GOST R IEC 61249-2-6-2012 Materials for printed boards and other interconnecting structures Part 2-6 Reinforced base materials clad and unclad Brominated epoxide non-woven and wovened .pdf

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5、test), copper-clad 201307011 - -, , (- ), ( ), 0,80 1,70 . . 95 C. . , .2 , . - . ( ). 61189-2:1997 , - . 2. - (IEC 61189-2:1997, Test methods for electrical materials, printed boards and other interconnectionstructures and assemblies Part 2: Test methods for materials for interconnection structures

6、) 61249-5-1:1995 . 5-1. - . ( , ) IEC 61249-5-1:1995, Materials for interconnection structures Part 5: Sectional specification set forconductive foils and films with or without coatings Section 1: Copper foils (for the manufacture of copper-cladbase materials). 9000:2000 . (ISO 9000:2000, Quality ma

7、nagement systems Fundamentals and vocabulary) 11014-1:1994 . . 1. (NF ISO 11014-1-1994, Safety data sheet for chemicalproducts. Part 1: Content and order of sections) 14001:1996 . - (ISO 14001:1996, Environmental management systems. Specification with guidance for use)3 .1 61249-2-620123.1 - 105 C.

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