ASTM B885-2009 Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts《印刷线路板触点上存在杂质的标准试验方法》.pdf

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1、Designation: B 885 09Standard Test Method forPresence of Foreign Matter on Printed Wiring BoardContacts1This standard is issued under the fixed designation B 885; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision, the year of last rev

2、ision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.1. Scope1.1 This test method defines a resistance probing test fordetecting the presence of foreign matter on Printed WiringBoard (PWB) co

3、ntacts or fingers that adversely affects electri-cal performance. This test method is defined specifically forsuch fingers coated with gold. Application of this test methodto other types of electrical contacts or to fingers coated withother materials may be possible and desirable but may requiresome

4、 changes in fixturing, procedures, or failure criteria.1.2 Practice B 667 describes another contact resistanceprobe method that has more general application to electricalcontacts of various materials and shapes. Practice B 667 shouldbe used for more fundamental studies. This test methodprovides a fa

5、st inspection method for printed wiring boardfingers.1.3 The values stated in SI units are to be regarded asstandard. No other units of measurement are included in thisstandard.1.4 This standard does not purport to address all of thesafety concerns, if any, associated with its use. It is theresponsi

6、bility of the user of this standard to become familiarwill all hazards including those identified in the appropriateMaterial Safety Data Sheet (MSDS) for this product/materialas provided by the manufacturer, to establish appropriatesafety and health practices, and determine the applicability ofregul

7、atory limitations prior to use.2. Referenced Documents2.1 ASTM Standards:2B 539 Test Methods for Measuring Resistance of ElectricalConnections (Static Contacts)B 542 Terminology Relating to Electrical Contacts andTheir UseB 667 Practice for Construction and Use of a Probe forMeasuring Electrical Con

8、tact Resistance3. Terminology3.1 DefinitionsTerms used in this test method related toelectrical contacts are defined in accordance with TerminologyB 542.3.2 Definitions of Terms Specific to This Standard:3.2.1 edgecard connector, nan electrical connector de-signed to connect physically and electrica

9、lly with a compatiblePWB equipped with gold fingers.3.2.2 printed wiring board (PWB) contacts, PWB fingers,nareas near the edge of a printed wiring board coated withgold and designed to function as electrical contacts when theboard is plugged into a compatible edgecard connector.4. Summary of Test M

10、ethod4.1 Two closely spaced electrodes are brought into contactwith a single PWB finger in such a manner that they contact thesurface with a minimum of wipe.Afixture loads each electrodeto apply a force in the range of 0.5 to 0.7 N to the surface ofthe finger. Two electrical leads attached to each e

11、lectrode areused to make a fourwire resistance measurement to detectelevated resistance indicative of the presence of a film or othercontaminant on the finger.5. Significance and Use5.1 This test method provides a way to detect contaminationon printed wiring board fingers that affects the electrical

12、performance of such fingers. Such contamination may ariseduring PWB manufacture, circuit assembly, or service life andmay include solder mask, solder flux, hardened lubricants,dust, or other materials. This test method provides a nonde-structive method of inspecting such fingers at any point in thel

13、ife of the product including after original manufacture, afterassembly of circuit components to the PWB, and after time inservice such as when returned for repair. Because this testmethod uses two probes to finger contacts in series, it providesa sensitive test for contaminants that may increase ele

14、ctrical1This test method is under the jurisdiction of ASTM Committee B02 onNonferrous Metals and Alloys and is the direct responsibility of SubcommitteeB02.11 on Electrical Contact Test Methods.Current edition approved April 15, 2009. Published May 2009. Originallyapproved in 1997. Last previous edi

15、tion approved in 2003 as B 885 - 97 (2003).2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM website.1Copyright ASTM In

16、ternational, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.resistance when the fingers are plugged into an edgecardconnector that typically makes contact to the finger throughonly one contact to finger interface.5.2 Practice B 667 describes a more general proced

17、ure formeasuring contact resistance of any solid material in practi-cally any geometrical form. The method in Practice B 667should be used for general studies and fundamental studies ofelectrical contact materials.6. Apparatus6.1 Four-Wire mV Meter, with a resolution of 0.0001 V orbetter, capable of

18、 performing dry circuit resistance measure-ments in accordance with Test Methods B 539, Test Method C.6.2 Two Gold-Tipped Electrodes (Probes), with a radius notless than 3.0 mm at the tips. Each electrode shall have twowires attached. One wire, the voltage lead, shall be attachedwithin 2 mm of the t

19、ip end. The other wire, the current lead,shall be attached at any convenient location that is at least 0.5mm farther away from the tip than the attachment point of thevoltage lead.6.3 Fixture, to hold the PWB securely while it is beingprobed and a fixture to hold the two electrodes, such that thedis

20、tance between the centers of the electrodes is 2.0 to 2.5 mmand both electrodes will be centered roughly on a single PWBfinger. Fig. 1 shows an example of a suitable fixture. Otherfixtures that provide the same capability may be used. Locatethis fixture to minimize shock and vibration reaching thepr

