DLA SMD-5962-89772-1992 MICROCIRCUIT CHMOS 16-BIT MICROCONTROLLER WITH 8-BIT OR 16-BIT EXTERNAL BUS MONOLITHIC SILICON《硅单片 装有8位或16位外总线16位微型控制器 互补高性能金属氧化物半导体结构微型电路》.pdf

《DLA SMD-5962-89772-1992 MICROCIRCUIT CHMOS 16-BIT MICROCONTROLLER WITH 8-BIT OR 16-BIT EXTERNAL BUS MONOLITHIC SILICON《硅单片 装有8位或16位外总线16位微型控制器 互补高性能金属氧化物半导体结构微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-89772-1992 MICROCIRCUIT CHMOS 16-BIT MICROCONTROLLER WITH 8-BIT OR 16-BIT EXTERNAL BUS MONOLITHIC SILICON《硅单片 装有8位或16位外总线16位微型控制器 互补高性能金属氧化物半导体结构微型电路》.pdf（24页珍藏版）》请在麦多课文档分享上搜索。

1、tr SUD-5962-89772 59 9999996 0024292 947 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED REV STATUS OF SHEETS PMIC NIA STAl9DARI ZED IIILITARY DRAWIHG THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE SC NIA )ESC FORM 193 JUL 91 PREPARED BY DEFENSE ELE

2、CTRONICS SUPPLY CENTER DAYTON, OHIO 45444 SIZE ICAGE CODE REVISION LEVEL A 67268 92-08-04 5962-89772 SHEET 1 OF 23 5962-E045 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS

3、-,-,-* v+ SMD-5962-89772 59 9999996 0024293 883 S TANDmI ZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 1. SCOPE SIZE 5962-89772 A REVISION LEVEL SHEET 2 1.1 Scope. This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product

4、 assurance classes consisting of military high reliability (device classes 8, Q, and M) and space application (device classes S and VI, and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-

5、JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, “Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices“. available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN. When 1.2 m. The PIN shall be as shown in the following

6、example: - M - o1 - 5962 89T72 I I I I l I I I X - I I X - I I Lead Case Device Devi ce RHA I Federal stock class designator type class outline finish designator (See 1.2.1) (See 1.2.2) designator (See 1.2.4) (See 1.2.5) / (See 1.2.3) / Drawing number 1.2.1 Radiation hardness assurance (RHA) desiqna

7、tor. Device classes M, B, and S RHA marked devices shall meet the Device classes Q and V RHA MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. marked devices shall meet the MIL-1-38535 specified RHA levels and shall be marked with the appropriate RHA designato

8、r. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device typeCs) shall identify the circuit function as follows: Devi ce type Generic number Circuit function o1 8397BH 12 MHt l-bit microcontroller with 8K bytes of on-chip ROM. 1.2.3 Device class designator. The device class designa

9、tor shall be a single letter identifying the product assurance level as follows: Device class Device requi rements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Q or V Certification and qualification to

10、MIL-M-38510 Certification and qualification to MIL-1-38535 1.2.4 Case outline(s1. The case outlinds) shall be as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Packaqe style 2 CHGA3-PN 68 pin grid array Provided by IHSNot for ResaleNo reproduction or netwo

11、rking permitted without license from IHS-,-,-*y 1 SMD-5962-772 59 999999b 0024294 71T 1.2.5 Lead finish. The lead finish shall be as specified in MIL-M-38510 for classes M, 6, and S or MIL-1-38535 for asses Q an inish letter X shall not be marked on the microcircuit or its packaging. The “X“ designa

12、tion is ir use in ste:ifi!ations when lead finishes A, 6, and C are considered acceptable and Interchangeable without ,ef erence . 1.3 Absolute mxiauni ratinas. u Storage Tenperature Ronge -65C to t15OoC Voltage on Any Pin with respect to Ground (except h) -0.3 V dc to +7 V dc Voltage from EA to V A

13、verage output curre88 from any pin 10M Power Dissipation (P ) 1.5 W I/ lead Tenperature (sopdering 10 seconds) . 300C Thermal Resistance, Junction-to-case (OX) 3.5CIW Junction Temperature (TJ) . 150C or ANGND -0.3 V dc to t13.0 V dc 1.4 Recomnended operating conditions. Case Operating Temperature Ra

14、nge -55OC to +125“C 2/ Supply Voltages, VC, pEF, VpD 4.5 V dc to 5.5 V dc Oscillator frequen y, . 6.0 to 12 Wz 1.5 Disital loqic testinq for device classes Q and V. Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - - XX percent 31 iJ Must withstand t

15、he added P due to short circuit test (e.g., I ). operation at the maximum 18vets may degrade performance and af%t reliability. 2/ Case tenperatures are instant on. 3J Values will be added when they become available. 5962-89772 STANDARDIZED MILITARY DRAWING DRFENSE ELECTBONICS SUPPLY CENTER DAYTON, O

16、HIO 45444 iESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-89772 59 7777776 0024275 b5b U . y. 2. APPLICABLE DOCUMENTS 2.1 Government specifications, standards, bulletin, and handbook. Unless otherwise specified, the fol

17、lowing pecifications, standards, bulletin, and hmdkok of the issue listed in that issue of the Department of Defense Index If Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified lerei n. SPECIFICATIONS MILITARY MI L-M-3851 O - MIL-1-38535 -

18、 STANDARDS MILITARY MI L-STD-480 - MIL-STD-883 - MIL-STD-1835 - BULLETIN MILITARY MIL-BUL-103 - HANDBOOK MILITARY MIL-HDBK-780 - Microcircuits, General Specification for. Integrated Circuits, knufacturing, General Specification for. Configuration Control-Engineering Changes, Deviations and Waivers.

