DLA SMD-5962-87646 REV B-2006 MICROCIRCUIT DIGITAL CMOS HEX CONTACT BOUNCE ELIMINATOR MONOLITHIC SILICON《硅单块 六进制接触回弹消除器 互补金属氧化物半导体 数字微型电路》.pdf
《DLA SMD-5962-87646 REV B-2006 MICROCIRCUIT DIGITAL CMOS HEX CONTACT BOUNCE ELIMINATOR MONOLITHIC SILICON《硅单块 六进制接触回弹消除器 互补金属氧化物半导体 数字微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-87646 REV B-2006 MICROCIRCUIT DIGITAL CMOS HEX CONTACT BOUNCE ELIMINATOR MONOLITHIC SILICON《硅单块 六进制接触回弹消除器 互补金属氧化物半导体 数字微型电路》.pdf(14页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add tests for high level output currents, IOH1and IOH2, in table I. Update the boilerplate to the requirements of MIL-PRF-38535. Editorial changes throughout. - TVN 05-07-15 Thomas M. Hess B Change the input current low, debounce inputs minimum l
2、imits at -55C, in table I. Change the test name and symbol for quiescent supply current, IDD, in table I, to quiescent current, ISS, to agree with the original manufacturers data sheet. - CFS 06-07-06 Thomas M. Hess REV SHET REV SHET REV B A A A A B B A A A A A A REV STATUS OF SHEETS SHEET 1 2 3 4 5
3、 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Greg A. Pitz CHECKED BY D. A. DiCenzo DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil APPROVED BY Michael A. Frye DRAWING APPROVAL DATE 88-02-03 MICROCIRCUIT, DIGITAL, CMOS, HEX CONTACT BOUNCE ELIMINATOR, MONOLITHIC SILICON SI
4、ZE A CAGE CODE 67268 5962-87646 STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A REVISION LEVEL B SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E518-06 Provided by IHSNot for ResaleNo reproduction or networking permitted
5、 without license from IHS-,-,-SIZE A 5962-87646 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microc
6、ircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87646 01 E A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identif
7、y the circuit function as follows: Device type Generic number Circuit function 01 14490A Hex contact bounce eliminator 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 1
8、6 Dual-in-line 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range (VDD) -0.5 V dc to +18.0 V dc Input voltage range (VIN) -0.5 V dc to VDD + 0.5 V dc Input current, per pin (IIN). 10 mA Maximum power dissipation (PD) .
9、500 mW 1/ Storage temperature range (TSTG) . -65C to +150C Lead temperature (soldering, 8 seconds). +260C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VDD) +5.0 V dc to +15.0 V dc Oscillator f
10、requency (OSCOUT) at +25C with CEXT 100 pF: VDD= 5.0 V. 1.5/CEXT(in F) Hz VDD= 10.0 V. 4.5/CEXT(in F) Hz VDD= 15.0 V. 6.5/CEXT(in F) Hz Case operating temperature range (TC). -55C to +125C 1/ For TC= +100C to +125C, derate linearly at 12 mW/C to 200 mW. Provided by IHSNot for ResaleNo reproduction o
11、r networking permitted without license from IHS-,-,-SIZE A 5962-87646 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following sp
12、ecification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General
13、 Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Draw
14、ings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the
15、 text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall
16、 be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification
17、to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modi
18、fications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimen
19、sions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Block d
20、iagram. The block diagram shall be as specified on figure 2. 3.2.4 Switching waveforms and timing diagram. The switching waveforms and timing diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance character
21、istics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for
22、ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-87646 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix
23、A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Cert
24、ification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option i
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