BS EN 61191-1-2013 Printed board assemblies Generic specification Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologi.pdf

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1、BSI Standards PublicationPrinted board assemblies Part 1: Generic specification Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologiesBS EN 61191-1:2013National forewordThis British Standard is the UK implementation of EN 61191-1:2013. It

2、 is identical to IEC 61191-1:2013. It supersedes BS EN 61191-1:1999 which is withdrawn.The UK participation in its preparation was entrusted to Technical Com-mittee EPL/501, Electronic assembly technology 31.240Compliance with a British Standard cannot confer immunity fromlegal obligations.This Brit

3、ish Standard was published under the authority of theStandards Policy and Strategy Committee on 30 September 2013.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 61191-1:2013EUROPEAN STANDARD EN 61191-1 NORME EUROPENNE EUROPISCHE NORM August 2013 CENELEC Europea

4、n Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels 2013 CENELEC - All rights of exploitation in any form and by any means reserved worldwi

5、de for CENELEC members. Ref. No. EN 61191-1:2013 E ICS 31.190; 31.240 Supersedes EN 61191-1:1998 English version Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-

6、1:2013) Ensembles de cartes imprimes - Partie 1: Spcification gnrique - Exigences relatives aux ensembles lectriques ou lectroniques brass utilisant les techniques de montage en surface et associes (CEI 61191-1:2013) Elektronikaufbauten auf Leiterplatten - Teil 1: Fachgrundspezifikation - Anforderun

7、gen an geltete elektrische und elektronische Baugruppen unter Verwendung der Oberflchenmontage und verwandter Montagetechniken (IEC 61191-1:2013) This European Standard was approved by CENELEC on 2013-06-25. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulat

8、e the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European

9、Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members

10、 are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway

11、, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. BS EN 61191-1:2013EN 61191-1:2013 - 2 - Foreword The text of document 91/1089A/FDIS, future edition 2 of IEC 61191-1, prepared by IEC/TC 91 “Electronics assembly technology“ was submitted to t

12、he IEC-CENELEC parallel vote and approved by CENELEC as EN 61191-1:2013. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2014-03-25 latest date by which the national stan

13、dards conflicting with the document have to be withdrawn (dow) 2016-06-25 This document supersedes EN 61191-1:1998. EN 61191-1:2013 includes the following significant technical changes with respect to EN 61191-1:1998: - reference standard EN 61192-1 has been replaced by IPC-A-610; - some of the term

14、inology has been updated; - references to EN standards have been corrected; - the use of lead-free alloys in the assembly have been added. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held respon

15、sible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 61191-1:2013 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards i

16、ndicated: IEC 60068-2-20:2008 NOTE Harmonised as EN 60068-2-20:2008 (not modified). IEC 60068-2-58:2004 NOTE Harmonised as EN 60068-2-58:2004 (not modified). IEC 61188-5-1:2002 NOTE Harmonised as EN 61188-5-1:2002 (not modified). IEC 61188-5-2:2003 NOTE Harmonised as EN 61188-5-2:2003 (not modified)

17、. IEC 61188-5-3:2007 NOTE Harmonised as EN 61188-5-3:2007 (not modified). IEC 61188-5-4:2007 NOTE Harmonised as EN 61188-5-4:2007 (not modified). IEC 61188-5-5:2007 NOTE Harmonised as EN 61188-5-5:2007 (not modified). IEC 61188-5-6:2003 NOTE Harmonised as EN 61188-5-6:2003 (not modified). IEC 61188-

18、7:2009 NOTE Harmonised as EN 61188-7:2009 (not modified). IEC 61189-2:2006 NOTE Harmonised as EN 61189-2:2006 (not modified). IEC 61190-1-2:2007 NOTE Harmonised as EN 61190-1-2:2007 (not modified). IEC 61193-1:2001 NOTE Harmonised as EN 61193-1:2002 (not modified). IEC 61193-3 NOTE Harmonised as EN

19、61193-3. IEC 62326-1:2002 NOTE Harmonised as EN 62326-1:2002 (not modified). IEC 62326-4:1996 NOTE Harmonised as EN 62326-4:1997 (not modified). IEC 62326-4-1:1996 NOTE Harmonised as EN 62326-4-1:1997 (not modified). ISO 9001:2008 NOTE Harmonised as EN ISO 9001:2008 (not modified). BS EN 61191-1:201

20、3- 3 - EN 61191-1:2013 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, onl

21、y the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year I

22、EC 60194 - Printed board design, manufacture and assembly - Terms and definitions EN 60194 - IEC 60721-3-1 - Classification of environmental conditions - Part 3: Classification of groups of environmental parameters and their severities - Section 1: Storage EN 60721-3-1 - IEC 61188-1-1 - Printed boar