21、obes. Placement on a foam pad on a bench top has beenfound suitable.6.4 Two Springs, one for each electrode, having a springconstant and a pretension that will apply a load in the range of0.5 to 0.7 N when the electrode is brought to rest on the fingerbeing tested. Other mechanisms that achieve the

22、same resultare acceptable.6.5 Mechanism, that will move the electrode fixture from anopen position to the closed position on the finger in such amanner that the electrodes meet the surface of the contact witha minimum of wipe.6.6 Lens Tissue, for cleaning the electrodes.6.7 Beakers, 100-mL size, two

23、 required.6.8 Hot Plate, suitable for warming two breakers.6.9 Thermometer, calibrated in C over the range of 0 to100 C.6.10 Compressed Air, at 100 to 200 kPa above atmosphericpressure (15 to 25 psig) or a handheld can of compressed gaswith nozzle designed for use as a dust removal tool, commonlyref

24、erred to as a “duster.”7. Reagents and Materials7.1 Isopropyl Alcohol (IPA), Pure Chemical Grade.7.2 A goldcoated calibration coupon covered with a mini-mum of 2.0 m of gold electrodeposit on the surface to be usedin testing and verifying the cleanliness of the probes. SpecialFIG. 1 Resistance Probe

25、B885092care should be taken with the coupon to ensure and preservethe cleanliness of the gold surface, including avoiding touchingthe gold surface with anything other than the test probes.8. Test Procedure8.1 Clean the goldplated calibration coupon within 8 hprior to performing measurements, by dipp

26、ing it into a beakerof isopropyl alcohol at 50C for 1 min. and then into a secondbeaker with isopropyl alcohol at 50C for 1 min.8.2 Connect probe connections to the milliohmeter usingfour-wire connections and set the milliohmeter for dry circuitconditions.8.3 Both before and after each PWB is probed

27、, probe thegoldplated calibration coupon once. If this reading is greaterthan 4 mV, clean the electrodes by wiping with clean lenstissue and measure resistance again, repeating the process untilthe reading is 4 mV or below.8.4 Blow dust and particles off of the fingers using cleancompressed air or h

28、andheld compressed gas duster.8.5 Probe each finger on the PWB on the board onceaccording to the following steps and record the resistance valuefor each finger. Repeat 8.6-8.9 for each finger.8.6 Align the finger that is to be probed under the electrodesand clamp down.8.7 Bring the probe down onto t

29、he finger such that theelectrodes contact the surface of the finger with a minimum ofwipe. As discussed in Section 6, the load on each electrodeshall be in the range of 0.5 to 0.7 N.8.8 Record the initial reading, taken within2softheelectrodes contacting the finger. The electrodes gradually maypenet

30、rate films or other contamination on the surface, and asthey do, the measured resistance will decrease. It is important,therefore, to obtain and record the initial reading.8.9 If the reading exceeds 10 mV, wipe the probe tips withclean lens tissue.9. Interpretation of Results9.1 The fingers on the P

31、WB are free of significant contami-nation if the results satisfy both of the following conditions:9.1.1 No finger has resistance greater than 50 mV, and9.1.2 Not more than one finger has a resistance greater than10 mV.10. Report10.1 Report the following information:10.1.1 Test laboratory identificat

32、ion.10.1.2 Test operator.10.1.3 Date of test.10.1.4 Identification of apparatus used.10.1.5 Identification of parts tested.10.1.6 Test results, including number of fingers probed,number exceeding predetermined resistance levels, and pass orfail conclusions as appropriate.10.1.7 Deviations, if any, f

33、rom documented test method.10.1.8 Any observations that the test operator feels arerelevant.10.1.9 Any failure analysis performed on boards tested.11. Precision and Bias11.1 No statement is made about either the precision or biasof this test method for measuring presence of foreign matter onprinted

34、wiring board contacts since the result merely stateswhether there is conformance to the criteria for successspecified in the procedure.12. Keywords12.1 contact resistance; contamination; edgecard connector;printed wiring board fingersASTM International takes no position respecting the validity of an

35、y patent rights asserted in connection with any item mentionedin this standard. Users of this standard are expressly advised that determination of the validity of any such patent rights, and the riskof infringement of such rights, are entirely their own responsibility.This standard is subject to rev

36、ision at any time by the responsible technical committee and must be reviewed every five years andif not revised, either reapproved or withdrawn. Your comments are invited either for revision of this standard or for additional standardsand should be addressed to ASTM International Headquarters. Your

37、 comments will receive careful consideration at a meeting of theresponsible technical committee, which you may attend. If you feel that your comments have not received a fair hearing you shouldmake your views known to the ASTM Committee on Standards, at the address shown below.This standard is copyr

38、ighted by ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959,United States. Individual reprints (single or multiple copies) of this standard may be obtained by contacting ASTM at the aboveaddress or at 610-832-9585 (phone), 610-832-9555 (fax), or serviceastm.org (e-mail); or through the ASTM website(www.astm.org).B885093