ASTM B813-2000(2009) Standard Specification for Liquid and Paste Fluxes for Soldering of Copper and Copper Alloy Tube.pdf

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1、Designation: B 813 00 (Reapproved 2009)Standard Specification forLiquid and Paste Fluxes for Soldering of Copper andCopper Alloy Tube1This standard is issued under the fixed designation B 813; the number immediately following the designation indicates the year oforiginal adoption or, in the case of

2、revision, the year of last revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.INTRODUCTIONThis specification covers a series of specific requirements for liquid and paste fluxes. It also

3、incorporates a series of test methods that establish the procedures on how to measure these properties.The format of this specification initially defines the specification requirements followed by the specifictest methods in the order in which they are to be performed.1. Scope1.1 This specification

4、establishes the requirements and testmethods for liquid and paste fluxes for joining by soldering ofcopper and copper alloy tube and fittings in plumbing, heating,air conditioning, mechanical, fire sprinkler, and other similarsystems.NOTE 1This specification does not apply to fluxes intended forelec

5、tronic applications.1.2 Solder fluxes are to be tested in accordance with therequirements of this specification by an independent testinglaboratory. Testing, measuring equipment, and inspection fa-cilities shall be of sufficient accuracy and quality to complywith the requirements of this specificati

6、on.1.3 UnitsThe values stated in SI units are to be regardedas standard. No other units of measurement are included in thisstandard.1.4 The following hazard caveat pertains to Sections 11-19.This standard does not purport to address the safety problems,if any, associated with its use. It is the resp

7、onsibility of the userof this standard to establish appropriate safety and healthpractices and determine the applicability of regulatory limita-tions prior to use.2. Referenced Documents2.1 The following documents of the issue in effect on thedate of materials purchase form a part of this specificat

8、ion tothe extent referenced herein:2.2 ASTM Standards:2B32 Specification for Solder MetalB88 Specification for Seamless Copper Water TubeB 88M Specification for Seamless Copper Water Tube(Metric)B 152/B 152M Specification for Copper Sheet, Strip, Plate,and Rolled BarB 280 Specification for Seamless

9、Copper Tube for AirConditioning and Refrigeration Field ServiceB 846 Terminology for Copper and Copper AlloysD 130 Test Method for Corrosiveness to Copper fromPetroleum Products by Copper Strip TestD 1200 Test Method for Viscosity by Ford Viscosity Cup2.3 Other:1986 Amendments to the Safe Drinking W

10、ater Act33. General Requirements3.1 The flux shall be suitable for joining copper tube andfittings by soldering in the size ranges shown in Table 1 ofSpecifications B88and B 88M and Tables 4 and 5 of Speci-fication B 280.3.2 The flux shall remain active over the temperature rangeof the soldering ope

11、ration, removing and excluding oxidesfrom the metal surfaces in the joint.3.3 The flux shall be suitable for use with all solders listedin Table 5 of Specification B32as well as the more recently1This specification is under the jurisdiction of Committee B05 on Copper andCopper Alloys and is the dire

12、ct responsibility of Subcommittee B05.04 on Pipe andTube.Current edition approved Feb. 15, 2009. Published February 2009. Originallyapproved in 1991. Last previous edition approved in 2000 as B 813 001.2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Serv

13、ice at serviceastm.org. For Annual Book of ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM website.3Available from U.S. Government Printing Office Superintendent of Documents,732 N. Capitol St., NW, Mail Stop: SDE, Washington, DC 20401, http:/www.access.gpo.

14、gov.1Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.developed solder alloys suitable for the applications in thescope of this specification.3.4 The flux shall allow the solder to adequately wet andspread on the surfaces being soldere

15、d.3.5 The flux residue shall be water flushable after soldering.3.6 The flux residue shall not be corrosive after soldering.3.7 The flux shall not release toxic fumes during thesoldering operation or toxic substances into the water in thecompleted system.3.8 The flux shall adhere to the copper and c

16、opper alloysunder anticipated temperature, joint geometry, joint position,job site, and weather conditions.3.9 The flux shall not contain more than 0.2 % lead inaccordance with the 1986 Amendments to the Safe DrinkingWater Act.4. Terminology4.1 For terms related to copper and copper alloys, refer to

17、Terminology B 846 for terms specific to this standard.4.2 Definition:4.2.1 flux, na chemically active substance that is used toremove and exclude oxides from the joint area during heatingand that ensures that the melted solder will wet the surfaces tobe joined.5. Spreading Factor5.1 Spreading of the

18、 solder is determined by measuring theheight (h) of a solder bead on a standard test sheet followingthe specified heating cycle. Spread factor (SF) is calculated asfollows:SF 5 100 1.0 2 h! (1)where:h = the maximum height of the solder bead, mm.5.2 A flux is considered to have acceptably influenced

