BS PD IEC TR 62343-6-5-2014 Dynamic modules Design guide Investigation of operating mechanical shock and vibration tests for dynamic modules《动态模块 设计指南 动态模块操作机械冲击和振动试验研究》.pdf

《BS PD IEC TR 62343-6-5-2014 Dynamic modules Design guide Investigation of operating mechanical shock and vibration tests for dynamic modules《动态模块 设计指南 动态模块操作机械冲击和振动试验研究》.pdf》由会员分享，可在线阅读，更多相关《BS PD IEC TR 62343-6-5-2014 Dynamic modules Design guide Investigation of operating mechanical shock and vibration tests for dynamic modules《动态模块 设计指南 动态模块操作机械冲击和振动试验研究》.pdf（28页珍藏版）》请在麦多课文档分享上搜索。

1、BSI Standards Publication Dynamic modules Part 6-5: Design guide Investigation of operating mechanical shock and vibration tests for dynamic modules PD IEC/TR 62343-6-5:2014National foreword This Published Document is the UK implementation of IEC/TR 62343-6-5:2014. It supersedes PD IEC/TR 62343-6-5:

2、2011, which is withdrawn. The UK participation in its preparation was entrusted by Technical Committee GEL/86, Fibre optics, to Subcommittee GEL/86/3, Fibre optic systems and active devices. A list of organizations represented on this committee can be obtained on request to its secretary. This publi

3、cation does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. The British Standards Institution 2014. Published by BSI Standards Limited 2014 ISBN 978 0 580 85413 2 ICS 33.180.20 Compliance with a British Standard cannot confer immu

4、nity from legal obligations. This Published Document was published under the authority of the Standards Policy and Strategy Committee on 31 July 2014. Amendments/corrigenda issued since publication Date Text affected PUBLISHED DOCUMENT PD IEC/TR 62343-6-5:2014 IEC TR 62343-6-5 Edition 2.0 2014-06 TE

5、CHNICAL REPORT Dynamic modules Part 6-5: Design guide Investigation of operating mechanical shock and vibration tests for dynamic modules INTERNATIONAL ELECTROTECHNICAL COMMISSION T ICS 33.180.20 PRICE CODE ISBN 978-2-8322-1641-5 Registered trademark of the International Electrotechnical Commission

6、Warning! Make sure that you obtained this publication from an authorized distributor. colour inside PD IEC/TR 62343-6-5:2014 2 IEC TR 62343-6-5:2014 IEC 2014 CONTENTS FOREWORD . 4 1 Scope 6 2 Background . 6 3 Questionnaire results in Japan 6 4 Evaluation plan 7 5 Evaluation results 7 5.1 Step 1 . 7

7、Evaluation of hammer impact . 7 5.1.1Evaluation of adjacent board insertion and rack handle impact 9 5.1.2 5.2 Step 2 . 9 5.3 Step 3 . 11 MEMS-VOA . 11 5.3.1WSS and tuneable laser 14 5.3.2 6 Simulation . 16 6.1 Simulation model 16 6.2 Frequency characteristics . 17 6.3 Dependence on PC board design

8、18 6.4 Consistency of evaluation and simulation results 19 7 Summary . 19 8 Conclusions . 20 Annex A (informative) Results of a questionnaire on dynamic module operating shock and vibration test conditions . 21 A.1 Background. 21 A.2 Questionnaire methodology 21 A.3 Survey result. 21 Bibliography 24

9、 Figure 1 Photos of evaluating hammer impact, rack and boards . 7 Figure 2 Evaluation results of hammer impact H 8 Figure 3 Photos of evaluating adjacent board insertion and rack handle impact . 9 Figure 4 DUT (VOA and WSS) installed on PC boards and rack for secondstep of the evaluation . 10 Figure

10、 5 Oscilloscope display of waveform changes in vibration and optical output 10 Figure 6 Evaluation results when employing MEMS-VOA for Z-axis . 11 Figure 7 Photos of the MEMS-VOA shock/vibration test equipment 12 Figure 8 Operating shock characteristics of MEMS-VOA 12 Figure 9 Vibration evaluation r

11、esults for MEMS-VOA (Z-axis; 2 G) . 13 Figure 10 Shock and vibration evaluation system for WSS and tuneable laser . 14 Figure 11 Shock evaluation results for WSS (directional dependence) . 15 Figure 12 Shock evaluation results for WSS (z-axis direction and shock dependence) . 15 Figure 13 Simulation

12、 model 17 Figure 14 Vibration simulation results 17 Figure 15 Vibration simulation results (dependence on board conditions). 18 PD IEC/TR 62343-6-5:2014IEC TR 62343-6-5:2014 IEC 2014 3 Table 1 Rack and board specifications, conditions of evaluating hammer impact and acquiring data . 8 Table 2 Dynami

13、c modules used in evaluation and evaluation conditions 10 Table 3 Conditions for MEMS-VOA vibration/shock evaluation . 12 Table 4 Results of MEMS-VOA vibration evaluation . 13 Table 5 Conditions for simulating board shock and vibration 16 Table 6 Comparison of hammer impact shock evaluation results

14、and vibration simulation (conditions: 1,6 mm 240 mm 220 mm, t H D) 19 Table A.1 Summary of survey results on operating shock and vibration test conditions . 22 PD IEC/TR 62343-6-5:2014 4 IEC TR 62343-6-5:2014 IEC 2014 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ DYNAMIC MODULES Part 6-5: Design guide

15、 Investigation of operating mechanical shock and vibration tests for dynamic modules FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to

16、promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Gui

17、des (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC

18、 also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as p

19、ossible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense.

