DLA SMD-5962-11208 REV A-2013 MICROCIRCUIT CMOS LINEAR 11-BIT DIGITAL TO ANALOG CONVERTER MONOLITHIC SILICON.pdf

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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED REV SHEET REV SHEET REV STATUS REV OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Steve L. Duncan DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil/ STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILAB

2、LE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Greg Cecil APPROVED BY Charles F. Saffle MICROCIRCUIT, CMOS, LINEAR, 11-BIT, DIGITAL TO ANALOG CONVERTER, MONOLITHIC SILICON DRAWING APPROVAL DATE 13-03-15 AMSC N/A REVISION LEVEL SIZE A CAGE CODE 67268 5962-11208 SHE

3、ET 1 OF 11 DSCC FORM 2233 APR 97 5962-E317-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-11208 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Sc

4、ope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are r

5、eflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 - 11208 01 K X X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 Radi

6、ation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device ty

7、pe Generic number Circuit function 01 RHD5930 Digital-to-Analog converter,11-bit, Ladder output 02 RHD5931 Digital-to-Analog converter,11-bit, Buffered output 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All levels are

8、defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level is inte

9、nded for use in space applications. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process In

10、spections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s)

11、taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality

12、level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-11208 DLA LAND AND MARITIME COLUMBUS, OHI

13、O 43218-3990 REVISION LEVEL SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 16 Flat package with formed leads 1.2.5 Lead finish. The lead finish sha

14、ll be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Supply voltage (VCC) +7.0 V dc Input voltage (VIN) range VCC+0.4 V, GND -0.4 V PREF relative to NREF +6.0 V Junction temperature (TJ) +150C Power at +25C 250 mW Thermal resistance, junction-to-case (JC) . 10C/W Storage temperature

15、 range -65C to +150C Lead temperature (soldering, 10 seconds) +300C 1.4 Recommended operating conditions. Supply voltage range (VCC) . +3.0 V dc to +5.5 V dc Case operating temperature range (TC) -55C to +125C 1.5 Radiation features. Maximum Total Ionizing Dose (TID) (dose rate = 50 - 300 rad(Si)/s)

16、: In accordance with MIL-STD-883, method 1019, condition A. 1 Mrad(Si) Enhanced Low Dose Rate Sensitvity (ELDRS) Immune by CMOS technology Single Event Latchup (SEL) . 100 MeV-cm2/mg 2/ Neutron Displacement Damage ( 1 x 1014 neutrons/cm2) Immune by CMOS technology 2. APPLICABLE DOCUMENTS 2.1 Governm

17、ent specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIO

18、NS MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit

19、 Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) _ 1/ Stresses above the absolute maximum rat

20、ings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ This limit is guaranteed by design or process, but not tested. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-

21、STANDARD MICROCIRCUIT DRAWING SIZE A 5962-11208 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 4 DSCC FORM 2234 APR 97 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence

22、. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Complianc

23、e with MIL-PRF-38534 shall include the performance of all tests herein or as designated in the device manufacturers Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performa

24、nce requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, constructi

25、on, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Radiation exposure circuit. T

26、he radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance char

27、acteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking of

28、device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers vendor similar PIN may also be marked. 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufactu

29、rer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any

30、, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DLA Land and Maritime -VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in orde

31、r to supply to this drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime -VA shall affirm that the manufacturers product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MI

32、L-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturers Quality Management (QM) plan. The modification

33、in the QM plan shall not affect the form, fit, or function as described herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-11208 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 5 DSC

34、C FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TC +125C VCC= +5.0 V Group A subgroups Device type Limits Unit unless otherwise specified Min Max Resolution 2/ RES 1,2,3 All 11 Bits Supply current ICCToggle inputs, VCC, GND 1,2,3 All 5 mA Quiescent

35、current ICCqAll inputs = VCC1,2,3 All 5 mA Relative accuracy RA PREF = VCC, NREF = GND 1,2,3 All 0.25 %FSR Gain error AE PREF = VCC, NREF = GND 1,2,3 All 0.55 %FSR Offset error OFF2 PREF = 4.9 V, NREF = 0.1 V 1,2,3 All 0.25 %FSR Differential Nonlinearity 2/ DNL PREF = VCC, NREF = GND 1,2,3 All 0.25

36、%FSR Output settling time TD All inputs = GND to VCC, PREF = 4.9 V, NREF = 0.1 V, Output = 1/2 LSB of Nominal 4,5,6 All 5 S PREF input Z 2/ ZP 1,2,3 All 5 k NREF input Z 2/ ZR1,2,3 All 5 k Input high voltage VIH PREF = 4.9 V, NREF = 0.1 V 1,2,3 All 3.5 V Input low voltage VILPREF = 4.9 V, NREF = 0.1

37、 V 1,2,3 All 1.5 V Input low leakage IIL Input under test = GND 1,2,3 All 1 nA Input high leakage IIH Input under test = VCC1,2,3 All 1 nA 1/ These devices have been tested to (2 Mrad(Si) to Method 1019, condition A of MIL-STD-883 at +25C for these parameters to ensure the requirements of RHA design

38、ator level H” (1Mrad(Si) are met. 2/ Not tested. Shall be guaranteed by design, characterization, or correlation to other test parameters. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-11208 DLA LAND AND MA

39、RITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 6 DSCC FORM 2234 APR 97 Case X Symbol Inches Millimeters Min Max Min Max A .105 2.68 A1 .030 REF 0.76 REF A2 .017 .027 0.43 0.69 A3 .012 0.30 b .015 .019 0.38 0.48 c .007 .009 0.18 0.23 D .417 10.59 e .050 BSC 1.27 BSC e1 .350 BSC 8.90 BSC E .300

40、 7.62 E1 .394 .419 10.01 10.64 E2 .346 REF 8.79 REF NOTE: 1. Location of the pin 1 marking. The ESD symbol may be used as the pin 1 marking. 2. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving confl

41、icts between the metric and inch-pound units, the inch-pound units shall rule. 3. The package and lid are electrically isolated from signal pads. FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SI

42、ZE A 5962-11208 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 7 DSCC FORM 2234 APR 97 Device types 01 02 Case outline X Terminal number Terminal symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 PREF NREF GND D10 (MSB) D09 D08 D07 D06 D05 D04 D03 D02 D01 D00 (LSB) VCCAOUT PREF NRE

43、F GND D10 (MSB) D09 D08 D07 D06 D05 D04 D03 D02 D01 D00 (LSB) VCCAOUT (Buffered) FIGURE 2. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-11208 DLA LAND AND MARITIME COLUMBUS, OHIO 4321

44、8-3990 REVISION LEVEL SHEET 8 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-PRF-38534 test requirements Subgroups (in accordance with MIL-PRF-38534, group A test table) Interim electrical parameters 1 Final electrical parameters 1*, 2, 3, 4, 5, 6 Group A test requirements 1, 2, 3

45、, 4, 5, 6 Group C end-point electrical parameters 1, 2, 3, 4, 5, 6 End-point electrical parameters for Radiation Hardness Assurance (RHA) devices 1 * PDA applies to subgroup 1. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. Burn-

46、in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DLA Land and Maritime -VA or the acquiring activity upon request. Also, the test circuit shall s

47、pecify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TAas specified in accordance with table I of method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table

48、 II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance with MIL-PRF-38534 and as specified herein. 4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows: a. Tests shall be as specified in table II herein. b. Subgroups 7, 8A, 8B, 9, 10, and 11 shall be omitted. 4.3.2 Group B inspection (PI). Group