19、thespreading of solder on the copper surfaces when the averagespreading factor is at least 50 (see Section 13).5.3 The spreading test shall show a balanced action byforming a regular and even solder layer.6. Aggressiveness Requirements6.1 From a standard test sheet on which a specimen hasbeen prepar

20、ed with solder (see Section 15), the resistivity ofthe aqueous solution shall be more than 100 000 V cm.6.2 From a standard test sheet on which a specimen hasbeen prepared without solder (see Section 16), the resistivity ofthe aqueous solution shall be more than 85 000 V cm.7. Corrosiveness Requirem

21、ents7.1 There shall be a clear indication that in the areas of fluxreaction, the sheets shall show a corrosion and residue-freesurface comparable with the unwetted areas as determined byvisual inspection in accordance with Section 17.7.2 Corrosiveness shall be reported in accordance with oneof the c

22、lassifications listed as follows (see Test Method D 130):Classification Description1 Slight tarnish2 Moderate tarnish3 Dark tarnish8. Viscosity Requirements8.1 The viscosity of liquid fluxes shall be less than 180 s asdetermined using a No. 2 Ford flow cup in accordance withSection 18.9. Residue Flu

23、shing Requirements9.1 Flushing of the residue shall be determined by weightloss.9.2 The loss of weight of each sheet shall be determined bycomparing the average weight before and after the test proce-dure. The weight loss of the flux residue shall be more than99 % in accordance with Section 19.% Wei

24、ght Loss d! 5 100 2c 2 a!b 2 a!3 100 (2)where:a = weight of degreased, flushing-test sheet, g;b = weight of degreased, flushing-test sheet plus theweight of applied flux, g; andc = weight of dried, flushing-test sheet after flushing, g.10. Sampling10.1 Samples of flux taken for the purpose of the te

25、sts listedin this specification shall be selected from the stock of themanufacturer and shall be representative of the material beingevaluated.11. Specimen Preparation11.1 Standard Quantity of Solder MetalA standard quan-tity of solder metal shall be a sample of 60:40 tin-lead (AlloyGrade Sn60), mea

26、suring 6.0 mm in diameter by 0.86 mm inthickness, weighing approximately 0.21 g, that has beendegreased with trichloroethylene.11.2 Standard Quantity of FluxAstandard quantity of fluxshall be 0.003 mL as measured by a precision pipet or othervolumetric measuring devices with equivalent precision.11.

27、3 Standard Test SheetA standard test sheet shall be apiece of copper 35 by 35 by 1 mm thick of Copper UNS No.C12200 (deoxidized high residual phosphorus) produced inaccordance with Specifications B 152/B 152M.11.3.1 Preparation:11.3.1.1 The sheet is abraded three times with a waterproofsand or emery

28、 paper (Grit No. 360), each time perpendicular tothe previous direction. One corner of each test sheet shall bebent upwards to permit handling. It is degreased with calciumcarbonate mixed with water to a paste consistency with whichthe test sheet is rubbed using a wad of cotton. The residue isflushe

29、d off by a strong jet of tap water. The test sheet isconsidered to be degreased when it is completely moistened bywater when flushed.11.3.1.2 In any of the following steps in which the testsheets must be handled, use forceps or laboratory tongs. Thesheet is then etched for 15 s in an etching solutio

30、n formulatedas follows:B 813 00 (2009)2(a) Etching Solution(1-L etching solution contains 200-gchromic acid anhydride (CrO3) and 125-mL sulfuric acid(specific gravity 1.84) reagent grade, balance distilled water,diluted to 1 L.)(b) Finally, the sheet is rinsed thoroughly with distilled water(60 to 7

31、0C), immersed in ethanol (ACS Grade), and allowedto dry.11.4 Resistivity Test SpecimenThe resistivity test speci-men is the condition of the standard test sheet on which havebeen deposited standard quantities of flux and solder metalbefore they are placed in the oven.11.4.1 Preparation:11.4.1.1 Remo

32、ve test sheet from the liquid ethanol, allow todry, and apply a standard quantity of flux. With a standardquantity of solder metal, spread the flux to an area of about 15mm in diameter.11.4.1.2 Place the test sheet with flux and solder metal in theoven where it remains for 3 min at a temperature of

33、275Cfrom the time the solder melts. Remove the specimen andallow to cool to room temperature.11.5 Flushing-Test SheetThe flushing-test sheet is a pieceof copper 100 by 100 by 1.0 mm thick of Copper UNS No.C12200 (deoxidized high residual phosphorus) produced inaccordance with Specifications B 152/ B

