BS EN 61191-4-1999 Printed board assemblies - Sectional specification - Requirements for terminal soldered assemblies《印制电路板组件 分规范 端点焊接组件要求》.pdf

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1、BRITISH STANDARD BS EN 61191-4:1999 IEC 61191-4: 1998 Printed board assemblies Part 4: Sectional specification Requirements for terminal soldered assemblies The European Standard EN 61191-4:1998 has the status of a British Standard ICS 31.180BSEN61191-4:1999 This British Standard, having been prepar

2、ed under the directionof the Electrotechnical Sector Committee, was publishedunderthe authority ofthe Standards Committee andcomesinto effect on 15 January 1999 BSI 05-1999 ISBN 0 580 30841 3 National foreword This British Standard is the English language version of EN61191-4:1998. It is identical w

3、ith IEC61191-4:1998. The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly technology, which has the responsibility to: aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpret

4、ation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. A list of organizations represented on this committee can be obtained on request to its secretary. From 1 January 1997, all IEC publications have

5、 the number60000 added to the old number. For instance, IEC27-1 has been renumbered as IEC60027-1. For a period of time during the change over from one numbering system to the other, publications may contain identifiers from both systems. Cross-references Attention is drawn to the fact that CEN and

6、CENELEC Standards normally include an annex which lists normative references to international publications with their corresponding European publications. The British Standards which implement these international or European publications may be found in the BSI Standards Catalogue under the section

7、entitled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Com

8、pliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, theEN title page, pages 2 to 14, an inside back cover and a back cover. This standard has been updated (see copyri

9、ght date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Amendments issued since publication Amd. No. Date CommentsBSEN61191-4:1999 BSI 05-1999 i Contents Page National foreword Inside front cover Foreword 2 Text of EN 61191-4 3ii b

10、lankEUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 61191-4 October 1998 ICS 31.240 English version Printed board assemblies Part 4: Sectional specification Requirements for terminal soldered assemblies (IEC 61191-4:1998) Ensembles de cartes imprimes Partie4:Spcification intermdiaire Exigences

11、relatives lassemblage de bornes par brasage (CEI 61191-4:1998) Elektronikaufbauten auf Leiterplatten Teil 4: Rahmenspezifikation Anforderungen an geltete Baugruppen mit Ltsttzpunkten (IEC 61191-4:1998) This European Standard was approved by CENELEC on 1998-10-01. CENELEC members are bound to comply

12、with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secret

13、ariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as th

14、e official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, CzechRepublic, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committ

15、ee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1998 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC member

16、s. Ref. No. EN 61191-4:1998 EEN61191-4:1998 BSI 05-1999 2 Foreword The text of document 91/135/FDIS, future edition1 of IEC61191-4, prepared by IECTC91, Surface mounting technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN61191-4 on1998-10-01. This EN61191-4is

17、 to be used in conjunction with EN61191-1:1998. The following dates were fixed: Annexes designated “normative” are part of the body of the standard. In this standard, Annex ZA is normative. Annex ZA has been added by CENELEC. Endorsement notice The text of the International Standard IEC61191-4:1998w

18、as approved by CENELEC as a European Standard without any modification. Contents Page Foreword 2 1 General 3 1.1 Scope 3 1.2 Classification 3 2 Normative references 3 3 General requirements 3 4 General terminal and part mounting requirements 3 4.1 Wire and cable preparation 3 4.2 Terminal installati

19、on 3 4.3 Mounting to terminals 6 5 Acceptance requirements 13 5.1 Control and corrective actions 14 5.2 Terminal soldering 14 5.3 Part marking and reference designations 14 6 Rework of unsatisfactory soldered connections 14 Annex ZA (normative) Normative referencesto international publications witht

20、heir corresponding European publications Inside back cover Figure 1 Rolled flange terminal 4 Figure 2 Rolled flange discontinuities 4 Figure 3 Flared flange terminals 5 Figure 4 Flared angles 6 Figure 5 Wire and lead wrap around 6 Figure 6 Side route connections and wrap on bifurcated terminal 8 Fig

21、ure 7 Top and bottom route terminal connection 9 Figure 8 Continuous run wire wraps 10 Figure 9 Service loop for lead wiring 10 Figure 10 Insulation clearance measurement (c) 11 Figure 11 Stress relief examples 12 Figure 12 Pierced or perforated terminal wire wrap 13 Table 1 Nicked or broken strand

22、limits 3 Table 2 Plated through-holes with terminals, minimum acceptance conditions 14 Table 3 Defects for terminal attachment and soldering defects 14 latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 1999-07

23、-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2001-07-01EN61191-4:1998 BSI 05-1999 3 1 General 1.1 Scope This standard prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are totally terminal

24、/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e.surface mounting, through-hole mounting, chip mounting). 1.2 Classification This specification recognizes that electrical and electronic assemblies are subject to classi

25、fications by intended end-item use. Three general end-product levels have been established to reflect differences in producibility, complexity, functional performance requirements, and verification (inspection/test) frequency. These are the following: Level A: General electronic products Level B: De

26、dicated service electronic products Level C: High-performance electronic products The user of the assemblies is responsible for determining the level to which his product belongs. The contract shall specify the level required and indicate any exceptions or additional requirements to the parameters,

27、where appropriate. It should be recognized that there may be overlaps of equipment between level where appropriate (see clause4 in IEC61191-1). 2 Normative references The following normative document contains provisions which, through reference in this text, constitute provisions of this part of IEC

28、61191. At the time of publication, the edition indicated was valid. All normative documents are subject to revision, and parties to agreements based on this part of IEC61191are encouraged to investigate the possibility of applying the most recent edition of the normative document indicated below. Me

