BS EN 60191-6-12-2011 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages DesL.pdf

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1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationMechanical standardization of semiconductor devicesPart 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guidel

2、ines for fine-pitch land grid array (FLGA)BS EN 60191-6-12:2011National forewordThis British Standard is the UK implementation of EN 60191-6-12:2011. It isidentical to IEC 60191-6-12:2011. It supersedes BS EN 60191-6-12:2002which is withdrawn.The UK participation in its preparation was entrusted to

3、Technical CommitteeEPL/47, Semiconductors.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions of acontract. Users are responsible for its correct application. BSI 2011ISBN 978 0 580

4、 70310 2ICS 31.080.01 Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of the StandardsPolicy and Strategy Committee on 31 August 2011.Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARD

5、BS EN 60191-6-12:2011EUROPEAN STANDARD EN 60191-6-12 NORME EUROPENNE EUROPISCHE NORM August 2011 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Management Centre: Avenue Marnix 17, B - 1

6、000 Brussels 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60191-6-12:2011 E ICS 31.080.01 Supersedes EN 60191-6-12:2002English version Mechanical standardization of semiconductor devices - Part 6-12: General rules for the

7、preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (IEC 60191-6-12:2011) Normalisation mcanique des dispositifs semiconducteurs - Partie 6-12: Rgles gnrales pour la prparation des dessins dencombrement des botier

8、s des dispositifs semiconducteurs montage en surface - Lignes directrices de conception pour les botiers matriciels plots et pas fins (FLGA) (CEI 60191-6-12:2011) Mechanische Normung von Halbleiterbauelementen - Teil 6-12: Allgemeine Regeln fr die Erstellung von Gehusezeichnungen von SMD-Halbleiterg

9、ehusen - Konstruktionsleitfaden fr Feinraster-Land-Grid-Array (FLGA) (IEC 60191-6-12:2011) This European Standard was approved by CENELEC on 2011-07-13. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the

10、status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, Germ

11、an). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria

12、, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. BS EN 60191-6-

13、12:2011EN 60191-6-12:2011 - 2 - Foreword The text of document 47D/784/CDV, future edition 2 of IEC 60191-6-12, prepared by SC 47D, Mechanical standardization for semiconductor devices, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as

14、EN 60191-6-12 on 2011-07-13. This European Standard supersedes EN 60191-6-12:2002. EN 60191-6-12:2011 includes the following significant changes with respect to EN 60191-6-12:2002: a) scope is expanded so that this standard include the square type FLGA. The title of this standard has been changed ac

15、cordingly: “Rectangular type” has been deleted from the title; b) ball pitch of 0,3 mm has been added; c) datum is changed from the body datum to the ball datum; d) combination lists of D, E, MD, and MEhave been revised. Attention is drawn to the possibility that some of the elements of this documen

16、t may be the subject of patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent rights. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (

17、dop) 2012-04-13 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2014-07-13 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 60191-6-12:2011 was approved by CENELEC as a European Standard without any mod

18、ification. _ BS EN 60191-6-12:2011- 3 - EN 60191-6-12:2011 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following referenced documents are indispensable for the application of this document. For dated references, only the

19、edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 601

20、91 Series Mechanical standardization of semiconductor devices EN 60191 Series IEC 60191-6 - Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages EN 60191-6 - BS EN 60191-6-12:2011 2 60191-

21、6-12 IEC:2011 CONTENTS 1 Scope . 5 2 Normative references . 5 3 Terms and definitions . 5 4 Terminal position numbering . 6 5 Nominal package dimension . 6 6 Outline drawings and principle dimensions . 7 7 Dimensions 10 Figure 1 Flange-type FLGA 6 Figure 2 Rectangle-type FLGA . 6 Figure 3 Flange-typ

22、e FLGA 7 Figure 4 Rectangle-type FLGA . 8 Figure 5 Mechanical gauge drawing e. 9 Figure 6 Pattern of terminal position area f. 9 Table 1 Group 1: Dimensions appropriate to mounting and interchangeability 10 Table 2 Group 2: Dimensions and tolerances . 14 Table 3 Combination list of D, E, MD, and ME

23、e = 0,80mm pitch . 15 Table 4 Combination list of D, E, MD, and ME e = 0,65 mm pitch . 16 Table 5 Combination list of D, E, MD, and ME e = 0,50 mm pitch . 17 Table 6 Combination list of D, E, MD, and ME e = 0,40 mm pitch . 18 Table 7 Combination list of D, E, MD, and ME e = 0,30 mm pitch . 19 BS EN

