DLA SMD-5962-09235 REV C-2013 MICROCIRCUIT LINEAR 2 5 V AND 5 0 V PRECISION MICROPOWER SHUNT VOLTAGE REFERENCE MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add conditions of IR= 15 mA for subgroups 2, 3 and make limit changes to the VR/ T test as specified under Table I. - ro 11-03-24 C. SAFFLE B Add device type 62. Make change to title block on first sheet. Make change to Table IB title description
2、 and footnote 1/. - ro 12-05-10 C. SAFFLE C Make limit changes to Reverse breakdown voltage tolerance test as specified under Table IB. Delete device class M references. - ro 13-10-02 C. SAFFLE REV SHEET REV C SHEET 15 REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 1
3、1 12 13 14 PMIC N/A PREPARED BY RICK OFFICER DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY RAJESH PITHADIA APPROVED BY CHARLES F
4、. SAFFLE MICROCIRCUIT, LINEAR, 2.5 V AND 5.0 V PRECISION MICROPOWER SHUNT VOLTAGE REFERENCE, MONOLITHIC SILICON DRAWING APPROVAL DATE 10-08-18 AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-09235 SHEET 1 OF 15 DSCC FORM 2233 APR 97 5962-E494-13 Provided by IHSNot for ResaleNo reproduction or
5、networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-09235 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliabilit
6、y (device classes Q) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as show
7、n in the following example: 5962 R 09235 61 V Z A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices
8、meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 61 LM4050 Radiation hardened, 2.5 V pr
9、ecision micropower shunt voltage reference 62 LM4050 Radiation hardened, 5.0 V precision micropower shunt voltage reference 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation
10、 Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style Z GDFP1-G10 10 Flat pack with gullwing leads 1.2.5 Lead finish. The lead finish is as sp
11、ecified in MIL-PRF-38535 for device classes Q and V. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-09235 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.3 Ab
12、solute maximum ratings. 1/ Reverse current 20 mA Forward current . 10 mA Power dissipation (PD) (TA= +25C) 467 mW 2/ Junction temperature (TJ) . +150C Lead temperature (soldering, 10 seconds) +260C Storage temperature . -65C to +150C Electrostatic discharge (ESD) tolerance . 2, 000 V 3/ Thermal resi
13、stance, junction-to-case (JC) . 20.87C/W Thermal resistance, junction-to-ambient (JA) 214C/W (still air) 147C/W (500 linear feet /minute air flow) 1.4 Recommended operating conditions. Reverse current : Device type 61 . 60 A to 15 mA Device type 62 . 74 A to 15 mA Ambient operating temperature range
14、 (TA) . -55C to +125C 1.5 Radiation features. Maximum total dose available (dose rate = .010 rads(Si)/s) . 100 krads(Si) 4/ The manufacturer supplying RHA parts on this drawing has performed a characterization test to demonstrate if the parts exhibit enhanced low dose rate sensitivity (ELDRS) accord
15、ing to MIL-STD-883 method 1019 paragraph 3.13.11. These parts have been characterized and observed to be enhanced low dose rate sensitive. However, the characterization test demonstrated the parts did pass the radiation end point parameter limits under low dose rate conditions according to MIL-STD-8
16、83 method 1019 paragraph 3.13.3.b. The manufacturer will continue to perform low dose rate lot acceptance testing on each wafer lot or wafer according to method 1019 of MIL-STD-883. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the ma
17、ximum levels may degrade performance and affect reliability. 2/ Maximum power dissipation must be de-rated at elevated temperatures and is dictated by TJ(maximum junction temperature), JA(junction to ambient thermal resistance), and TA(ambient temperature). The maximum allowable power dissipation at
18、 any temperature is PDmax= (TJ(max) TA) / JAor the number given in absolute maximum ratings paragraph 1.3 herein, which ever is lower. 3/ The human body model is 100 pF capacitor discharged through a 1.5 k resistor into each pin. 4/ For device types 61 and 62, these part have been tested and do demo
19、nstrate enhanced low dose rate effects. Radiation end point limits for the noted parameters are guaranteed for the conditions specified in MIL-STD-883, method 1019, condition D and paragraph 3.13.3.b. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S
20、TANDARD MICROCIRCUIT DRAWING SIZE A 5962-09235 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this draw
21、ing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-88
22、3 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:
23、/quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothin
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