ASTM B885-2009(2015) Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts《印刷线路板触点上存在杂质的标准试验方法》.pdf

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1、Designation: B885 09 (Reapproved 2015)Standard Test Method forPresence of Foreign Matter on Printed Wiring BoardContacts1This standard is issued under the fixed designation B885; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision, the

2、year of last revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.1. Scope1.1 This test method defines a resistance probing test fordetecting the presence of foreign matter on Printed Wiri

3、ngBoard (PWB) contacts or fingers that adversely affects electri-cal performance. This test method is defined specifically forsuch fingers coated with gold. Application of this test methodto other types of electrical contacts or to fingers coated withother materials may be possible and desirable but

4、 may requiresome changes in fixturing, procedures, or failure criteria.1.2 Practice B667 describes another contact resistanceprobe method that has more general application to electricalcontacts of various materials and shapes. Practice B667 shouldbe used for more fundamental studies. This test metho

5、dprovides a fast inspection method for printed wiring boardfingers.1.3 The values stated in SI units are to be regarded asstandard. No other units of measurement are included in thisstandard.1.4 This standard does not purport to address all of thesafety concerns, if any, associated with its use. It

6、is theresponsibility of the user of this standard to become familiarwill all hazards including those identified in the appropriateMaterial Safety Data Sheet (MSDS) for this product/materialas provided by the manufacturer, to establish appropriatesafety and health practices, and determine the applica

7、bility ofregulatory limitations prior to use.2. Referenced Documents2.1 ASTM Standards:2B539 Test Methods for Measuring Resistance of ElectricalConnections (Static Contacts)B542 Terminology Relating to Electrical Contacts and TheirUseB667 Practice for Construction and Use of a Probe forMeasuring Ele

8、ctrical Contact Resistance3. Terminology3.1 DefinitionsTerms used in this test method related toelectrical contacts are defined in accordance with TerminologyB542.3.2 Definitions of Terms Specific to This Standard:3.2.1 edgecard connector, nan electrical connector de-signed to connect physically and

9、 electrically with a compatiblePWB equipped with gold fingers.3.2.2 printed wiring board (PWB) contacts, PWB fingers,nareas near the edge of a printed wiring board coated withgold and designed to function as electrical contacts when theboard is plugged into a compatible edgecard connector.4. Summary

10、 of Test Method4.1 Two closely spaced electrodes are brought into contactwith a single PWB finger in such a manner that they contact thesurface with a minimum of wipe.Afixture loads each electrodeto apply a force in the range of 0.5 to 0.7 N to the surface ofthe finger. Two electrical leads attached

11、 to each electrode areused to make a fourwire resistance measurement to detectelevated resistance indicative of the presence of a film or othercontaminant on the finger.5. Significance and Use5.1 This test method provides a way to detect contaminationon printed wiring board fingers that affects the

12、electricalperformance of such fingers. Such contamination may ariseduring PWB manufacture, circuit assembly, or service life andmay include solder mask, solder flux, hardened lubricants,dust, or other materials. This test method provides a nonde-structive method of inspecting such fingers at any poi

13、nt in thelife of the product including after original manufacture, afterassembly of circuit components to the PWB, and after time inservice such as when returned for repair. Because this testmethod uses two probes to finger contacts in series, it providesa sensitive test for contaminants that may in

14、crease electricalresistance when the fingers are plugged into an edgecard1This test method is under the jurisdiction of ASTM Committee B02 onNonferrous Metals and Alloys and is the direct responsibility of SubcommitteeB02.11 on Electrical Contact Test Methods.Current edition approved May 1, 2015. Pu

15、blished May 2015. Originallyapproved in 1997. Last previous edition approved in 2009 as B885 09. DOI:10.1520/B0885-09R15.2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of ASTMStandards volume information, refe

16、r to the standards Document Summary page onthe ASTM website.Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States1connector that typically makes contact to the finger throughonly one contact to finger interface.5.2 Practice B667 describes a

17、 more general procedure formeasuring contact resistance of any solid material in practi-cally any geometrical form. The method in Practice B667should be used for general studies and fundamental studies ofelectrical contact materials.6. Apparatus6.1 Four-Wire m Meter, with a resolution of 0.0001 orbe

18、tter, capable of performing dry circuit resistance measure-ments in accordance with Test Methods B539, Test Method C.6.2 Two Gold-Tipped Electrodes (Probes), with a radius notless than 3.0 mm at the tips. Each electrode shall have twowires attached. One wire, the voltage lead, shall be attachedwithi

19、n 2 mm of the tip end. The other wire, the current lead,shall be attached at any convenient location that is at least 0.5mm farther away from the tip than the attachment point of thevoltage lead.6.3 Fixture, to hold the PWB securely while it is beingprobed and a fixture to hold the two electrodes, s

20、uch that thedistance between the centers of the electrodes is 2.0 to 2.5 mmand both electrodes will be centered roughly on a single PWBfinger. Fig. 1 shows an example of a suitable fixture. Otherfixtures that provide the same capability may be used. Locatethis fixture to minimize shock and vibration