19、Test Methods and Procedures for Microelectronics. Hicrocircuit Case Outlines. List of Standardized Military Drawings (SHDs). Standardized Military Drawings. Copies of the specifications, standards, bulletin, and handbook required by manufacturers in connection with specific cquisition functions shou

20、ld be obtained from the contracting activity or as directed by the contracting activity.) erein, the text of this drawing shall take precedence. 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited 3. REQUIREMENTS 3.1 Item rwuirements. The ind

21、ividual item rquircncnts for device class M shall be in accordance with 1.2.1 of 1L-STD-883, “Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices“ and as specified erein. The individual item requirements for evice classes B and S shall be in accordance with MIL-M-3851

22、0 and as pecified herein. ncluded in this SMD. IL-1-38535, the device manufacturers Quality Management (Pn) plan, and as specified herein. pecified in MIL-M-38510 for device classes II, I, mnd S 8nd UIL-1-38535 for device classes Q and V and herein. For device classes EI and S, a full electrical cha

23、racterization table for each device type shall be The individual item rquirements for device classes Q and V shall be in accordance with 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as 3.2.1 Case outline(s). The case outlinds) shall be

24、 in accordance with 1.2.4 herein. 5962-89772 REVISION LEVEL SHEET STANDARDIZED MILITARY DRAWIMG DEFENSE ELECTRONICS SUP?LY CEITlbR DAYTON, OHIO 45444 DESC FORM 193A JL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-89772 59 9999996 00242

25、96 592 3.2.2 Terminal connections. 3.2.3 Functional block diagram. 3.2.4 Radiation exposure circuit. 3.3 ie electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall ?ply over the full case operating temperature range. The terminal connections

26、shall be as specified on figure I. The functional block diagram shall be as specified on figure 2. The radiation exposure circuit shall be specified when available. Electrical Derformance characteristics and Wstirradiation parameter limits. Unless otherwise specified herein, 3.4 Electrical test requ

27、irements. The electrical test requirements shall be the subgroups specified in table IIA. he electrical tests for each subgroup are defined in table 1. 3.5 Marking. ccordance with MIL-STD-883 (see 3.1 herein). IL-BUL-103. nd V shall be in accordance with MIL-1-38535. The part shall be marked with th

28、e PIN listed in 1.2 herein. Marking for device class M shall be in In addition, the manufactureras PIN my also be marked as listed in Marking for device classes B and S shall be in accordance with HIL-M-38510. Harking for device classes Q 3.5.1 Certification/compliance mark. The compliance mark for

29、device class M shall be a “Ca as required in The certification mark for device classes B and S shall be II flJ“ or “JAN“ as required in IL-STD-883 (see 3.1 herein). IL-M-38510. The certification mark for device classes Q and V shall be a “QHL“ as required in MIL-1-38535. For device class M, a certif

30、icate of compliance shall be rquired from a 3.6 Certificate of condiance. anufacturer in order to be listed as an approved source of supply in MIL-BUL-103 (see 6.7.3 herein). lasses Q and V, a certificate of compliance shall be rquired from a ML-38535 listed manufacturer in order to supply o the req

31、uirements of this drawing (see 6.7.2 herein). isting as an approved source of supply for this drawing shall affirm that the manufactureras product meets, for device lass M the requirements of MIL-STD-883 (see 3.1 herein), or for device classes Q and V, the requirements of IL-1-38535 and the requirem

32、ents herein. erein) or device classes B and S in MIL-M-38510 or for device classes Q and V in MIL-1-38535 shall be provided with ach lot of microcircuits delivered to this drawing. For device The certificate of compliance submitted to DESC-ECC prior to 3.7 Certificate of conformance. A certificate o

33、f conformance as required for device class H in MIL-STD-883 (see 3.1 3.8 Notification of change for device class M. For device class M, notification to DESC-ECC of change of product see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in MIL-STD-480. 3.9 V

34、erification and review for device class H. For device class M, DESC, DESCIs agent, and the acquiring activity Offshore documentation etain the option to review the manufacturers facility and applicable rquired documentation. rhall be made available onshore at the option of the reviewer. 3.10 Microci

35、rcuit group assignment for device classes M. B. and S. Device classes M, 8, and S devices covered by :his drawing shall be in microcircult group number 105 (see MIL-M-38510, appendix E). 3.11 Serialization for device class S. All device class S devices shall be serialized in accordance with IIL-M-38