34、 152M.11.5.1 Preparation:11.5.1.1 The copper sheets shall have raised edges of 3 or 4mm to avoid loss of flux. The sheets shall be degreased withtrichloroethylene, flushed with water, and dried at a tempera-ture of 50C. Every sheet shall be weighed to 10-mg accuracyusing a standard laboratory balanc

35、e.12. Test Methods12.1 The properties enumerated in this specification shall bedetermined in accordance with the test methods given inSections 13-19.13. Spreading Test13.1 ScopeThe influence of the flux on the spreading ofthe fluid solder is indicated by the spreading factor obtained bythe condition

36、s detailed in Section 17.13.2 Apparatus:13.2.1 OvenThe performance characteristics of the ovenshall be such that the temperature has an accuracy of 62.5C.The oven shall be equipped with a sight glass for visiblecontrol of the melting of the solder. It shall be possible tomeasure the oven temperature

37、 in close proximity to the testsheet. The test sheet shall be capable of being placed in theoven and removed from it exactly horizontally. To reducecooling when the preheated test sheet is removed from theoven, it is placed on a plate in an exact horizontal position soas to be pushed in and out. The

38、 oven must be easy to heat to thepreset temperature.13.2.2 Gilson Precision Pipet,3to25L.13.3 Spreading Factor Procedure:13.3.1 The spreading factor test specimen is the condition ofthe standard test sheet with a standard quantity of flux havingbeen heated to 275C for 30 s in the oven. Immediatelyaf

39、terwards, a standard quantity of solder metal is placed overthe liquid flux and the test specimen is replaced in the oven.13.3.2 The period for which the test sheet shall be outsidethe oven for application of the solder metal shall not exceed 10s.13.3.3 Remove test sheet from the ethanol, allow to d

40、ry, andapply a standard quantity of flux. Spread the flux with astandard quantity of solder metal to an area of about 15 mm indiameter and then remove the solder metal.13.3.4 Heat the test sheet with flux for 30 s in an oven at275C. Afterwards, replace the standard quantity of soldermetal that was u

41、sed to spread the flux on the test sheet and heatthe assembly for 3 min at a temperature of 275C in the oven.13.3.5 After the test specimen has cooled to room tempera-ture and been cleaned, measure the solder height by means ofa flat micrometer three times, average the values, and calculatethe sprea

42、ding factor as in 5.1.13.4 CalculationAfter five tests, the highest and lowestfigures are excluded. Calculate the average of the remainingthree.14. Aggressiveness Test14.1 ScopeThe aggressiveness of the flux is determinedby means of a resistivity test by measuring the resistivity in Vcm of an aqueou

43、s solution of the flux residue. The conductivitycell to be used shall be kept immersed in distilled water atambient temperature for a minimum of 24 h before use.14.2 Apparatus:14.2.1 Ohmmeter (Must Be Suitable for Use with Liquids)Cell constant shall be specified.14.2.2 Beakers100 mLfor this test sh

44、all be acid/alkaliresistant, cleaned, and degreased. Finally, they shall be rinsedthoroughly with distilled water.14.2.3 ThermometersThe temperatures shall be measuredwith cleaned thermometers having a scale that will accuratelyregister the temperatures. The thermometer shall be immersedin a clean g

45、raduate measuring cylinder, filled with distilledwater for a minimum of 24 h before use.14.3 CalculationAfter five tests, the highest and lowestfigures are excluded and the average of the other three is used.15. Resistivity TestSoldered (see 6.1)15.1 Procedure:15.1.1 Clean seven watch glasses and se

46、ven graduatedbeakers thoroughly by washing in hot water detergent solution,rinsing several times with tap water followed by rinsing threetimes with distilled water. Then add approximately 50 mL ofdistilled water to each beaker, cover with a watch glass, andboil for 2 min. Discard the water and repea

47、t this boiling withfresh distilled water. Place each clean beaker upside down ontissue paper until they are needed. Fill each beaker to the75-mL mark with distilled water. Immerse the beakers in awater bath maintained at 25C. When this temperature isreached, measure the resistivity of the distilled

48、water in eachbeaker. Make sure that the resistivity of the distilled water ineach beaker is not less than 500 000 V cm. If the resistivity ofthe water in any beaker is less than 500 000 V cm, repeat thecomplete process just described. Retain two of these beakers ascontrols.15.1.2 For determination o

49、f the resistivity, five of the testspecimens indicated in 11.4 are used. After cooling the lastB 813 00 (2009)3sheet, five of the sheets (see 13.3.5) are placed in separatebeakers filled with 75-mL distilled water. The test sheets areplaced with the soldered surface down. The beakers are thencovered with watch glasses. Heat all seven beakers simulta-neously. As the contents of each beaker comes to a boil, timethe boiling for 1 min. The beakers are then allowed to cool for10 min. They are then cooled rapidly until a temperature of25C has been reac