21、 reaching theprobes. Placement on a foam pad on a bench top has beenfound suitable.6.4 Two Springs, one for each electrode, having a springconstant and a pretension that will apply a load in the range of0.5 to 0.7 N when the electrode is brought to rest on the fingerbeing tested. Other mechanisms th

22、at achieve the same resultare acceptable.6.5 Mechanism, that will move the electrode fixture from anopen position to the closed position on the finger in such amanner that the electrodes meet the surface of the contact witha minimum of wipe.6.6 Lens Tissue, for cleaning the electrodes.6.7 Beakers, 1

23、00-mL size, two required.6.8 Hot Plate, suitable for warming two breakers.6.9 Thermometer, calibrated in C over the range of 0 to100 C.6.10 Compressed Air, at 100 to 200 kPa above atmosphericpressure (15 to 25 psig) or a handheld can of compressed gaswith nozzle designed for use as a dust removal to

24、ol, commonlyreferred to as a “duster.”7. Reagents and Materials7.1 Isopropyl Alcohol (IPA), Pure Chemical Grade.FIG. 1 Resistance ProbeB885 09 (2015)27.2 A goldcoated calibration coupon covered with a mini-mum of 2.0 m of gold electrodeposit on the surface to be usedin testing and verifying the clea

25、nliness of the probes. Specialcare should be taken with the coupon to ensure and preservethe cleanliness of the gold surface, including avoiding touchingthe gold surface with anything other than the test probes.8. Test Procedure8.1 Clean the goldplated calibration coupon within 8 hprior to performin

26、g measurements, by dipping it into a beakerof isopropyl alcohol at 50C for 1 min. and then into a secondbeaker with isopropyl alcohol at 50C for 1 min.8.2 Connect probe connections to the milliohmeter usingfour-wire connections and set the milliohmeter for dry circuitconditions.8.3 Both before and a

27、fter each PWB is probed, probe thegoldplated calibration coupon once. If this reading is greaterthan 4 m, clean the electrodes by wiping with clean lenstissue and measure resistance again, repeating the process untilthe reading is 4 m or below.8.4 Blow dust and particles off of the fingers using cle

28、ancompressed air or handheld compressed gas duster.8.5 Probe each finger on the PWB on the board onceaccording to the following steps and record the resistance valuefor each finger. Repeat 8.6 8.9 for each finger.8.6 Align the finger that is to be probed under the electrodesand clamp down.8.7 Bring

29、the probe down onto the finger such that theelectrodes contact the surface of the finger with a minimum ofwipe. As discussed in Section 6, the load on each electrodeshall be in the range of 0.5 to 0.7 N.8.8 Record the initial reading, taken within2softheelectrodes contacting the finger. The electrod

30、es gradually maypenetrate films or other contamination on the surface, and asthey do, the measured resistance will decrease. It is important,therefore, to obtain and record the initial reading.8.9 If the reading exceeds 10 m, wipe the probe tips withclean lens tissue.9. Interpretation of Results9.1

31、The fingers on the PWB are free of significant contami-nation if the results satisfy both of the following conditions:9.1.1 No finger has resistance greater than 50 m, and9.1.2 Not more than one finger has a resistance greater than10 m.10. Report10.1 Report the following information:10.1.1 Test labo

32、ratory identification.10.1.2 Test operator.10.1.3 Date of test.10.1.4 Identification of apparatus used.10.1.5 Identification of parts tested.10.1.6 Test results, including number of fingers probed,number exceeding predetermined resistance levels, and pass orfail conclusions as appropriate.10.1.7 Dev

33、iations, if any, from documented test method.10.1.8 Any observations that the test operator feels arerelevant.10.1.9 Any failure analysis performed on boards tested.11. Precision and Bias11.1 No statement is made about either the precision or biasof this test method for measuring presence of foreign

34、 matter onprinted wiring board contacts since the result merely stateswhether there is conformance to the criteria for successspecified in the procedure.12. Keywords12.1 contact resistance; contamination; edgecard connector;printed wiring board fingersASTM International takes no position respecting

35、the validity of any patent rights asserted in connection with any item mentionedin this standard. Users of this standard are expressly advised that determination of the validity of any such patent rights, and the riskof infringement of such rights, are entirely their own responsibility.This standard

36、 is subject to revision at any time by the responsible technical committee and must be reviewed every five years andif not revised, either reapproved or withdrawn. Your comments are invited either for revision of this standard or for additional standardsand should be addressed to ASTM International

37、Headquarters. Your comments will receive careful consideration at a meeting of theresponsible technical committee, which you may attend. If you feel that your comments have not received a fair hearing you shouldmake your views known to the ASTM Committee on Standards, at the address shown below.This

38、 standard is copyrighted by ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959,United States. Individual reprints (single or multiple copies) of this standard may be obtained by contacting ASTM at the aboveaddress or at 610-832-9585 (phone), 610-832-9555 (fax), or serviceastm.org (e-mail); or through the ASTM website(www.astm.org). Permission rights to photocopy the standard may also be secured from the Copyright Clearance Center, 222Rosewood Drive, Danvers, MA 01923, Tel: (978) 646-2600; http:/ 09 (2015)3