JEDEC JESD75-5-2004 SON QFN Package Pinouts Standardized for 1- 2- and 3-Bit Logic Functions《1 2和3位逻辑功能的SON QFN包装插脚引线标准化》.pdf
《JEDEC JESD75-5-2004 SON QFN Package Pinouts Standardized for 1- 2- and 3-Bit Logic Functions《1 2和3位逻辑功能的SON QFN包装插脚引线标准化》.pdf》由会员分享,可在线阅读,更多相关《JEDEC JESD75-5-2004 SON QFN Package Pinouts Standardized for 1- 2- and 3-Bit Logic Functions《1 2和3位逻辑功能的SON QFN包装插脚引线标准化》.pdf(13页珍藏版)》请在麦多课文档分享上搜索。
1、JEDEC SOLID STATE TECHNOLOGY ASSOCIATIONJESD75-5JULY 2004JEDECSTANDARDSON/QFN Package Pinouts Standardized for 1-, 2-, and 3-Bit Logic FunctionsNOTICEJEDEC standards and publications contain material that has been prepared, reviewed, and approvedthrough the JEDEC Council level and subsequently revie
2、wed and approved by the JEDEC Legal Counsel.JEDEC standards and publications are designed to serve the public interest through eliminatingmisunderstandings between manufacturers and purchasers, facilitating interchangeability andimprovement of products, and assisting the purchaser in selecting and o
3、btaining with minimum delay theproper product for use by those other than JEDEC members, whether the standard is to be used eitherdomestically or internationally.JEDEC standards and publications are adopted without regard to whether or not their adoption mayinvolve patents or articles, materials, or
4、 processes. By such action JEDEC does not assume any liability toany patent owner, nor does it assume any obligation whatever to parties adopting the JEDEC standards orpublications.The information included in JEDEC standards and publications represents a sound approach to productspecification and ap
5、plication, principally from the solid state device manufacturer viewpoint. No claims to be in conformance with this standard may be made unless all requirements stated in thestandard are met.Inquiries, comments, and suggestions relative to the content of this JEDEC standard or publication shouldbe a
6、ddressed to JEDEC Solid State Technology Association, 2500 Wilson Boulevard, Arlington, VA22201-3834, (703)907-7559 or www.jedec.org.Published byJEDEC Solid State Technology Association 20042500 Wilson BoulevardArlington, VA 22201-3834This documentmay be downloaded free of charge, however JEDEC reta
7、ins the copyright on this material. By downloading this file the individual agrees not to charge for or resell the resulting material.Price: Please refer to the current Catalog of JEDEC Engineering Standards and Publications at www.jedec.orgPrinted in the U.S.A.All rights reservedPLEASE! DONT VIOLAT
8、E THE LAW! This document is copyrighted by the JEDEC Solid State Technology Association and may not be reproduced without permission. Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement. For information, contact: JEDEC Solid State Tec
9、hnology Association 2500 Wilson Boulevard Arlington, Virginia 22201-3834 or call (703) 907-7559 JEDEC Standard No. 75-5Page 1SON/QFN PACKAGE PINOUTS STANDARDIZED FOR 1-, 2-, AND 3-BIT LOGIC FUNCTIONS(From JEDEC Board Ballot JCB-04-44, formulated under the cognizance of the JC-40 Committee on Digital
10、 Logic.)1ScopeThis standard defines device pinout for 1-, 2- and 3-bit wide logic functions. This pinout specifically applies to the conversion of Dual-Inline-Packaged (DIP) 1-, 2- and 3-bit logic devices to SON/QFN packaged 1-, 2- and 3-bit logic devices. The purpose of this document is to provide
11、a pinout standard for 1-, 2- and 3-bit logic devices offered in 6- or 8-land SON/QFN packages for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.2 Terms and definitions (for the purpose of this document)DIP: Dual In-line Pin Package (gull
