier shall report

42、the limits of hardness that can be expected when the conductive ink is properly applied and cured. When agreed between customer and supplier, specific requirements regarding hardness shall be met, but in no case shall be less than 2H. See annex C (Bibliography). STD*BSI BS EN b1249-5-q-ENGL 1997 Lb2

43、4bb9 Ob34193 b8O = Page 7 EN 61249-5-4 : 1996 3.4.7 flammability The addition of a coating of conductive ink to a printed board shall not reduce the flammability rating (for example: FV-O, FV-1) of the printed board base material. - STD-BSI BS EN b1249-5-4-ENGL 1997 M 1b24bb9 Ob3Y194 517 Page 8 EN 6

44、1249-6-4 1996 Annex A (normative) lest pattern for insulation resistance measurement Dimensions in millimetres L 3 STD-BSI BS EN b1249-5-LI-ENGL 1997 Lb2LIbb9 Ob3LIL75 LI53 = Page 9 EN 61249-5-4 : 1996 IEC Test method publication number number IEC 1189-1 1 PO1 IEC 1189-1 1 PO2 (informative) Descript

45、ion Preconditioning, standard atmospheric conditoning Preconditioning. 125 OC Conversion table IEC 1189-2 IEC 1189-2 IEC 11 89-2 IEC 1189-2 IEC 1189-2 * cn * 2E06 Volume and surface resistivity, three IEC 93 electrodes elevated temperature 2E07 Surface and volume resistlvity, IEC 249f2.9 2E08 Surfac

46、e corrosion IEC 24912.4 2E09 Comparatlve trarklng index IEC 249i2.6 2E10 Permittivity and dissipation factor IEC 24912.7 . publlcation number number I IEC 32W9.1.1 18a I IEC 92619.1.2 18b I IEC 1189-2 2E11 Electric strength IEC 24912.8 I I 1 IEC 1189-2 2E12 I Resistance of fol1 I IEC 249E.1 . I 1 ST

47、D*BSI BS EN bL297-5-9-ENGL I997 lb24bb9 Ob34L9b 39T D Page 10 EN 61249-6-4 : 1996 IEC 1189-2 IEC 1189-2 IEC 1189-2 IEC 1189-2 IEC 11 89-2 Test method Inumber publication I 2E13 Corrosion at edge IEC 24912.5 2E14 Arc resistance 2E15 Dielectric breakdown 2E16 Contact resistance of printed circuit keyp

48、ad cont. 2M01 Bow/twist IEC 24913.1 Description IEC 1189-2 IEC 11892 IEC 1189-2 IEC 1189-2 publication number 2M05 Pull off strength IEC 249B.5 2M6 Pyl strengthsohrent vapour IEC 249l3.6.4 2M07 Peel strengthsolvent dip IEC 249B.6.6 2M08 Flexural strength IS0 178 IEC 1189-2 IEC 1189-2 IEC 1189-2 IEC

49、11 89-2 I IEC 1189-2 2M02 1 Bow/twist after etching and heating I IEC 24913.2 I 2Mll Glass transltion temperature (TMA) 2M12 Surface waviness 2M13 Peel rtrsngthlafter condition IEC 24919.6.1 2M14 Peel strengthithermal shock IEC 24913.6.2 , 1 IEC 1189-2 IEC 11 892 IEC 11882 IEC 11 89-2 Cure factor of base materials by I DSC/TMA IEC 1189-2 I 2M03 2M16 Ped 8trengthishulate plating IEC 24N3.6.5 2M17 Peel. strongthhlevated temperature IEC 24BB.6.7 2M18 Surface quallty IEC 24BB.9 2MlB Punching IEC 249B.8 1 IEC 24W3.3 I IEC 1189-2 IEC 1189-2 IEC 1