DLA SMD-5962-92347 REV D-2007 MICROCIRCUIT LINEAR HIGH SPEED VOLTAGE COMPARATOR WITH LATCH MONOLITHIC SILICON《硅单片 装有锁存器的稳压器 高速线性微型电路》.pdf

《DLA SMD-5962-92347 REV D-2007 MICROCIRCUIT LINEAR HIGH SPEED VOLTAGE COMPARATOR WITH LATCH MONOLITHIC SILICON《硅单片 装有锁存器的稳压器 高速线性微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-92347 REV D-2007 MICROCIRCUIT LINEAR HIGH SPEED VOLTAGE COMPARATOR WITH LATCH MONOLITHIC SILICON《硅单片 装有锁存器的稳压器 高速线性微型电路》.pdf（17页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Delete input offset voltage temperature coefficient test and make change to input voltage range test as specified under TABLE I. In accordance with N.O.R. 5962-R221-94. 94-06-28 M. A. FRYE B Make change to terminal connections as specified under

2、FIGURE 3. In accordance with N.O.R. 5962-R167-95. 95-07-07 M. A. FRYE C Add device type 03. Add case outline H. Add TABLE IIB. Replace CAGE code 34031 with CAGE code 24355. Make changes to 1.2.2, 1.2.4, 1.3, TABLE I, and TABLE II. Redrawn. 97-06-27 R. MONNIN D Replace reference to MIL-STD-973 with r

3、eference to MIL-PRF-38535. - ro 07-07-23 R. HEBER REV SHET REV D D SHET 15 16 REV STATUS REV D D D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY RICK C. OFFICER DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY CHARLES E. BESORE COL

4、UMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL A. FRYE AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 93-05-24 MICROCIRCUIT, LINEAR, HIGH SPEED, VOLTAGE COMPARATOR WITH LATCH, MONOLITHIC SILICON AMSC N/A REVISIO

5、N LEVEL D SIZE A CAGE CODE 67268 5962-92347 SHEET 1 OF 16 DSCC FORM 2233 APR 97 5962-E491-07 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92347 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVI

6、SION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the

7、Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 92347 01 M E A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class

8、designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF

9、-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 AD9696 Single voltage comparator with l

10、atch 02 AD9698 Dual voltage comparator with latch 03 AD9696 Single voltage comparator with latch 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certificatio

11、n to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descri

12、ptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line H GDFP1-F10 or CDFP2-F10 10 Flat pack I MACY1-X10 10 Can P GDIP1-T8 or CDIP2-T8 8 Dual-in-line X See figure 1 8 Dual small outline with gullwing leads Y See figure 2 16 Dual small outline with gullwing leads 1.2.5 Lead

13、 finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92347 DEFENSE SUPPLY CENTE

14、R COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage range (VS) 7 V dc Input voltage range (VIN) 5 V Differential input voltage . 5.4 V Latch enable voltage range -0.5 V to +VSOutput current (continuous) 20 mA Power dissi

15、pation (PD) . 600 mW Lead temperature (soldering 10 seconds) +300C Storage temperature range -65C to +150C Junction temperature (TJ) +175C Thermal resistance, junction-to-ambient (JA): Cases E and Y 90C/W Case H 140C/W Case I 170C/W Cases P and X 110C/W Thermal resistance, junction-to-case (JC): Cas

16、es E, I, and P See MIL-STD-1835 Case H 60C/W Case X 20C/W Case Y 25C/W 1.4 Recommended operating conditions. Supply voltage range (VS) 5 V dc Ambient operating temperature range (TA) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specifica

17、tion, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specif

18、ication for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (

19、Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text o

20、f this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the de

21、vice. Extended operation at the maximum levels may degrade performance and affect reliability. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92347 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 RE

22、VISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification

23、in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The

24、design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figures 1 and 2. 3.2.2 Terminal c

25、onnections. The terminal connections shall be as specified on figure 3. 3.2.4 Timing diagram. The timing diagram shall be as specified on figure 4. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance character

26、istics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defi

27、ned in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“

28、 on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certif

29、ication mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from

30、a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate o

31、f compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and her

32、ein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For

33、device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the

34、option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit grou

35、p number 50 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92347 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 TABLE