23、ds and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies EN 61188-1-1 - IEC 61189-1 - Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology EN 61189-

24、1 - IEC 61189-3 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) EN 61189-3 - IEC 61190-1-1 - Attachment materials for electronic assembly - Part 1-1: Requirements for so

25、ldering fluxes for high-quality interconnections in electronics assembly EN 61190-1-1 - IEC 61190-1-2 - Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly EN 61190-1-2 - IEC 61190-1-3 - Attachment material

26、s for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications EN 61190-1-3 - IEC 61191-2 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemb

27、lies EN 61191-2 - BS EN 61191-1:2013EN 61191-1:2013 - 4 - Publication Year Title EN/HD Year IEC 61191-3 - Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies EN 61191-3 - IEC 61191-4 - Printed board assemblies - Part 4: Sectional speci

28、fication - Requirements for terminal soldered assemblies EN 61191-4 - IEC 61249-8-8 - Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings EN 61249-8-8 - IEC 61340-5-1 - Electrostatics - Part 5-1:

29、 Protection of electronic devices from electrostatic phenomena - General requirements EN 61340-5-1 - IEC/TR 61340-5-2 - Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide CLC/TR 61340-5-2 - IEC 61760-2 - Surface mounting technology - Part 2: Transpo

30、rtation and storage conditions of surface mounting devices (SMD) - Application guide EN 61760-2 - IPC-A-610E 2010 Acceptability of Electronic Assemblies - - BS EN 61191-1:2013 2 61191-1 IEC:2013 CONTENTS 1 Scope . 8 2 Normative references . 8 3 Terms and definitions . 9 4 General requirements . 10 4

31、.1 Order of precedence 10 4.1.1 General remark . 10 4.1.2 Conflict 10 4.1.3 Conformance documentation . 10 4.2 Interpretation of requirements . 10 4.3 Classification . 11 4.4 Defects and process indicators 11 4.5 Process control requirements 11 4.6 Requirements flowdown 11 4.7 Physical designs . 12

32、4.7.1 Design requirements 12 4.7.2 New designs 12 4.7.3 Existing designs 12 4.8 Visual aids 12 4.9 Proficiency of personnel 12 4.9.1 Design proficiency . 12 4.9.2 Manufacturing proficiency 12 4.10 Electrostatic discharge (ESD) 12 4.11 Facilities 13 4.11.1 General . 13 4.11.2 Environmental controls 1

33、3 4.11.3 Temperature and humidity . 13 4.11.4 Lighting . 13 4.11.5 Field conditions . 13 4.11.6 Clean rooms 13 4.12 Assembly tools and equipment 13 4.12.1 General . 13 4.12.2 Process control 14 5 Materials requirements . 14 5.1 Overview . 14 5.2 Solder . 14 5.3 Flux . 14 5.4 Solder paste 15 5.5 Pref

34、orm solder . 15 5.6 Adhesives . 15 5.7 Cleaning agents 15 5.7.1 General . 15 5.7.2 Cleaning agents selection 15 5.8 Polymeric coatings 15 5.8.1 General . 15 BS EN 61191-1:201361191-1 IEC:2013 3 5.8.2 Solder resists and localized maskants . 15 5.8.3 Conformal coating and encapsulants . 15 5.8.4 Space

35、rs (permanent and temporary) 16 5.9 Chemical strippers. 16 5.10 Heat shrinkable soldering devices . 16 6 Components and printed board requirements . 16 6.1 General . 16 6.2 Solderability 16 6.2.1 Parts solderability 16 6.2.2 Reconditioning . 16 6.2.3 Solderability testing of ceramic boards 16 6.3 So

36、lderability maintenance . 17 6.3.1 General . 17 6.3.2 Preconditioning 17 6.3.3 Gold embrittlement of solder joints 17 6.3.4 Tinning of non-solderable parts . 17 6.4 Solder purity maintenance . 18 6.5 Lead preparation . 18 6.5.1 General . 18 6.5.2 Lead forming . 19 6.5.3 Lead forming limits 19 7 Asse

37、mbly process requirements . 19 7.1 Overview . 19 7.2 Cleanliness . 19 7.3 Part markings and reference designations . 19 7.4 Solder connection contours . 19 7.5 Moisture traps . 19 7.6 Thermal dissipation . 20 8 Assembly soldering requirements . 20 8.1 General . 20 8.2 General . 20 8.2.1 Soldering pr