24、60191-6-12:201160191-6-12 IEC:2011 5 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guidelines for fine-pitch land grid array (FLGA) 1 Scope This part of IEC 60191 provides s

25、tandard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the

26、edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60191(all parts), Mechanical standardization of semiconductor devices IEC 60191-6, Mechanical standardization of semiconductor devices Part 6: General rules for the pr

27、eparation of outline drawings of surface mounted semiconductor device packages 3 Terms and definitions For the purposes of this document, the terms and definitions given IEC 60191 series and the following apply. 3.1 fine-pitch land grid array FLGA package with metal lands on one side of a substrate

28、in a matrix of at least three rows and three columns on a pitch of 0,8 mm or less, wherein the maximum standoff height is 0,10 mm or less NOTE Terminals may be missing from some row-column intersections. 3.2 flange-type FLGA FLGA with a package outline (length, width) defined by a package flange par

29、t, mostly substrate, extending outward beyond the perimeter of a molded part or of a flip-chip-bonded part NOTE Flange-type FLGA, shown in Figure 1, is generally cut by singulation press, thus resulting in larger dimensional errors than the singulation by dicing saw BS EN 60191-6-12:2011 6 60191-6-1

30、2 IEC:2011 Figure 1 Flange-type FLGA 3.3 rectangle-type FLGA FLGA with a package outline (length, width) defined by a molded part with no extending flange part NOTE Rectangle-type FLGA, shown in Figure 2, is generally cut by dicing, thus resulting in less dimensional errors than the singulation by p

31、ress machine. Figure 2 Rectangle-type FLGA 4 Terminal position numbering When a package is viewed from the terminal side with the index corner in the bottom left corner position, terminal rows are lettered from bottom to top starting with A, then B, C, AA, AB, etc, whereas terminal columns are numbe

32、red from left to right starting with 1. Terminal positions are designated by a row-column grid system and shown as alphanumeric identification, e.g., A1, B1. The letters I, O, Q, S, X and Z shall not be used for naming the terminal rows. 5 Nominal package dimension A nominal package dimension is def

33、ined as “the package width (E) length (D)”, which is expressed in the tenths place in millimeter. IEC 1163/11 IEC 1164/11 BS EN 60191-6-12:201160191-6-12 IEC:2011 7 6 Outline drawings and principle dimensions The FLGA outline is shown in Figures 3 and 4. b a B E ADy1S A1AS y CZ e e(ZD)(ZE) D C B A 1

34、 2 3 4 n b x1x2M M M S S A M B c d Top view Side view Bottom view IEC 1165/11 NOTE For footnotes relating to this figure, see Figure 4. Figure 3 Flange-type FLGA BS EN 60191-6-12:2011 8 60191-6-12 IEC:2011 b a B E ADy1S A1AS y CZ e e(ZD)(ZE) D C B A 1 2 3 4 n b x1x2M M M S S A M B c d Top view Side

35、view Bottom view IEC 1166/11 NOTES relating to Figures 3 and 4: aDatum S is defined as the seating plane on which a package free stands by contact of the balls. bThe hatched zone is an index-marking area, where whole index mark will be basically contained in 1/16 of the body size, In case it is phys

36、ically difficult, index mark can extend more than 1/16 but no more than a quarter of the body size. cTrue positional tolerances of terminals, x1and x2, are applied to all terminals. dThe terminal diameter b is the maximum diameter of individual balls as measured in the plane parallel to the seating

37、plane. eAn array of terminal-existence areas with regard to the datum S, A, and B is shown in the mechanical gauge drawing in Figure 5. fThe array of terminal-existence areas with regard to the datum S is shown in Figure 6. Figure 4 Rectangle-type FLGA BS EN 60191-6-12:201160191-6-12 IEC:2011 9 e b3

38、eDmaxEmaxee b4IEC 1167/11 IEC 1168/11 NOTE The symbols in this figure are explained in IEC 60191-6. Figure 5 Mechanical gauge drawing eFigure 6 Pattern of terminal position area fBS EN 60191-6-12:2011 10 60191-6-12 IEC:2011 7 Dimensions Table 1 Group 1: Dimensions appropriate to mounting and interch