36、 I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits 2/ Unit Min Max Input characteristics Input offset voltage VIORS 100 1 All 2.0 mV 2,3 3.0 Input bias current IIB1 All 55 A 2,3 110 Input offset current

37、IIO1 All 1.0 A 2,3 1.3 Input voltage range VINVS= 5 V 1,2,3 All -2.0 +3.5 V VS= +5 V +1.6 +3.5 Common mode rejection ratio CMRR VS= 5 V 1,2,3 All 80 dB VS= +5 V 57 Latch enable input Logic “1” voltage threshold VTH1,2,3 All 2.0 V Logic “0” voltage threshold VTH1,2,3 All 0.8 Logic “1” current I(LE)1,

38、2,3 All 10 A Logic “0” current I(LE)1,2,3 All 1 A Digital outputs Logic “1” voltage VOUTSource at 4 mA 1,2,3 All 2.7 V Logic “0” voltage VOUTSink at 4 mA 1,2,3 All 0.5 V See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S

39、TANDARD MICROCIRCUIT DRAWING SIZE A 5962-92347 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Devic

40、e type Limits 2/ Unit Min MaxSwitching performance Propagation delay, tPD3/ 4/ 9,10,11 01,02 7.0 ns input to output high 9 03 7.0 Propagation delay, tPD3/ 4/ 9,10,11 01,02 7.0 ns input to output low 9 03 7.0 Propagation delay, latch enable to output high tPD(E)TA= +25C 3/ 4/ 9 All 8.5 ns Propagation

41、 delay, latch enable to output low tPD(E)TA= +25C 3/ 4/ 9 All 8.5 ns Propagation delay, delta delay between outputs tPDTA = +25C 3/ 4/ 9 All 1.5 Propagation delay dispersion tPDD100 mV to 1.0 V overdrive, TA= +25C 3/ 4/ 9 All 200 ps Latch enable, pulse width tPW(E)TA= +25C 4/ 9 All 3.5 ns Latch enab

42、le, setup time tSTA= +25C 4/ 9 All 3 ns Latch enable, hold time tHTA= +25C 4/ 9 All 3 ns Power supply 5/ Positive supply current +ISVS= +5 V and 5 V 1,2,3 01,03 32 mA 02 64 Negative supply current -ISVS= 5 V 1,2,3 01,03 4.0 mA 02 8.0 Power supply rejection ratio PSRR +VS= +4.75 V to +5.25 V, 4 All 7

43、0 dB -VS= -5.46 V to -4.94 V 5,6 65 1/ +VS= +5.0 V and VS= -5.2 V. See figure 4. 2/ The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum, is used in this table. Negative current shall be defined as conventional current flow out of a device t

44、erminal. 3/ Propagation delays are measured with 100 mV pulse and 100 mV overdrive (VOD). 4/ If not tested, shall be guaranteed to the limits specified in table I herein. 5/ Supply voltages should remain stable within 5% for normal operation Provided by IHSNot for ResaleNo reproduction or networking

45、 permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92347 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 FIGURE 1. Case outline X. Provided by IHSNot for ResaleNo reproduction or networking permitted without licen

46、se from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92347 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 8 DSCC FORM 2234 APR 97 Symbol Millimeters Inches Min Max Min Max A 2.11 2.62 0.083 0.103 b 0.38 0.48 0.015 0.019 c 0.10 0.13 0.004 0.005 E 6.35 6.60 0.250

47、0.260 E1 4.44 - 0.175 - E2 8.20 8.81 0.323 0.347 E3 11.00 11.61 0.433 0.457 e 1.27 BSC 0.050 BSC L 1.02 1.14 0.040 0.045 L1 1.40 1.68 0.055 0.066 L2 0.64 0.76 0.025 0.030 L3 0.38 0.51 0.015 0.020 R 0.38 0.51 0.015 0.020 S1 1.12 - 0.044 - Q 0.38 - 0.015 - N 8 8 NOTES: 1. The case outline X was origin

48、ally designed using inch-pound units of measurement, in the event of conflict between the metric and inch-pound units, the inch-pound shall take precedence. 2. Pin 1 is identified by a tab on the braze pad on the underside of the package. 3. Lead finish shall be hot solder dipped, or gold plated with nickel underplate. The lead material is alloy 42. 4. The lid is gold plated Kovar with nickel underplate. FIGURE 1. Case outline X Continued. Provided by IHSNot for ResaleNo reproduction or n