38、ocess 20 8.2.2 Machine maintenance 20 8.2.3 Handling of parts . 20 8.2.4 Preheating . 20 8.2.5 Carriers . 20 8.2.6 Hold down of surface mount leads . 20 8.2.7 Heat application. 21 8.2.8 Cooling 21 8.3 Reflow soldering 21 8.3.1 Requirements 21 8.3.2 Process development for reflow soldering 21 8.3.3 F

39、lux application . 21 8.3.4 Solder application 21 8.4 Mechanized immersion soldering (non-reflow) . 22 8.4.1 General . 22 8.4.2 Process development for mechanized immersion soldering . 22 8.4.3 Drying/degassing . 23 8.4.4 Holding fixtures and materials . 23 BS EN 61191-1:2013 4 61191-1 IEC:2013 8.4.5

40、 Flux application . 23 8.4.6 Solder bath 23 8.5 Manual/hand soldering 23 8.5.1 Requirements 23 8.5.2 Non-reflow manual soldering . 24 8.5.3 Reflow manual soldering 24 9 Cleanliness requirements . 25 9.1 General . 25 9.2 Equipment and material compatibility 25 9.3 Pre-soldering cleaning . 25 9.4 Post

41、-soldering cleaning . 25 9.4.1 General . 25 9.4.2 Ultrasonic cleaning 25 9.5 Cleanliness verification 26 9.5.1 General . 26 9.5.2 Visual inspection . 26 9.5.3 Testing 26 9.6 Cleanliness criteria 26 9.6.1 General . 26 9.6.2 Particulate matter 26 9.6.3 Flux residues and other ionic or organic contamin

42、ants . 26 9.6.4 Cleaning option . 27 9.6.5 Test for cleanliness . 27 9.6.6 Rosin residues on cleaned board assemblies 27 9.6.7 Ionic residues (instrument method) 28 9.6.8 Ionic residues (manual method) . 28 9.6.9 Surface insulation resistance (SIR) 28 9.6.10 Other contamination 28 10 Assembly requir

43、ements 28 10.1 General . 28 10.2 Acceptance requirements 28 10.2.1 Process control 28 10.2.2 Corrective action limits 29 10.2.3 Control limit determination . 29 10.3 General assembly requirements 29 10.3.1 Assembly integrity . 29 10.3.2 Assembly damage . 29 10.3.3 Markings 30 10.3.4 Flatness (bow an

44、d twist) 30 10.3.5 Solder connection 30 10.3.6 Interfacial connections . 31 11 Coating and encapsulation . 31 11.1 Detail requirements . 31 11.2 Conformal coating . 32 11.2.1 Coating instructions . 32 11.2.2 Application 32 11.2.3 Performance requirements. 33 11.2.4 Rework of conformal coating . 34 1

45、1.2.5 Conformal coating inspection . 34 BS EN 61191-1:201361191-1 IEC:2013 5 11.3 Encapsulation 34 11.3.1 Encapsulation instructions . 34 11.3.2 Application 34 11.3.3 Performance requirements. 34 11.3.4 Rework of encapsulant material . 34 11.3.5 Encapsulant inspection 34 12 Rework and repair 35 12.1

46、 General . 35 12.2 Rework of unsatisfactory soldered electrical and electronic assemblies . 35 12.3 Repair . 36 12.4 Post rework/repair cleaning . 36 13 Product quality assurance 37 13.1 System requirements . 37 13.2 Inspection methodology . 37 13.2.1 Verification inspection . 37 13.2.2 Visual inspe

47、ction . 37 13.2.3 Sampling inspection 38 13.3 Process control . 38 13.3.1 System details . 38 13.3.2 Defect reduction 38 13.3.3 Variance reduction. 39 14 Other requirements . 39 14.1 Health and safety 39 14.2 Special manufacturing requirements 39 14.2.1 Manufacture of devices incorporating magnetic

48、windings . 39 14.2.2 High-frequency applications . 39 14.2.3 High-voltage or high-power applications 39 14.3 Guidance on requirement flowdown . 39 15 Ordering data . 39 Annex A (normative) Requirements for soldering tools and equipment . 41 Annex B (normative) Qualification of fluxes 43 Annex C (nor

49、mative) Quality assessment . 44 Bibliography 46 Figure 1 Solder contact angle 30 Figure 2 Solder wetting of plated through-holes without leads 31 Figure 3 Coating conditions . 33 Table 1 Solder contamination limits; maximum contaminant limit (percentage by weight) 18 Table 2 Electrical and electronic assembly defects 36 Table 3 Magnification requirements . 37 BS EN 61191-1:2013 8 61191-1 IEC:2013 PRINTED BOARD ASSEMBLIES Part 1: Generic specification Requirements for soldered electrical and electronic assemblies us