12、-wing)SOP: Small-Outline Package; 0.95-mm lead pitch; 1.6mm wide body (MO-178; variations AA (5-ld), AB (6-ld), and BA (8-ld).SSOP: Shrink Small-Outline Package; 0.65-mm lead pitch; 5.3-mm wide body (MO-150; variation AA (8-ld).TSSOP: Thin Shrink Small-Outline Package; 0.65-mm lead pitch; 4.4-mm wid
13、e body (MO-153; variation AA (8-ld).SON: Plastic Very Very Thin (P-WFDSON), Ultra Thin (P-UFDSON), and Extremely Thin (P-XFDSON), Fine Pitch Dual Small Outline Non- Leaded Package Family (MO-252 Issue A, variation UAAD (6-ld).QFN: Plastic Very Very Thin (P-WFQFN), Ultra Thin (P-UFQFN), and Extremely
14、 Thin (P-XFQFN), Fine Pitch Quad Flat Small Outline, Non-Leaded Package Family (MO-255 Issue A, variation UAAD (8-ld), variation UABD (10-ld).3Pinout sandard3.1 DescriptionThe following criteria shall be used to convert existing 1-, 2- and 3-bit logic device functions offered in 5-, 6- and 8-pin DIP
15、 packages (e.g., SOP, SSOP, TSSOP) to 1-, 2- and 3-bit logic device functions offered in the 6- and 8-land SON/QFN packages:a) Attributes for the SON (6-ld) and QFN (8-ld) package package shall be as follows:6-land, 0.5-mm land pitch with 1.0-mm 1.45-mm body size and 3-row 2-column land array.8-land
16、, 0.5-mm land pitch with 1.6-mm 1.6-mm body size and depopulated quad array.b) The pinout conversions shall be in accordance with the diagrams shown in sections 3.2 and 3.5. Each device shallbe pinned out based on its present package/pinout and the pinout tables in sections 3.3, 3.4, and 3.6.JEDEC S
17、tandard No. 75-5Page 23 Pinout standard (contd)3.2 6-land SON package (MO-252, variation UAAD)Figure 1 Pinout configuration - Bottom view3.3 Pin conversion from 5-pin DIP to 6-land SON packageThe pinout adopts the naming convention of logic devices in 5-pin DIP packages. The signal nomenclature used
18、 in this table is intended to define the functionality of each pin and not require that a specific naming convention be followed. Each product vendor is free to name the pin according to their own conventions, provided that the functionality of the device is not altered from what is specified here.
19、Table 1 5-pin to 6-land pinout tableFunction(See Note)DescriptionPin Numbers1234561G00 Single 2-input NAND gate A B GND Y DNU VDD1G02 Single 2-input NOR gate A B GND Y DNU VDD1G04 Single inverter DNU A GND Y DNU VDD1GU04 Single unbuffered inverter DNU A GND Y DNU VDD1G05 Inverter with open-drain out
20、put DNU A GND Y DNU VDD1G06 Inverter with open-drain output DNU A GND Y DNU VDD1G07 Single buffer/driver with open-drain output DNU A GND Y DNU VDD1G08 Single 2-input AND gate A B GND Y DNU VDD1G14 Single inverter with Schmitt-trigger input DNU A GND Y DNU VDD1G17 Single buffer/driver with Schmitt-t
21、rigger input DNU A GND Y DNU VDD1G32 Single 2-input OR gate A B GND Y DNU VDD1G34 Single buffer DNU A GND Y DNU VDD1G38 Single 2-input NAND gate w/ open-drain output A B GND Y DNU VDD1G66 Single analog switch I/O I/O GND OE DNU VDD1G79 D-type flip-flop with Q output D CK GND Q DNU VDD1G80 D-type fli
22、p-flop with Q output D CK GND Q DNU VDD1G86 Single 2-input XOR gate A B GND Y DNU VDD1G125 Single buffer/driver with 3-state outputs OE A GND Y DNU VDD1G125 Single bus switch OE A GND B DNU VDD1G126 Single buffer/driver with 3-state outputs OE A GND Y DNU VDDJEDEC Standard No. 75-5Page 3NOTE 1 The f
23、unction designation refers to the part designation of a series of commercial logic parts common in the industry. This number is normally preceded by a series of manufacturer specific characters to make up a complete part designation.NOTE 2 DNU means Do Not Use. This designation requires that the pri
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