DLA DSCC-VID-V62 03611 REV B-2012 MICROCIRCUIT DIGITAL CMOS HIGH-SPEED SERIAL-BUS LINK-LAYER CONTROLLER MONOLITHIC SILICON.pdf
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1、 REVISIONSLTR DESCRIPTION DATE APPROVEDA Update boilerplate to current revision. - CFS 07-09-12 Thomas M. Hess B Update boilerplate paragraphs to current requirements. - PHN 12-04-10 Thomas M. Hess CURRENT DESIGN ACTIVITY CAGE CODE 16236 HAS CHANGED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 432
2、18-3990 Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV B B B B B B B B B B B B B B B B B PAGE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 PMIC N/A PREPARED BY Charles F. Saffle DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43218-3990 Original dat
3、e of drawing CHECKED BY Thomas M. Hess TITLE MICROCIRCUIT, DIGITAL, CMOS, HIGH-SPEED SERIAL-BUS LINK-LAYER CONTROLLER, MONOLITHIC SILICON YY-MM-DD 02-12-12 APPROVED BY Thomas M. Hess SIZE A CODE IDENT. NO. 16236 DWG NO. V62/03611 REV B PAGE 1 OF 17 AMSC N/A 5962-V052-12 Provided by IHSNot for Resale
4、No reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/03611 REV B PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance high-speed serial-bus link-layer co
5、ntroller microcircuit, with an operating temperature range of -40C to +85C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering doc
6、umentation: V62/03611 - 01 X E Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 TSB12LV01B-EP High-Speed Serial-Bus Link-Layer Controller 1.2.2 Case outline(s). The case outlines are as specified her
7、ein. Outline letter Number of pins JEDEC PUB 95 Package style X 100 JEDEC MS-026 Plastic Quad Flatpack 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer: Finish designator Material A Hot solder dip B Tin-lead plateC Gold plate
8、D PalladiumE Gold flash palladium Z Other 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) . -0.5 V to +3.6 V Supply voltage range (VCC5V) . -0.5 V to +5.5 V Input voltage range (VI) . -0.5 V to VCC+ 0.5 V Output voltage range (VO) . -0.5 V to VCC+ 0.5 V Input clamp current (IIK) (VIVCC)
9、20 mA 2/ Output clamp current (IOK) (VOVCC) 20 mA 3/ Maximum power dissipation: TA +25C . 1500 mW TA +70C . 739.5 mW TA +85C . 486 mW Operating free-air temperature range (TA) -40C to +85C Storage temperature range (TSTG) . -65C to +150C 1/ Stresses beyond those listed under “absolute maximum rating
10、” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may af
11、fect device reliability. 2/ This applies to external input and bidirectional buffers. For 5 V tolerant terminals, use VI VCC5V. 3/ This applies to external output and bidirectional buffers. For 5 V tolerant terminals, use VO VCC5V. Provided by IHSNot for ResaleNo reproduction or networking permitted
12、 without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/03611 REV B PAGE 3 1.4 Recommended operating conditions. 4/ Supply voltage range (VCC) . +3.0 V to +3.6 V Supply voltage range (VCC5V): (5 V tolerant) +3.0 V to +5.5 V (Non 5 V tolera
13、nt) +3.0 V to +3.6 V Minimum high level input voltage (VIH) +2.0 V Maximum low level input voltage (VIL) . +0.8 V Transition time (tt) (10% to 90%) . 0 to 6 ns Operating free-air temperature range (TA) -40C to +85C Junction temperature range (TJ) 0C to +115C 5/ 2. APPLICABLE DOCUMENTS JEDEC SOLID ST
14、ATE TECHNOLOGY ASSOCIATION (JEDEC) JEP95 Registered and Standard Outlines for Semiconductor Devices (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10th Street, Suite 240S, Arlington, VA 22201.) THE INSTITUTE OF ELEC
15、TRICAL AND ELECTRONICS ENGINEERS (IEEE) IEEE 1394-1995 - (1394) Standard for High-Performance Serial Bus (Copies of these documents are available online at http:/www.ieee.org or from the IEEE Service Center, 445 Hoes Lane, P.O. Box 1331, Piscataway, NJ 088551331. 4/ Use of this product beyond the ma
16、nufacturers design rules or stated parameters is done at the users risk. The manufacturer and/or distributor maintain no responsibility or liability for product used beyond the stated limits. 5/ The junction temperatures listed reflect simulation conditions. The absolute maximum junction temperature
17、 is 150C. The customer is responsible for verifying the junction temperature. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/03611 REV B PAGE 4 3. REQUIREMENTS 3.
18、1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufactu
19、rers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, c
20、onstruction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Block diagram. The block diagram shall be as shown in figure 2. 3.5.3 Terminal connections. The terminal connections shall be as shown in fi
21、gure 3. 3.5.4 Timing waveforms. The timing waveforms shall be as shown in figure 4. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/03611 REV B PAGE 5 TABLE I. Ele
22、ctrical performance characteristics. 1/ Test Symbol Test conditions unless otherwise specified VCCTemperature, TALimits Unit Min Max High level output voltage VOHIOH= -8 mA 2/ 3.0 V and 3.6 V -40C to +85C VCC 0.6 V IOH= -4 mA 3/ VCC 0.6 Low level output voltage VOLIOL= 8 mA 2/ 3.0 V and 3.6 V 0.5 V
23、IOL= 4 mA 3/ 0.5 Low level input current IIL4/ VI= GND TTL/LVCMOS 3.0 V and 3.6 V -1 A 5-V tolerant 3.0 V and 3.6 V -20 D0-D7, CTL0, CTL1 3.0 V and 3.6 V -20 High level input current IIHVI= VCCTTL/LVCMOS 3.0 V and 3.6 V 1 A VI= VCC, 5V 5-V tolerant 3.0 V and 3.6 V 20 D0-D7, CTL0, CTL1 3.0 V and 3.6
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