36、510. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sawling and inspection. For device class M, sampling and inspection procedures shall be in accordance with ;ection 4 of MIL-M-38510 to the extent specified in MIL-STD-883 (see 3.1 herein). ind inspection procedures shall bemin accordance with MIL-M-38510 and

37、method 5005 of MIL-STD-883, except as modified ierein. ievice manufacturers QM plan. For device classes B and S, sampling For device classes Q and V, ssmpling and inspection procedures shall be in accordance with MIL-1-38535 and the 5962-89772 REVISION LEVEL STANDARD1 ZED MILITARY DRAWING DEFENSE EL

38、ECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5952-89772 59 9999996 0024297 429 U TABLE I. Electrical performance characteristics. Test Conditions I -55.C 5 Tf I +125*C 11 I Unles

39、s otherwise specified I I I l cc supply current I Icc IA11 outputs disconnected z/ I Ibctive de current in reset) I I I I PD supply current 1 IpD 1Norni.L operation and 21 I I power-down l I I i REF supply current I IREF 121 nput Lou voltage except RESET I l I I I I I I I I I I I I I I except RESET,

40、 NMI, EA, I I and XTALI I I I I RESET rising I I nput low voltage RESET I VIL1 I l nput high voltage I IH I I nput high voltage I IHI I I f I I RESET falling I hysteresis I I I l NMI, XTALI, and EA I I I to each pin of HSI,P3, I I P4 and P2.1 I I nput high voltage I “IH2 I I .nput high voltage I 1H3

41、 I I I I .nput leakage current 1 IIL IVIN = 0.0 to vcc 21 See footnotes at end of t8ble. roup A ubgroups evi ce type All I Limits I Unit - I I l I _t_l I I I1 I I I -+-+ I I Min I Max I I 275 I BA i8 i I I I l -0.3 i t0.8 i V Y I I I I 3f I I - I I -0.3 I t0.7 I 2.0 I 6.0 I i3f i I I l I I 31 I - I

42、I 2.4 I 6.0 I 2.1 I 6.0 I I - I I I If I 2.2 I 6.0 I I I i I10 i PA I I i i STANDARD1 ZED 5962-89772 MILITARY DRAWING DEFERSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DESC FORM 193A Tin 01 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-

43、89772 59 9999996 0024298 3b5 TABLE I. Electrical performance characteristics - Continued. I I l Test I Symbol I Conditions Itroup A I -55OC I T Is +12SC 11 ISUbgrOUpS I I I 1,2,3 to each pin of PO I I I c I Unless otherwise specified I I I I I I I I IC input leakage current I ILI1 IV, = 0.0 V to Vcc

44、 2/ I I I I I I mput high current to EA I IIH IVIH = 2.4 V 21 I I I I I I I I I I I I P2.6 and P2.7 I I I I I nput low current to PI, I IIL IVIL = 0.45 V 21 l I 1 l i hput low current to 1 IIL1 :VIL = 0.45 V 21 RESET I I I P2.3, P2.4, READY, I BUSWIDTH I I input low current P2.2, I IIL2 (VIL = 0.45

45、V 21 I I I quasi-bidirectional I I I port pins, P3 and P4 I I I when used as ports I I I I I I I quasi-bidirectional I I port pins, P3 and P4 I I I when used as ports I I I i I I lutput low voltage on I VOL IIoL = 0.8 mA 21 41 51 I l )utput low voltage on I VOL, IIOL = 2.0 inA g 31 y g/ I/ I I i i )

46、utput low voltage on I vou IIOL = 2.0 mA 21 A/ fi/ 11 81 I standard output pins: I I I RESET and buslcontrol I I I pins I I I I I I quasi-bidirectional I I I pins I I I I I I 3utput high voltage on I voH1 JIOH = -200 pA 21 i/ I standard output pins I I I and bus/control pins I I I i I IOH = -20 PA 2

47、1 i/ i I OH utput high voltage on I I See footnotes at end of table. I I ivice I Limits I Unit type +-r-i I I 1+3 IpA I I I I I l l +-t-l I I I All I i 100 i I I i I l-+-+ I I I I I I I I -125 I I I I I I I I -0.25 I -2.0 I mA I I 0.45 I I I I i I I i I I +t-l I I I I 2.4 1 l I I I I I I M I I I I 2

48、.4 I I I I I I l I REVISION LEVEL SHEET STANDARD1 ZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-89772 59 9999996 0024299 2TL - STAUDARDI ZED HI

49、LITARY DRAWIG DEFENSE ELLCTROHICS S?LY CEliXR DAYTON, OBI0 45444 TABLE I. Electrical performance characteristics - Continued. SIZE 5962-89772 A L REVISION LEVEL SHEET 8 I I I Test i Symbol i Conditions IGroup A I -55.C 1 TC S +125C I/ 1 subgroups I nlcrs otherwise specified I I I I I I I RESET I I iutput high current on I IoH3 IV, = 2.4 V z/ i I 1,2,3 I I I I I I I in capacitance I cs If,