29、mbers of IEC and ISO maintain registers of currently valid International Standards. IEC 61191-1:1998, Printed board assemblies Part1:Generic specification Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies. 3 General requirements Requ

30、irements of IEC61191-1 are a mandatory part of this specification. 4 General terminal and part mounting requirements The following requirements are applicable to part mounting in all types of assemblies. 4.1 Wire and cable preparation Sufficient insulation cover shall be stripped from the wire or le

31、ads to provide for insulation clearances as specified. Chemical stripping agents shall be used for solid wire only and shall be neutralized or removed prior to soldering, In stripping insulation, care should be taken to avoid nicking or otherwise damaging the wire or the remaining insulation. For le

32、vel A or B assemblies, the number of nicked or broken strands in a single wire shall not exceed the limits given in Table 1. For wires used at a potential of6kV or greater, or for level C assemblies, there shall be no broken strands. The number of nicked strands shall be in accordance with Table 1.

33、Insulation discolouration resulting from thermal stripping is permissible. Table 1 Nicked or broken strand limits 4.1.1 Tinning of stranded wire Portions of stranded wire which will be soldered shall be tinned prior to mounting. The solder shall penetrate to the inner strands of the wire and shall w

34、et the tinned portion of the wire. Wicking of solder under the insulation shall be minimized. 4.2 Terminal installation The detailed requirements for installation of solder terminals are defined in the following paragraphs. 4.2.1 Terminal mounting (mechanical) Terminals not connected to printed wiri

35、ng or ground planes shall be of the rolled flange configuration (seeFigure 1). A printed foil land may be used as a seating surface for a rolled flange provided that the land is isolated and not connected to active printed wiring or ground plane. Number of strands Maximum allowable nicked or broken

36、strands Level A and B Level C Less than 7 0 0 7 15 1 0 16 18 2 0 19 25 3 0 26 36 4 0 37 40 5 0 41 or more 6 0EN61191-4:1998 4 BSI 05-1999 4.2.2 Terminal shank discontinuities The shank of the terminal shall not be either perforated, split, cracked, or there shall not be discontinuity to the extent t

37、hat oils, flux, inks, or other substances used for processing the printed board can be entrapped. Circumferential cracks or splits in the shank are not acceptable regardless of the extent. 4.2.3 Flange discontinuities The rolled flange shall not be split, cracked or otherwise discontinuous to the ex

38、tent that flux, oils, inks, or other liquid substances utilized for processing the printed board can be entrapped within the mounting hole. After rolling, the rolled area shall be free of circumferential splits or cracks, but may have a maximum of three radial splits or cracks provided that the spli

39、ts or cracks are separated by at least 90 and do not extend into the barrel of the terminal (see Figure 2). 4.2.4 Terminal mounting (electrical) Flared flange terminals shall be mounted in non-interfacial plated through-holes provided the mounting is in conjunction with a land or ground plane on the

40、 flared side as shown in Figure 3a. They shall not be flared to the base material of the printed board. Funnel shoulder terminals shall not be used (see Figure 3b). Terminals may be mounted in nonplated through-holes with active circuitry on the top-side (or primary side) and a rolled flange on the

41、backside of the board (see Figure 3c). 4.2.5 Flange angles Flared flanges shall be formed to include an angle of between35 and120 and shall extend between0,4mm and1,5mm beyond the surface of the land provided minimum electrical spacing requirements are maintained (see Figure 4), and the flare diamet

42、er does not exceed the diameter of the land. Figure 1 Rolled flange terminal Figure 2 Rolled flange discontinuitiesEN61191-4:1998 BSI 05-1999 5 Figure 3 Flared flange terminalsEN61191-4:1998 6 BSI 05-1999 4.2.6 Shank discontinuities After installation, the shank of the terminal shall meet the requir

43、ements of4.2.2. 4.2.7 Flared flange discontinuities The flared flange of a terminal shall not be perforated, split, cracked, or otherwise discontinuous to the extent that flux, oils, inks or other substances utilized for processing the printed board can be entrapped. After flaring, the flange shall

44、conform to 4.2.3. 4.3 Mounting to terminals The detailed requirements for mounting of components and wires to terminals installed in printed boards, terminal boards or chassis members are defined in the following subclauses. 4.3.1 Wire and lead wrap-around Leads and wires should be mechanically secu

45、red to their terminals before soldering. Such mechanical securing should prevent motion between the parts of the connection during the soldering operation. Leads and wires shall be wrapped around turret and straight pin terminals for a minimum of180 and may overlap provided there is sufficient room

46、on the turret (see Figure 5). The last wire on a straight pin terminal shall be at least one wire diameter from the top to allow for an adequate solder fillet. Adequate service loops should be provided to allow for field maintenance. For wires with a diameter less than0,25mm, a minimum of one turn a

47、nd a maximum of three turns shall be used. Exception is made in the case of those small parts used for terminating wires where such mechanical securing would be impracticable, such as connector solder cups, slotted terminal posts and heat shrinkable solder devices. Wires and leads shall contact the

48、post for at least180 and shall not be wrapped on each other. Figure 4 Flared angles Figure 5 Wire and lead wrap aroundEN61191-4:1998 BSI 05-1999 7 4.3.2 Side route connection If mechanically secured in accordance with4.3.1, a90 minimum wrap is acceptable (see Figure 6). Lead and wire ends may extend

49、 beyond the base of terminals provided the minimum electrical spacing is maintained. When practicable, except for bus wire, wires shall be placed in ascending order with the largest on the bottom. The wire or component lead shall be dressed through the slot and wrapped to either post of the terminal (see Figure 6) assuring positive contact of the wire with at least one corner of the post (seeFigure 6). The wire or lead shall also be in firm contact with the base of the terminal or the