20、 While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undert

21、ake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attes

22、tation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition o

23、f this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct o

24、r indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable

25、for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. The main task of IEC technical committees

26、is to prepare International Standards. However, a technical committee may propose the publication of a technical report when it has collected data of a different kind from that which is normally published as an International Standard, for example “state of the art“. IEC 62343-6-5, which is a technic

27、al report, has been prepared by subcommittee 86C: Fibre optic systems and active devices, of IEC technical committee 86: Fibre optics. This second edition cancels and replaces the first edition published in 2011. It constitutes technical revision. The main change with respect to the previous edition

28、 is the addition of “Results of a questionnaire on dynamic module operating shock and vibration test conditions“ in Annex A. PD IEC/TR 62343-6-5:2014IEC TR 62343-6-5:2014 IEC 2014 5 The text of this technical report is based on the following documents: Enquiry draft Report on voting 86C/1206/DTR 86C

29、/1246/RVC Full information on the voting for the approval of this technical report can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts of IEC 62343 series, published under the gene

30、ral title Dynamic modules, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the pu

31、blication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of this publication may be issued at a later date. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for

32、the correct understanding of its contents. Users should therefore print this document using a colour printer. PD IEC/TR 62343-6-5:2014 6 IEC TR 62343-6-5:2014 IEC 2014 DYNAMIC MODULES Part 6-5: Design guide Investigation of operating mechanical shock and vibration tests for dynamic modules 1 Scope T

33、his part of IEC 62343, which is a technical report, describes an investigation into operating mechanical shock and vibration for dynamic modules. It also presents the results of a survey on the evaluation and mechanical simulation of mechanical shock and vibration testing. Also included is a study o

34、f standardization for operating mechanical shock and vibration test methods. 2 Background The recent deployment of advanced, highly flexible optical communication networks using ROADM (reconfigurable optical add drop multiplexing) systems has been accompanied by the practical utilization of dynamic

35、wavelength dispersion compensators, wavelength blockers and wavelength selective switches as “dynamic modules.” Since these dynamic modules incorporate such new technology as MEMS (micro electromechanical systems), there are concerns about the vulnerability to operating shock and vibration condition

36、s, which urgently require establishing evaluation methods and conditions. Standards for shock and vibration test conditions pertaining to storage and transport are already established, but methods and conditions for evaluating operating shock and vibration are not yet established. The JIS (Japanese

37、Industrial Standards) committee consequently conducted a questionnaire survey on the shock and vibration testing of passive optical components and dynamic modules in commercial use. The survey revealed that many respondents confirmed a need to standardize evaluation conditions for operating shock an

38、d vibration; some suggested earthquake, hammer impact testing and inserting an adjacent board as cases of shock and vibration during dynamic module operation. Based on the survey results, the JIS committee evaluated operating shock and vibration by conducting hammer impact tests using several dynami

39、c modules, compared the results through simulation, and then recommended specific evaluation conditions. This technical report is based on OITDA (Optoelectronic Industry and Technology Development Association) TP (Technical Paper), TP05/SP_DM-2008, “Investigation on operating vibration and mechanica

40、l impact test conditions for optical modules for telecom use.“ 3 Questionnaire results in Japan The JIS committee conducted a questionnaire on operating shock and vibration testing. The questionnaire allowed the respondents to specify the optical components to be tested. This questionnaire included

41、optical switches, VOAs (variable optical attenuators) and tuneable filters among the mechanical components used in all possible situations. The survey covered 18 organizations: eight Japanese manufacturers of mechanical optical components, eight device makers as users of such components, and two res

42、earch institutes. Reponses were received from 14 of these organizations for a response rate of 78 %, among which 12 respondents specified optical switches, seven specified VOAs and three chose tuneable filters. In tabulating the data, the survey asked questions regarding these three types of compone

43、nts and described occurrences not dependent on the type of component, the manufacturer and the user, and evaluation conditions. PD IEC/TR 62343-6-5:2014IEC TR 62343-6-5:2014 IEC 2014 7 The results revealed a strong need for the standardization of operating shock and vibration evaluation methods and

44、conditions for such dynamic modules as optical switches and VOAs. A majority of respondents also requested that the hammer impact testing and the insertion of an adjacent PC board be included as cases of operating shock and vibration. 4 Evaluation plan Based on the survey results described in Clause

45、 3, the appropriate conditions for shock and vibration testing were determined based on an evaluation. The evaluation method consisted of the following three steps: Step 1: Measure the shock and vibration characteristics of a board with a shock sensor inserted into a standard rack by striking the fr

46、ont face of the board with a hammer or by inserting an adjacent PC board. Step 2: Test an optical module installed in a standard rack by repeating the procedure in Step 1. Measure any changes in the optical characteristics of the optical module. Step 3: Use standard shock and vibration test equipmen

47、t to reproduce the shock and vibration characteristics obtained in Step 1 and the optical characteristics of the optical module obtained in Step 2. 5 Evaluation results 5.1 Step 1 Evaluation of hammer impact 5.1.1Figure 1 Photos of evaluating hammer impact, rack and boards A PC board with a shock se

48、nsor attached is inserted into the rack. The front of the board is then struck repeatedly by a hammer, along with an adjacent board being forcibly inserted in order to measure the impact and frequency detected by the shock sensor. The handles attached to the front edge of the rack are also forcibly

49、struck by hand, with the impact being measured as well. Figure 1 shows photos of the hammer impact as well as the rack and PC boards. Table 1 below summarizes the specifications of the rack and PC boards, and the conditions of evaluating hammer impact and the acquisition of data. IEC 2032/14 Shock sensor Board Hammer Dynamic module (470 g weight) PD IEC/TR 62343-6-5:2014 8 IEC TR 62343-6-5:2014 IEC 2014 Table 1 Rack and board specifications, condi