39、angeability Dimensions in millimeters Term Symbol Specification Recommended value Package nominal dimension E x D A package nominal dimension is defined as “the package width (E) x length (D), which is expressed in the tenths place in millimeter. - Package length D (1) Range of Dnom: from 1,5 to 21,

40、0 (2) Interval of DnomFor square FLGA with Dnom 15,0, Dnomis an integer. For other FLGA, the number in the tenths place of Dnomis either 0 or 5. (3) Tolerance of D For Flange-type: When Dnom 21,0, vD= 0,15 When Dnom 21,0, vD= 0,20 where vDdenotes a tolerance. For Rectangle-type: When Dnom12,0, vD= 0

41、,08 When 12,0 21,0, vD= 0,15 where vDdenotes a tolerance. - BS EN 60191-6-12:201160191-6-12 IEC:2011 11 Table 1 (continued) Dimensions in millimeters Term Symbol Specification Recommended value Package width E (1) Range of Enom: from 1,5 to 21,0 (2) Interval of EnomFor square FLGA with Enom 15,0, En

42、omis an integer. For other FLGA, the number in the tenths place of Enomis either 0 or 5. (3) Tolerance of “E” For flange-type: When Enom 21,0, vE= 0,15 When Enom 21,0, vE= 0,20 where vEdenotes a tolerance. For rectangle-type: When Enom12,0, vE= 0,08 When 12,0 21,0, vE= 0,15 where vEdenotes a toleran

43、ce. - Maximum profile height A “A” includes heat slug thickness, package warpage, and tilt errors. - Stand-off height A1A1max 0,10 - Terminal grid pitch e e = 0,80 0,65 0,50 0,40 0,30 - A = 0,30 0,40 0,50 0,65 0,80 1,00 1,20 1,70 2,00 BS EN 60191-6-12:2011 12 60191-6-12 IEC:2011 Table 1 (continued)

44、Dimensions in millimeters Term Symbol Specification Recommended value Terminal diameter b Datum- based positional tolerance of terminals x1For flange-type: For rectangle-type: x1is 0,15, irrespective of e. - e x10,80 0,20 0,65 0,20 0,50 0,20 0,40 0,15 0,30 0,15 For C-FLGA: emin. nom. max. 0,80 0,45

45、0,50 0,55 0,65 0,35 0,40 0,45 0,50 0,25 0,30 0,35 0,40 0,20 0,25 0,30 For P-FLGA and T-FLGA emin. nom. max. 0,80 0,35 0,40 0,45 0,65 0,30 0,35 0,40 0,50 0,20 0,25 0,30 0,40 0,15 0,20 0,25 0,30 0,12 0,15 0,18 BS EN 60191-6-12:201160191-6-12 IEC:2011 13 Table 1 (continued) Dimensions in millimeters Te

46、rm Symbol Specification Recommended value Relative positional tolerance of terminals x2- Coplanarity y - Parallelism of the top surface y1y1= 0,20 - Number of terminals n nmax= ME x MD (ME -1) x MD ME x (MD -1) (ME-1) x (MD-1) (ME +1) x MDME x (MD +1) (ME +1) x (MD +1) MD ( Dnom- bmax vD-X1 - x2 - 2

47、u)/ e+1 ME ( Enom- bmax vE- x1 - x2 - 2u)/ e+1 u = 0,11 Numbers of matrices in MEand MDare shown in Table 3. “u” denotes edge clearance. - Maximum matrix size in length MDMaximum matrix size in width MEe x20,80 0,08 0,65 0,08 0,50 0,05 0,40 0,05 0,30 0,03 e y 0,80 0,10 0,65 0,10 0,50 0,08 0,40 0,08

48、0,30 0,05 BS EN 60191-6-12:2011 14 60191-6-12 IEC:2011 Table 2 Group 2: Dimensions and tolerances Dimensions in millimeters Term Symbol Specification Recommended value Overhang dimension in length (ZD) (ZD) = Dnom- (MD- 1) x e /2 (ZD) is a reference value. - Overhang dimension in width (ZE) (ZE) = Enom - (ME- 1) x e /2 (ZE) is a reference value. - Datum- defined terminal- existence area b3b3= bmax + x1- Relative terminal- existence area b4b4 = bmax + x2- BS EN 60191-6-12:201160191-6-12 IEC:2011 15 Table 3 Combination list of D, E, MD, and ME e = 0,80mm pitch Dnomor EnomMDor